conga-JC370 3.5" SBC
Embedded Computing with the 8th Generation Intel Core Mobile Processors benefits apart from the increase in performance
Embedded Computing with the 8th Generation Intel Core Mobile Processors benefits apart from the increase in performance
The 8th generation of Intel Core Mobile processors offers a performance increase of 40% compared to the previous generation. But there are other reasons that speak for the new Intel Core Mobile processors, which congatec now offers for the first time on extremely space-saving 3.5 inch single board computers in addition to COM Express and Mini-ITX motherboards.
More cores for a full performance boost
New generations of processors are measured above all by their increased performance. The eigth Intel Core Mobile generation (codenamed Whiskey Lake) with its new high-end Intel® Core™ i7, Core™ i5, Core™ i3 and Celeron® embedded processors makes no difference. This time, however, it reaches values that have not been seen for a long time. Thanks to improved microarchitecture and, above all, thanks to twice as many cores, it offers a performance increase of up to 40% compared to the previous U-Series processors (codenamed Kaby Lake). The memory is also designed to match the performance boost: Via two DDR4 SODIMM sockets, up to 2,400 MT/s with up to 64GB can be provided. But there are more reasons for the use in embedded applications. One of them is of particular importance, namely the availability of the processor series, which Intel has pushed up to 15 years.
Pragmatically handling the availability leap
However, not all component manufacturers were able to follow this considerable leap from 7 to 15 years, which is why only a few embedded board and module manufacturers have been able to follow this extended long-term availability. congatec is one of the few companies that has dealt intensively with this long-term availability promise and now also offers suitable solutions that can be handled pragmatically. As a standard offer, the company now offers boards and modules with an availability of 10+. Based on a specific Long Time Buy contract, the availability can be extended to 15 years. congatec offers its customers standardised regulations in this regard. The components, some of which have already been discontinued at the end of this life cycle, will be stocked by congatec and financed within the framework of the agreed coverage volume.
3.5" SBC coolings solutions
Three new premium embedded cooling solutions for its 3.5-inch Single Board Computers (SBCs) offer a maximum cooling mass and surface area for extremely powerful designs. Heat dissipation is standardized and all solutions feature a massive heatspreader, made of light metal, which disperses waste heat from the CPU hotspots quickly and effectively. Depending on the TDP, the heatspreader can be expanded with passive finned heat sinks or active ventilation systems. With congatec also offering its three cooling solutions in a standardized height, OEMs can in future implement footprint-identical cooling solutions for comparable TDP requirements.
congatec's first 3.5" SBC
Whitepaper
Compact 3.5-inch boards with 8th generation Intel Core Mobile processors
The 8th generation Intel Core Mobile processors deliver up to 40% more performance than the predecessor generation. congatec now offers the new cores on extremely compact
3.5-inch single-board computers (SBCs).
New boards are measured first and foremost by the performance boost their processors offer. The new congatec 3.5-inch board with 8th generation Intel Core Mobile processors (code name “Whiskey Lake”) is no different in that aspect. This time, however, it achieves levels that haven’t been seen for a long time. Thanks to an improved microarchitecture and especially thanks to twice as many cores, the new high-end Intel® Core™ i7, Core™ i5, Core™ i3, and Celeron® Embedded processor boards offer up to 40% more performance compared to previous boards with U-series processors (code name “Kaby Lake”). The memory has also been designed to match the performance boost: two DDR4 SODIMM slots provide up to 2400 MT/s with up to 64 GB.
Learn more about our conga-JC370 3.5-inch SBC and download the whitepaper
40% performance boost for 3.5 inch SBC
congatec enters the 3.5 inch single board computer (SBC) business for the first time with the new conga-JC370. In the future, congatec will support all major processors suitable for this compact design on this form factor. With this step, congatec is driving the constant expansion of its product portfolio on the board level. In addition to Computer-on-Modules, where the company already ranks in top positions worldwide, embedded motherboards and SBCs have become the company’s second major product pillar. The offering in this sector includes the three embedded computer board standards with the highest revenue, i.e. Mini-ITX, 3.5 inch and Pico ITX, as well as a large number of COM carrier combinations. This offer is complemented by customized board variants, reaching all the way up to full-custom designs.
Learn more about the 3.5 inch SBC here
