COM-HPC Size D module based on Intel® Xeon® D-1848TER 10-core processor with 2.0 GHz, 15MB cache and dual channel DDR4 2666 MT/s memory interface (formerly Ice Lake-D Refresh LCC). Industrial temperature range from -40°C to 85°C.
- aReady.

- Services & Trainings

- Company
- News & Events

Your item has been added to the inquiry
conga-HPC/sILL
COM-HPC Server Size D module based on Intel® Xeon® D processor series (code name "Ice Lake")
Selected ecosystem parts
Virtualization

Operating Systems
IOT Software

Cooling Solutions

Carrierboards

Memory

Module services
Value adding ecosystem offerings
Virtualization

Operating Systems
IOT Software

Cooling Solutions

Carrierboards

Memory

Module services
Value adding ecosystem offerings
Virtualization

Operating Systems
IOT Software

Cooling Solutions

Carrierboards

Memory

Module services
Specification
Industrial: Operating Temperature: -40 to +85°C | Storage Temperature: -40 to +85°C (depending on CPU)
Documents
Data Sheet
Manual
Software
Use for BIOS update or customization and panel configuration. Linux source version.
Important note: Only compatible with cgos 1.03.032 and older!
Product Variants
Product Filter:
Add Filter:
- 2.7W W
- 3W W
- 3W W
- 3W W
- 3.6W W
- 3.9W W
- 4W W
- 4.3W W
- 4.5W W
- 5W W
- 5.5W W
- 6W W
- 6.4W W
- 6.4W W
- 6.5W W
- 7W W
- 7.5W W
- 9W W
- 9.5W W
- 10W W
- 11.5W W
- 12W W
- 15W W
- 16W W
- 17W W
- 18W W
- 19W W
- 20W W
- 24W W
- 25W W
- 28 W W
- 30W W
- 31W W
- 35W W
- 37W W
- 39W W
- 45W W
- 47W W
- 50W W
- 52W W
- 55W W
- 57W W
- 59W W
- 60W W
- 65W W
- 67W W
- 77W W
- 80W W
- 85W W
- 100W W
- 100W W
- 100W W
- 118W W
- 135W W
- Ubuntu Linux LTS
- Microsoft® Windows 11 IoT Enterprise
- RTOS
- QNX
- Microsoft® Windows 11
- Microsoft® Windows IoT 10 Core
- Microsoft® Windows 10 IoT Enterprise
- Microsoft® Windows® 10 (64bit only)
- Microsoft® Windows® 10
- Microsoft® Windows 10 Enterprise
- Microsoft® Windows 10 Core Pro
- Microsoft® Windows® 7
- Android
- Linux
- Yocto
- Microsoft® Windows® XP
- Microsoft® Windows® embedded Standard
- Microsoft® Windows® CE 6.0
- Microsoft® Windows® CE 7.0
- Embedded POS Ready
- Windows Embedded Compact 7
- Microsoft Windows 8 embedded
- Microsoft® Windows® 8.1
- BSPs with OS drivers and tools
- Microsoft® Windows® 7/8 embedded Standard
- Microsoft® Windows Server 2016
- RHEL 6.8 & 7.2
- SUSE 12 SP1
- Fedora 22
- Ubuntu 14.10
- CentOS 6.6 & 7.1
- FreeBSD 10.3 & 11
- Yocto v2.0 (Jethro), Kernel 4.1
- VMware
- Microsoft® Windows Server 2012 R2
- Microsoft® Windows Server 2012
- Microsoft® Windows Server 2008 R2 SP1
- RHEL 6.6 & 7.1
- SuSE 11 SP4 & 12 SP1
- Yocto v.2.0 Kernel 4.1
- Wind River VxWorks 7
- ESXi
- Microsoft® Windows IoT Core
- Microsoft® Windows 10 (64bit only)
- Fedora 24
- Ubuntu
- SuSe
- Red Hat Enterprise
- Yocto Project v2.2
- Chromium 2
- Wind River VxWorks
- Microsoft® Windows 10 IoT Enterprise (64bit only)
- RTS Hypervisor
If you don't find the configuration you require contact your congatec Sales representative for further assistance.
COM-HPC Size D module based on Intel® Xeon® D1746TER 10-core processor with 2.0 GHz, 15MB cache and dual channel DDR4 up to 2667 MT/s memory interface (formerly Ice Lake-D LCC). Industrial temperature range from -40°C to 85°C.
COM-HPC Size D module based on Intel® Xeon® D1732TE 8-core processor with 1.9 GHz, 15MB cache and dual channel DDR4 up to 2667 MT/s memory interface (formerly Ice Lake-D LCC). Industrial temperature range from -40°C to 85°C.
COM-HPC Size D module based on Intel® Xeon® D1715TER 4-core processor with 2.4 GHz, 10MB cache and dual channel DDR4 up to 2667 MT/s memory interface (formerly Ice Lake-D LCC). Extended temperature range from -40°C to 80°C.
COM-HPC Size D module based on Intel® Xeon® D1735TR 8-core processor with 2.2 GHz, 15MB cache and dual channel DDR4 up to 2933 MT/s memory interface (formerly Ice Lake-D LCC). Commercial temperature range from 0°C to 60°C.
COM-HPC Size D module based on Intel® Xeon® D1712TR 4-core processor with 2.0 GHz, 10MB cache and dual channel DDR4 up to 2400 MT/s memory interface (formerly Ice Lake-D LCC). Commercial temperature range from 0°C to 60°C.
Ecosystem Details
Virtualization
Operating Systems
IOT Software
Cooling Solutions
Standard active cooling solution for COM-HPC Server modules conga-HPC/sILL with integrated heat pipes, 35.2mm overall cooling height and integrated 12V fan.
Standard passive cooling solution for COM-HPC Server modules conga-HPC/sILL with integrated heat pipes, 18.2mm overall cooling height.
Standard heatspreader for COM-HPC Server modules conga-HPC/sILL with integrated heat pipes and 11mm overall cooling height. Through hole mounting with bore hole standoffs Ø2.7mm.
Standard heatspreader for COM-HPC Server modules conga-HPC/sILL with integrated heat pipes and 11mm overall cooling height. Threaded mounting with threaded standoffs M2.5.
Heat pipe Adapter for COM-HPC Server modules conga-HPC/sILL. Suitable for standard 8 mm heat pipes to optimize heat distribution.
Retention frame for conga-HPC/sILL
Carrierboards
conga-HPC/EVAL-Server
Memory
DDR4 UDIMM memory module with 3200 MT/s and 16GB RAM
DDR4 ECC UDIMM memory module with 3200 MT/s and 16GB RAM
Industrial DDR4 UDIMM memory module with 3200 MT/s and 16GB RAM
Industrial DDR4 ECC UDIMM memory module with 3200 MT/s and 16GB RAM
DDR4 UDIMM memory module with 3200 MT/s and 32GB RAM
DDR4 ECC UDIMM memory module with 3200 MT/s and 32GB RAM
Industrial DDR4 UDIMM memory module with 3200 MT/s and 32GB RAM
Industrial DDR4 ECC UDIMM memory module with 3200 MT/s and 32GB RAM
DDR4 ECC RDIMM memory module with 3200 MT/s and 16GB RAM
Industrial DDR4 ECC RDIMM memory module with 3200 MT/s and 16GB RAM
DDR4 ECC RDIMM memory module with 3200 MT/s and 32GB RAM
Industrial DDR4 ECC RDIMM memory module with 3200 MT/s and 32GB RAM
DDR4 ECC RDIMM memory module with up to 3200 MT/s and 64GB RAM
Industrial DDR4 ECC RDIMM memory module with 3200 MT/s and 64GB RAM
DDR4 ECC VLP RDIMM memory module with up to 3200 MT/s and 16GB RAM
Industrial DDR4 ECC VLP RDIMM memory module with up to 3200 MT/s and 16GB RAM
DDR4 ECC VLP RDIMM memory module with up to 3200 MT/s and 32GB RAM
Module services
Design-Training to develop carrier boards for Computer on Modules
congatec Wide Temperature Range Screening
Standard screening profile with 12h temperature screening and cold soak test
Including functional test and several boot-ups (before & after screening)
congatec Wide Temperature Range Screening
Standard screening profile with 12h temperature screening and cold soak test
Including functional test and several boot-ups (before & after screening)
Accessories
conga-HPC/EVAL-Server
Evaluation Carrier Board for COM-HPC Server Type Modules
conga-HPC/uATX-Server
Application Carrier Board for COM-HPC Server Type Modules (Size D)