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  • COM-HPC & COM Express Server-on-Modules based on Intel® Xeon D processors  | Ice Lake

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conga-HPC/sILL

COM-HPC Server Size D module based on Intel® Xeon® D processor series (code name "Ice Lake")

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                  Virtualization

                  Operating Systems

                  IOT Software

                  Cooling Solutions

                  Carrierboards

                  Memory

                  Module services

                  conga-HPC/sILL

                  COM-HPC Server Size D module based on Intel® Xeon® D processor series (code name "Ice Lake")

                  Virtualization Ready
                  • Industrial Use Condition with extended Temperature options
                  • 32 PCIe Express lanes
                  • AI Capabilities with Intel® DL boost
                  • Real Time Capable Platform
                  • Supporting up to 256 GB DDR4 2933MT/s Memory
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                  Value adding ecosystem offerings

                  Virtualization

                  Operating Systems

                  IOT Software

                  Cooling Solutions

                  Carrierboards

                  Memory

                  Module services

                  Specification

                  Formfactor
                  COM-HPC
                  CPU
                  Intel® Xeon® D-1848TER (10 x 2.0 GHz, 15 MB cache, 100G Eth, 57W)
                  Intel® Xeon® D-1712TR (4 x 2.0 GHz, 10 MB cache, 50G Eth, 39W)
                  Intel® Xeon® D-1735TR (8 x 2.2 GHz, 15 MB cache, 50G Eth, 59W)
                  Intel® Xeon® D-1715TER (4 x 2.4 GHz, 10 MB cache, 50G Eth, 50W)
                  Intel® Xeon® D-1732TE (8 x 1.9 GHz, 15 MB cache, 50G Eth, 52W)
                  Intel® Xeon® D-1746TER (10 x 2.0 GHz, 15 MB cache, 100G Eth, 67W)
                  DRAM
                  4x DIMM sockets for DDR4 memory modules | Max. capacity = 256GB
                  Ethernet
                  1 x 2.5GbE TSN Ethernet
                  2x 40G / 4x 25G / 8x 10G/2.5G/1G/100M lanes | Maximum total bandwidth 100Gb (depending on CPU)
                  I/O Interfaces
                  16 x PCIe Gen4
                  16 x PCIe Gen3
                  4 x USB 3.0
                  4 x USB 2.0
                  2 x SATA III (6Gb/s)
                  2 x UART
                  12 x GPIOs
                  2 x SM-Bus
                  2 x I²C bus
                  congatec Board Controller
                  Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection
                  embedded BIOS Features
                  AMI Aptio UEFI
                  64Mbyte serial SPI with congatec Embedded BIOS feature
                  OEM Logo
                  OEM CMOS Defaults
                  Flash Update
                  Security
                  Trusted Platform Module (TPM 2.0)
                  Power Management
                  ACPI 5.0 with battery support
                  Operating Systems
                  Microsoft® Windows® 10
                  Microsoft® Windows 10 IoT Enterprise
                  Microsoft® Windows IoT 10 Core
                  Linux
                  Android
                  Yocto
                  Hypervisor
                  RTS Real-Time Hypervisor
                  Temperature
                  Commercial: Operating Temperature: 0 to +60°C | Storage Temperature: -20 to +85°C
                  Industrial: Operating Temperature: -40 to +85°C | Storage Temperature: -40 to +85°C (depending on CPU)
                  Humidity
                  Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.
                  Size
                  160 x 160 mm

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