COM Express Type 6 Compact module with Intel® Core™ i7-6600U dual core processor with 2.6GHz, 4MB L2 cache and 2133MT/s dual channel DDR4 memory interface
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conga-TC170
COM Express Type 6 Compact module based on 6th Generation Intel® Core™ processor family
- 6th Generation Intel® Core™ ULV Processors
- Intel® Gen9 HD Graphics with HEVC (H.265) support
- Up to 32GB Dual-Channel DDR4 memory
- Productvideo
Value adding ecosystem offerings

Cooling Solutions

Memory

Carrierboards

Module services
Specification
with OpenCL 2.0, OpenGL 4.3 and DirectX12 (Windows 10) support | up to three independent displays: DisplayPort 1.2 | eDP 1.3 | VGA (optional)
It is capable of calculating efficient hash and RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and e commerce will benefit also with improved authentication, integrity and confidence levels.
Operating: 0 to +60°C Storage: -20 to +80°C
Documents
Data Sheet
Software
Use for BIOS update or customization and panel configuration. Linux source version.
Important note: Only compatible with cgos 1.03.032 and older!
Important note: Only compatible with cgos 1.03.032 and older!
Important note: Only compatible with cgos 1.03.032 and older!
Product Variants
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- 100W W
- 118W W
- 135W W
- Microsoft® Windows 11 IoT Enterprise upon request
- Microsoft® Windows 11 upon request
- Ubuntu Linux LTS
- Microsoft® Windows 11 IoT Enterprise
- RTOS
- QNX
- Microsoft® Windows 11
- Microsoft® Windows IoT 10 Core
- Microsoft® Windows 10 IoT Enterprise
- Microsoft® Windows® 10 (64bit only)
- Microsoft® Windows® 10
- Microsoft® Windows 10 Enterprise
- Microsoft® Windows 10 Core Pro
- Microsoft® Windows® 7
- Android
- Linux
- Yocto
- Microsoft® Windows® XP
- Microsoft® Windows® embedded Standard
- Microsoft® Windows® CE 6.0
- Microsoft® Windows® CE 7.0
- Embedded POS Ready
- Windows Embedded Compact 7
- Microsoft Windows 8 embedded
- Microsoft® Windows® 8.1
- BSPs with OS drivers and tools
- Microsoft® Windows® 7/8 embedded Standard
- Microsoft® Windows Server 2016
- RHEL 6.8 & 7.2
- SUSE 12 SP1
- Fedora 22
- Ubuntu 14.10
- CentOS 6.6 & 7.1
- FreeBSD 10.3 & 11
- Yocto v2.0 (Jethro), Kernel 4.1
- VMware
- Microsoft® Windows Server 2012 R2
- Microsoft® Windows Server 2012
- Microsoft® Windows Server 2008 R2 SP1
- RHEL 6.6 & 7.1
- SuSE 11 SP4 & 12 SP1
- Yocto v.2.0 Kernel 4.1
- Wind River VxWorks 7
- ESXi
- Microsoft® Windows IoT Core
- Microsoft® Windows 10 (64bit only)
- Fedora 24
- Ubuntu
- SuSe
- Red Hat Enterprise
- Yocto Project v2.2
- Chromium 2
- Wind River VxWorks
- Microsoft® Windows 10 IoT Enterprise (64bit only)
- RTS Hypervisor
If you don't find the configuration you require contact your congatec Sales representative for further assistance.
COM Express Type 6 Compact module with Intel® Core™ i5-6300U dual core processor with 2.4GHz, 3MB L2 cache and 2133MT/s dual channel DDR4 memory interface
COM Express Type 6 Compact module with Intel® Core™ i3-6100U dual core processor with 2.3GHz, 3MB L2 cache and 2133MT/s dual channel DDR4 memory interface
COM Express Type 6 Compact module with Intel® Core™ i7-6600U dual core processor with 2.6GHz up to 3.4GHz, 4MB Intel® Smart Cache , GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Skylake-U). Integrated DisplayPort to VGA converter.
COM Express Type 6 Compact module with Intel® Celeron® 3955U dual core processor with 2.0GHz, 2MB L2 cache and 2133MT/s dual channel DDR4 memory interface
Ecosystem Details
Cooling Solutions
Standard heatspreader for COM Express modules conga-TC97, TC170 and TC175. All standoffs are with 2.7mm bore hole.
Standard heatspreader for COM Express modules conga-TC97, TC170 and TC175. All standoffs are M 2.5 threaded
Standard passive cooling solution for COM Express modules conga-TC97, TC170 and TC175. All standoffs are with 2.7mm bore hole.
Standard passive cooling solution for COM Express modules conga-TC97, TC170 and TC175. All standoffs are M 2.5 threaded
Standard active cooling solution for COM Express modules conga-TC97, TC170 and TC175. All standoffs are with 2.7mm bore hole, 15mm fins, 18mm overall heat sink height and integrated 12V fan.
Standard active cooling solution for COM Express modules conga-TC97, TC170 and TC175. All standoffs are M 2.5 threaded, 15mm fins, 18mm overall heat sink height and integrated 12V fan.
Memory
DDR4 SODIMM memory module with 2400 MT/s and 4GB RAM
DDR4 SODIMM memory module with 2400 MT/s and 8GB RAM
DDR4 SODIMM memory module with 2400 MT/s and 16GB RAM
Carrierboards
Evaluation Carrier Board for COM Express Type 6 Modules.
Module services
Design-Training to develop carrier boards for Computer on Modules
HumiSeal® 1A33 coating for COM Express Basic and Compact modules; MIL-I-46058C qualified, IPC-CC-830 and
RoHS Directive 2002/95/EC compliant and recognized under UL File Number E105698.
congatec Wide Temperature Range Screening
Standard screening profile with 12h temperature screening and cold soak test
Including functional test and several boot-ups (before & after screening)
congatec Wide Temperature Range Screening
Standard screening profile with 12h temperature screening and cold soak test
Including functional test and several boot-ups (before & after screening)
Accessories
conga-LDVI
DVI Converter Module for LVDS
conga-TEVAL/COMe 2.1 (EOL)
Evaluation Carrier Board for COM Express® Type 6 Modules Rev. 2.1