conga-TEVAL3/COMe3.1 (P/N 065820)
congatec COM Express Type 6 evaluation carrier compliant to COM Express 3.1 specification. Industrial temperature range. From -40°C to 85°C
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conga-TEVAL3/COMe3.1
COM Express Type 6 Rev. 3.1 Evaluation Carrier Board
Selected module variant
Selected ecosystem parts
Carrierboards
conga-TEVAL3/COMe3.1
COM Express Type 6 Rev. 3.1 Evaluation Carrier Board
- Evaluation Carrier for COMe Type 6 modules
- Supports COMe Compact and Basic modules using connector Pinout Type 6
- Compliant to latest COMe Spec Rev. 3.1
Specification
Board Type
- Evaluation Carrier Board for COM Express® Type 6 Modules Rev. 3.1
Internal IO
- PCIe Gen4 x16 (PEG)
- PCIe Gen4 x4
- 2x PCIe Gen4 x1
- M.2 Key B 2242/3042 (USB2.0 muxed, PCIe x1, SIM)
- M.2 Key E 2230 (USB2.0 muxed, PCIe x1)
- Dual USB2.0 header (muxed)
- USB Typ B (muxed)
- 3x SATA 6Gb/s
- SATA 6Gb/s with SATADOM Pin 7
- LVDS (muxed with eDP)
- eDP (muxed with LVDS)
- VGA Dsub
- HDA/SoundWire header
- GSPI header
- SD Card socket (muxed with GPIOs)
- SPI boot flash socket
- Up to 4x COM headers
- CAN header
- LPC header
- Feature Connector
- ATX-4pin Power connector
- ATX-24pin Power connector
- Banana sockets for single power input
External IO
- RJ45 2.5G Base-T
- 2x Dual USB Type A up to 10Gbps
- 2x USB4 Type C up to 20Gbps with Intel® JHL9040RIT Thunderbolt™ 4 Retimer
- DP++ HBR3
- 2x Audio Jack 3.5mm
Temperature
Operation -40°C to 85°C | Storage -40°C to 85°C
Humidity
Operation 10% to 90% r. H. non cond. | Storage 5% to 95% r. H. non cond.
Size
294 x 244 mm2
Documents
All documents found on this page are updated without notification. Always check this page for
the latest
version.
Manual
11.02.2025
Data Sheet
27.11.2024
Software
High Definition Audio Codec driver
High Definition Audio Codec driver
