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COM-HPC
conga-TC675
conga-HPC/mRLP
conga-HPC/cRLS
conga-HPC/cRLP
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conga-TC675
13세대 인텔® 코어™ 임베디드 모바일 프로세서(코드명 랩터 레이크) 탑재 COM Express 타입 6 컴팩트 모듈
Selected module variant
Selected ecosystem parts
Cooling solutions
Memory
Carrierboards
Module services
Value adding ecosystem offerings
Cooling solutions
Please select
Heatspreader with Heatpipes - Threaded
Heatspreader with Heatpipes - Borehole
Passive Cooling with Heatpipes - Threaded
Passive Cooling with Heatpipes - Borehole
Active Cooling with Heatpipes - Threaded
Active Cooling with Heatpipes - Borehole
Memory
Please select
DDR5-SODIMM-4800 (8GB)
DDR5-SODIMM-4800 (16GB)
DDR5-SODIMM-4800 (32GB)
DDR5-SODIMM-4800 (8GB) / i-temp
DDR5-SODIMM-4800 (16GB) / i-temp
DDR5-SODIMM-4800 (32GB) / i-temp
Carrierboards
Please select
conga-TEVAL2
Module services
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Design-In Training
Conformal Coating COM Express Basic and Compact
Ext. temperature screening (-40°C to +85°C)
Ext. temperature screening (-25°C to +80°C)
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conga-TC675
13세대 인텔® 코어™ 임베디드 모바일 프로세서(코드명 랩터 레이크) 탑재 COM Express 타입 6 컴팩트 모듈
Intel® hybrid design combines Performance cores with Efficient cores
Up to Intel® Iris® Xe Graphics architecture with up to 96 EUs
PCI Express Gen 4 | USB 4
AI Acceleration with Intel® Deep Learning Boost (VNNI)
Options for Industrial Temperature Range 40°C up to +85°C
What is Virtualization Ready?
Technical Details
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Select module variant
conga-TC675/U300E
conga-TC675/i3-1315UE
conga-TC675/i3-1315URE
conga-TC675/i3-1320PE
conga-TC675/i3-1320PRE
conga-TC675/i3-13300HE
conga-TC675/i3-13300HRE
conga-TC675/i5-1335UE
conga-TC675/i5-1340PE
conga-TC675/i5-1345URE
conga-TC675/i5-1350PRE
conga-TC675/i5-13600HE
conga-TC675/i7-1365UE
conga-TC675/i7-1365URE
conga-TC675/i7-1370PE
conga-TC675/i7-1370PRE
conga-TC675/i7-13800HE
conga-TC675/i7-13800HRE
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Do you want to add further ecosystem parts (carrier boards, memory,...) to your request?
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