COM-HPC Product Overview
High performance Computer on Module formfactor
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There are 1,000's of possible configurations of our products, and therefore every possible configuration may not be shown with this tool.
If you don't find the configuration you require contact your congatec Sales representative for further assistance.
If you don't find the configuration you require contact your congatec Sales representative for further assistance.
conga-HPC/mRLP
- 13th Generation Intel® Core™
- Intel® Xe graphics engine
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 4
conga-HPC/cRLS
- 13th Generation Intel® Core™
- Intel® performance hybrid architecture
- Performance-optimized design
- Up to 24 cores
- PCIe Gen 5
conga-HPC/cRLP
- 13th Generation Intel® Core™
- Intel® performance hybrid architecture
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 5
conga-HPC/sILH
인텔® 제온® D 프로세서 시리즈 기반의 COM-HPC 서버 사이즈E 모듈 (코드명 아이스레이크)
conga-HPC/sILL
인텔® 제온® D 프로세서 시리즈 (코드명 아이스레이크) 기반의 COM-HPC 서버 사이즈D 모듈
conga-HPC/cTLH
- 11th Generation Intel® Core™
- Intel® Xe graphics engine
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 4
conga-HPC/cTLU
- 11th Generation Intel® Core™
- Power- and size-optimized design
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 4
conga-HPC/EVAL-Server
- Evaluation carrier board for Size D & E
- 7x PCIe connectors for 52 lanes
- 10 GbE RJ45 through module
- GbE RJ45 through ASPEED AST2600
conga-HPC/EVAL-Client
- Evaluation carrier board for sizes A, B, C
- 5x PCIe connectors for 48 lanes
- 2x MIPI Camera Serial Interface
- KR connector to connect LAN mezzanine cards
