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conga-TFS (EOL)
COM Express Type 6 모듈, AMD 임베디드 R-Series 플랫폼, 고성능 내장 그래픽
- Power efficient high-performance x86 processing
- Unprecedented integrated graphics performance
- High performance parallel processing support
Specification
It is capable of calculating efficient hash and RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and e commerce will benefit also with improved authentication, integrity and confidence levels.
ACPI 3.0 compliant, Smart Battery Management
Operating: 0 to +60°C Storage: -20 to +80°C
Documents
Manual
Data Sheet
Image
Software
Product Variants
Ecosystem Details
Carrierboards
Evaluation Carrier Board for COM Express Type 6 Modules.
Memory
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 8GB RAM.
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 4GB RAM.
DDR3L SODIMM memory module with 1600MT/s (PC3L-12800S) and 2GB RAM.
Cooling Solutions
Standard active cooling solution for high performance COM Express module conga-TFS with integrated vapor chamber, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.
Standard active cooling solution for high performance COM Express module conga-TFS with integrated vapor chamber, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
Standard heatspreader for high performance COM Express module conga-TFS with integrated vapor chamber. All standoffs are M2.5mm thread.
Standard heatspreader for high performance COM Express module conga-TFS with integrated vapor chamber. All standoffs are with 2.7mm bore hole.
Accessories
conga-Cdebug (EOL)
COM Express® Type 2 모듈과 Carrier 보드 디버깅 플랫폼
conga-LDVI
LVDS 출력을 위한 DVI 컨버터 모듈
conga-TEVAL/COMe 2.1 (EOL)
COM Express® Type 6 모듈을 지원하는 Evaluation Carrier 보드