COM Express Compact module with Intel® Atom™ x7-E3950 quad core processor with 1.6GHz core frequency up to 2.0GHz, 2MB L2 cache and up to 8GB 1866MT/s DDR3L SODIMM memory support. Industrial grade temperature range from -40°C to 85°C.
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conga-TCA5
COM Express Compact Type 6 module with Intel® Pentium® Quad Core Processor and low power consumption
- Intel® Pentium® Quad Core on COM Express
- Enhanced Security Execution
- up to 3 independent Ultra HD displays
- Whitepaper Download
- Product Video
Value adding ecosystem offerings

Cooling Solutions

Memory

Carrierboards

Module services
Specification
Documents
Data Sheet
Errata
Software
Use for BIOS update or customization and panel configuration. Linux source version.
Important note: Only compatible with cgos 1.03.032 and older!
Important note: Only compatible with cgos 1.03.032 and older!
Important note: Only compatible with cgos 1.03.032 and older!
(core-image-minimal) yocto-2-3_release.170825
(core-image-minimal) yocto-2-5-1_release.180814
(core-image-sato) yocto-2-3_release.170825
(core-image-sato) yocto-2-5-1_release.180814
Product Variants
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- 100W W
- 118W W
- 135W W
- Microsoft® Windows 11 IoT Enterprise upon request
- Microsoft® Windows 11 upon request
- Ubuntu Linux LTS
- Microsoft® Windows 11 IoT Enterprise
- RTOS
- QNX
- Microsoft® Windows 11
- Microsoft® Windows IoT 10 Core
- Microsoft® Windows 10 IoT Enterprise
- Microsoft® Windows® 10 (64bit only)
- Microsoft® Windows® 10
- Microsoft® Windows 10 Enterprise
- Microsoft® Windows 10 Core Pro
- Microsoft® Windows® 7
- Android
- Linux
- Yocto
- Microsoft® Windows® XP
- Microsoft® Windows® embedded Standard
- Microsoft® Windows® CE 6.0
- Microsoft® Windows® CE 7.0
- Embedded POS Ready
- Windows Embedded Compact 7
- Microsoft Windows 8 embedded
- Microsoft® Windows® 8.1
- BSPs with OS drivers and tools
- Microsoft® Windows® 7/8 embedded Standard
- Microsoft® Windows Server 2016
- RHEL 6.8 & 7.2
- SUSE 12 SP1
- Fedora 22
- Ubuntu 14.10
- CentOS 6.6 & 7.1
- FreeBSD 10.3 & 11
- Yocto v2.0 (Jethro), Kernel 4.1
- VMware
- Microsoft® Windows Server 2012 R2
- Microsoft® Windows Server 2012
- Microsoft® Windows Server 2008 R2 SP1
- RHEL 6.6 & 7.1
- SuSE 11 SP4 & 12 SP1
- Yocto v.2.0 Kernel 4.1
- Wind River VxWorks 7
- ESXi
- Microsoft® Windows IoT Core
- Microsoft® Windows 10 (64bit only)
- Fedora 24
- Ubuntu
- SuSe
- Red Hat Enterprise
- Yocto Project v2.2
- Chromium 2
- Wind River VxWorks
- Microsoft® Windows 10 IoT Enterprise (64bit only)
- RTS Hypervisor
If you don't find the configuration you require contact your congatec Sales representative for further assistance.
COM Express Compact module with Intel® Atom™ x5-E3940 quad core processor with 1.6GHz core frequency up to 1.8GHz, 2MB L2 cache and up to 8GB 1866MT/s DDR3L SODIMM memory support.Industrial grade temperature range from -40°C to 85°C.
COM Express Compact module with Intel® Atom™ x5-E3930 dual core processor with 1.1GHz core frequency up to 1.8GHz, 2MB L2 cache and up to 8GB 1600MT/s DDR3L SODIMM memory support.Industrial grade temperature range from -40°C to 85°C.
COM Express Compact module with Intel® Celeron™ N3350 dual core processor with 1.1GHz core frequency up to 2.3GHz, 2MB L2 cache and up to 8GB 1866MT/s DDR3L SODIMM memory support.
COM Express Compact module with Intel® Pentium® N4200 quad core processor with 1.5GHz core frequency up to 2.5GHz, 2MB L2 cache and up to 8GB 1866MT/s DDR3L SODIMM memory support.
Ecosystem Details
Cooling Solutions
Passive cooling solution for COM Express Compact module conga-TCA5 with lidded Intel Atom processor. All standoffs are M2.5mm thread.
Passive cooling solution for COM Express Compact module conga-TCA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole.
Standard heatspreader for COM Express Compact module conga-TCA5 with lidded Intel Atom processor. All standoffs are M2.5mm thread.
Standard heatspreader for COM Express Compact module conga-TCA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole.
Passive cooling solution for COM Express Compact module conga-TCA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread.
Passive cooling solution for COM Express Compact module conga-TCA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole.
Standard heatspreader for COM Express Compact module conga-TCA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread.
Standard heatspreader for COM Express Compact module conga-TCA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole.
Memory
DDR3L SODIMM memory module with 1866 MT/s and 2GB RAM
DDR3L SODIMM memory module with 1866 MT/s and 4GB RAM
DDR3L SODIMM memory module with 1866 MT/s and 8GB RAM
Industrial DDR3L SODIMM memory module with 1866 MT/s and 2GB RAM
Industrial DDR3L SODIMM memory module with 1866 MT/s and 4GB RAM
Industrial DDR3L SODIMM memory module with 1866 MT/s and 8GB RAM
Carrierboards
Evaluation Carrier Board for COM Express Type 6 Modules.
Module services
Design-Training to develop carrier boards for Computer on Modules
HumiSeal® 1A33 coating for COM Express Basic and Compact modules; MIL-I-46058C qualified, IPC-CC-830 and
RoHS Directive 2002/95/EC compliant and recognized under UL File Number E105698.
congatec Wide Temperature Range Screening
Standard screening profile with 12h temperature screening and cold soak test
Including functional test and several boot-ups (before & after screening)
congatec Wide Temperature Range Screening
Standard screening profile with 12h temperature screening and cold soak test
Including functional test and several boot-ups (before & after screening)
Accessories
conga-TEVAL/COMe 3.0
Evaluation Carrier Board for COM Express® Type 6 Modules Rev. 3.0
conga-LDVI
LVDS 출력을 위한 DVI 컨버터 모듈
conga-LDVI
DVI Converter Module for LVDS