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conga-TEVAL/COMe 3.0

Evaluation Carrier Board for COM Express® Type 6 Modules Rev. 3.0

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conga-TEVAL/COMe 3.0

Evaluation Carrier Board for COM Express® Type 6 Modules Rev. 3.0

  • COM Express Type 6 Rev. 3.0 Evaluation Carrier Board
  • Reference Carrier Board

Specification


Evaluation Carrier Board for COM Express® Type 6 modules. To achieve a quick start with COM Express® congatec offers an evaluation carrier board, which routes all the COM Express® signals to standard interface connectors. Supports COM Express® Compact and Basic modules using connector Pinout Type 6.

I/O

  • PCI Express x4
  • 5x PCI Express x1
  • PCI Express for Graphics x16
  • M.2 key B size 3042/2260/2280
  • mini PCI Express Half/Full size
  • 4x USB 3.1 Type-A 
  • 2x USB 2.0 Type-A
  • USB Client Type-B
  • Gigabit Ethernet (RJ45) 
  • SDP header

Audio

  • 2x Audio Jack (Line Out/MIC In)
  • Optical S/PDIF Out
  • External Codec header

Storage

  • 4x SATA; SATADOM support
  • SATA Power, SD/SDIO

Misc

  • COM RS-232/422/485
    • COM RS-232
    • CAN Bus
    • Power/Reset/Sleep Buttons
    • 2x FAN
    • Feature header

Video

  • 3x Dual-Mode DisplayPort
  • eDP
  • LVDS
  • VGA

Power

  • ATX 24pin PoweR 
  • 12V Banana 4mm Sockets, CMOS/RTC Battery

Size

  • 294 x 244 mm²

Environment

  • Temperature: Operation: -40° to + 85°C | Storage-40° to + 85°C
  • Humity: Operation: 10% to 90% Storage: 5% to 95%

Documents

All documents found on this page are updated without notification. Always check this page for the latest version.

Data Sheet

Ecosystem Details

Carrierboards

conga-TEVAL2 (P/N 065810)

Evaluation carrier board for COM Express Type6 Rev. 3.0 modules.

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11세대 인텔® 코어™ 프로세서 제품군(코드명 "타이거 레이크")과 솔더링(soldering) 방식 메모리 탑재 COM Express 타입 6 컴팩트 모듈