conga-HPC/EVAL-Server (P/N 065500)
conga-HPC/EVAL-Server
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conga-HPC/EVAL-Server
Evaluation Carrier Board for COM-HPC Server Type Modules
Selected module variant
conga-HPC/EVAL-Server
Evaluation Carrier Board for COM-HPC Server Type Modules
- Evaluation Carrier Board for COM HPC Server Type Modules
- Routing of the entire signals provided by COM HPC Module Base Specification R1.0 to standard interface connectors
Specification
Formfactor
Extended ATX
Board Variant
Evaluation Carrier Board for COM-HPC Server Type Modules (Sizes D and E)
Internal Connectors and Features
- 2x PCIe x16 connector
- 2x PCIe x8 connector
- 3x PCIe x4 connector
- 2x dual USB 2.0 header
- M.2 Key M 2230 / 2242 / 2260 / 2280 / 22110 8x Ethernet KR interfaces connector
- 2x SATA
- SATA Power
- 2x UART DB9 from module
- 1x UART DB9 from BMC
- 1x UART DB9 for BMC console
- GP SPI header
- I2C header
- SMB header
- eSPI header
- SPI socket
- GPIO header
- Feature header
- 3x Fan
External Connectors
- 4x USB3.2 Gen 1 Type A
- DP through BMC
- 10GbE RJ45 through module
- GbE RJ45 through ASPEED AST2600
Postcode
4x 7-Segment Postcode LEDs connected to PD I2C
Power Input
- ATX connector, 12V/GND banana jacks
Operating Temperature
Operating Temp.: -40°C … +85°C | Storage Temp.: -40°C … +85°C
Humidity
Operating Hum.: 10% … 90% r. H. non cond. Storage Hum.: 5% … 95% r. H. non cond.
Size
304.8 x 330.2 mm (approx. 12 x 13 inches)
Documents
All documents found on this page are updated without notification. Always check this page for
the latest
version.
Data Sheet
30.10.2024
Manual
30.10.2024
Schematics
22.07.2024
Ecosystem Details
Carrierboards
Accessories
conga-HPC/sILH
COM-HPC Server Size D module based on Intel® Xeon® D processor series (code name "Ice Lake")
conga-HPC/sILH
인텔® 제온® D 프로세서 시리즈 기반의 COM-HPC 서버 사이즈E 모듈 (코드명 아이스레이크)
conga-HPC/LEK
Mezzanine Cards for up to 100Gb Ethernet
