conga-SMX95 Preview image
  • conga-SMX95 Image 1
  • conga-SMX95 Image 2
  • conga-SMX95 Image 3
  • conga-SMX95 Image 4

Your item has been added to the inquiry

conga-SMX95 Image

conga-SMX95

最大 6コアの Arm Cortex-A55 と NXP eIQ® Neutron NPU 内蔵の NXP i.MX 95 プロセッサー シリーズを搭載した SMARC 2.1 モジュール

Selected module variant

    Selected ecosystem parts

    Cooling Solutions

      Module services

        Value adding ecosystem offerings


        Cooling Solutions

        Module services

        見積りを依頼 + Add more articles

        conga-SMX95

        最大 6コアの Arm Cortex-A55 と NXP eIQ® Neutron NPU 内蔵の NXP i.MX 95 プロセッサー シリーズを搭載した SMARC 2.1 モジュール

        • NXP i.MX 95 プロセッサー シリーズ搭載の SMARC モジュール | 最大 6コアの Arm Cortex-A55
        • 高速データ処理、機械学習、ビジョン向けの NXP eIQ® Neutron NPU
        • EdgeLock™ と暗号化エンジンによる高度なセキュリティ
        • 3～8W の超低消費電力アーキテクチャー
        • 動作温度範囲は最大 -40℃ ～ +85℃ に対応

         

        Congatec Logo
        Do you want to add further ecosystem parts (carrier boards, memory,...) to your request?

        Value adding ecosystem offerings

        Cooling Solutions

        Module services

        Specification

        Formfactor
        SMARC
        CPU
        NXP i.MX 9596 (commercial) (6x ARM Cortex-A55 @ 2.0 GHz + 1x ARM Cortex-M7 + 1x ARM Cortex-M33 + eIQ Neutron NPU)
        NXP i.MX 9596 (industrial) (6x ARM Cortex-A55 @ 1.8 GHz + 1x ARM Cortex-M7 + 1x ARM Cortex-M33 + eIQ Neutron NPU)
        DRAM
        Up to 16 GByte onboard LPDDR5 memory | up to 6400 MT/s | inline ECC
        Ethernet
        2x Gbit Ethernet with support for TSN | IEEE 1588
        I/O Interfaces
        1 x dual-role USB 2.0
        2 x USB 2.0
        2 x USB 3.0
        1 x SDIO 3.0
        2 x PCIe 3.0 1-lane
        1 x I²C bus
        SPI
        1 x QSPI
        Up to 3x UART (2x with Handshake)
        2 x CAN FD
        14 x GPIOs
        optional soldered M.2 1216 WiFi 6/BT 5.3
        Mass storage
        eMMC 5.1 up to 256 GByte
        Graphics
        Integrated in SoC | Arm® Mali™ 3D GPU G310 | 2D GPU supporting blend graphics overlays | OpenGL® ES 3.2 | Vulkan® 1.2 | OpenCL 3.0
        Security
        NXP EdgeLock® 2GO key management services | Cryptographic Acceleration and Assurance Module | Resource Domain Controller | ARM® TrustZone® | High Assurance Boot support |
        SHE, Encryption Engine AES-128, AES-256, 3DES, RC4, RSA4096, TRNG, SHA-1, SHA-2, SHA-256, MD-5 | RSA-1024, 2048, 3072, 4096 and secure key storage | side channel attack resistance
        Boot Loader
        U-Boot boot loader
        Operating Systems
        Linux
        Yocto
        Android
        Temperature
        Commercial : Operating 0°C to 60°C | Storage -20°C to 80°C
        Industrial: Operating -40°C to +85°C | Storage -40°C to +85°C
        Humidity
        Operating: 10 to 85% r. H. non cond. / Storage 5 to 85% r. H. non cond.
        Video Interfaces
        1 x Dual channel 24-bit LVDS
        1 x Display Port 1.4 1080p60 through MIPI-DSI to DisplayPort Bridge (shared with MIPI-DSI)
        optional MIPI-DSI capable of supporting 4kp30 or 3840p60 shared with DisplayPort
        1 x optional HDMI 2.0a through MIPI-DSI to HDMI bridge (shared with MIPI-DSI)
        up to 2x MIPI-CSI 4-lanes
        2 x Integrated Image Signal Processor (ISP) for cameras with up to 12 MP resolution (on selected processor SKU’s)
        Features
        Watchdog Timer
        Cortex-M7 and Cortex-M33 console
        optional JTAG debug interface
        High Precision Real Time Clock
        AI & Deep Learning
        NXP eIQ® Neutron Neural Processing Unit (NPU) with up to 2 TOPS
        NXP eIQ® ML Software Development Environment
        Size
        82 x 50 mm (3,23” x 1,97”)

        Documents

        All documents found on this page are updated without notification. Always check this page for the latest version.

        Data Sheet

        Datasheet for conga-SMX95
        13.03.2025

        Product Variants

        Product Filter:

          Add Filter:

           - 
           - 
           - 
           - 
           - 
           - 
            There are 1,000's of possible configurations of our products, and therefore every possible configuration may not be shown with this tool.
            If you don't find the configuration you require contact your congatec Sales representative for further assistance.
            conga-SMX95/MX959-6C-8G-eMMC64 (P/N 051600)

            SMARC Module with NXP i.MX 9596 6-core processor. Features 6x ARM Cortex-A55 @ 2 GHz, ARM Cortex-M7, ARM Cortex-M33, eIQ Neutron NPU, 8GB onboard LPDDR5 memory and 64GB onboard eMMC. Commercial grade temperature range from 0°C to 60°C.

            conga-SMX95/MX959-6C-4G eMMC32 (P/N 051601)

            SMARC Module with NXP i.MX 9596 6-core processor. Features 6x ARM Cortex-A55 @ 1.8 GHz, ARM Cortex-M7, ARM Cortex-M33, eIQ Neutron NPU, 4GB onboard LPDDR5 memory and 32GB onboard eMMC. Commercial grade temperature range from 0°C to 60°C.

            conga-SMX95/i-MX959-6C-8G eMMC64 (P/N 051610)

            SMARC Module with NXP i.MX 9596 6-core processor. Features 6x ARM Cortex-A55 @ 1.8 GHz, ARM Cortex-M7, ARM Cortex-M7, eIQ Neutron NPU, 8GB onboard LPDDR5 memory and 64GB onboard eMMC. Industrial grade temperature range from -40°C to 85°C.

            conga-SMX95/i-MX959-6C-4G eMMC32 (P/N 051611)

            SMARC Module with NXP i.MX 9596 6-core processor. Features 6x ARM Cortex-A55 @ 1.8 GHz, ARM Cortex-M7, ARM Cortex-M33, eIQ Neutron NPU, 4GB onboard LPDDR5 memory and 32GB onboard eMMC. Industrial grade temperature range from -40°C to 85°C.

            conga-SMX95/i-MX959-6C-8G eMMC64 NX611 (P/N 051620)

            SMARC Module with NXP i.MX 9596 6-core processor. Features 6x ARM Cortex-A55 @ 1.8 GHz, ARM Cortex-M7, ARM Cortex-M33, eIQ Neutron NPU, 8GB onboard LPDDR5 memory and 64GB onboard eMMC. Industrial grade temperature range from -40°C to 85°C. With Wifi/BT module NX611.

            Ecosystem Details

            Cooling Solutions

            conga-SMX95/CSP-B (P/N 051650)

            Passive cooling solution for SMARC module conga-SMX95 with NXP i.MX 95 lidded ARM processor. All standoffs are with 2.7mm bore hole.

            conga-SMX95/HSP-B (P/N 051651)

            Heat spreader solution for SMARC module conga-SMX95 with NXP i.MX 95 lidded ARM processor. All standoffs are with 2.7mm bore hole.

            Module services

            Design-In Training (P/N 27000001)

            Design-Training to develop carrier boards for Computer on Modules

            Accessories

            More about conga-SEVAL

            conga-SEVAL

            SMARC モジュール用 評価キャリアボード

            More about conga-SMC1/SMARC-ARM

            conga-SMC1/SMARC-ARM

            ARMベース SMARC 2.0 モジュール用 コンパクトサイズのキャリアボード