[Translate to Japanisch:] conga-QMX8-Plus computer-on-module
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[Translate to Japanisch:] conga-QMX8-Plus computer-on-module

conga-QMX8-Plus

NXP i.MX 8M Plus 14nmプロセッサ シリーズ（ARM 4コア Cortex-A53 / M7 + NPU内蔵）を搭載した Qseven モジュール

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conga-QMX8-Plus

NXP i.MX 8M Plus 14nmプロセッサ シリーズ（ARM 4コア Cortex-A53 / M7 + NPU内蔵）を搭載した Qseven モジュール

  • NXP i.MX 8M Plus 14nmプロセッサ シリーズ（ARM 4コア Cortex-A53 / M7 + NPU内蔵）
  • NPU とインテグレートされたカメラISPによる、強化されたAI、機械学習、ビジョン機能
  • 2～5W の超低消費電力アーキテクチャ
  • 最長15年の長期供給
  • 動作温度範囲は最高 -40℃ ～ +85℃
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Value adding ecosystem offerings

Cooling Solutions

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Specification

Formfactor
Qseven
CPU
NXP i.MX 8M Plus (consumer) (4x ARM® Cortex®-A53 @1.8GHz +1x ARM® Cortex®-M7 + NPU)
NXP i.MX 8M Plus (industrial) (4x ARM® Cortex®-A53 @1.6GHz +1x ARM® Cortex®-M7 + NPU)
DRAM
Up to 6 GByte onboard LPDDR4 memory | 4000 MT/s | inline ECC
Ethernet
1 x Gbit Ethernet with IEEE 1588 and TSN Support
I/O Interfaces
1 x dual-role USB 3.0
1 x CAN FD
1 x UART with Handshake
1 x SPI
2 x I²C bus
1 x PCIe 3.0
1 x onboard µSD card socket
1 x SDIO 3.0
3 x USB 2.0
12 x GPIOs
Mass storage
eMMC 5.1 up to 128 GByte | SPI NOR Flash up to 64MByte
Graphics
Integrated in SoC | GC7000UL 3D graphics with 2 high performance vec4 shaders | GC520L 2D graphics VPU up to 1080p60 H.265/H.264 decoding and encoding | OpenGL ES 3.1 | Vulcan | OpenCL 1.2 FP | OpenVG 1.1 2 independent displays
Security
Cryptographic Acceleration and Assurance Module (CAAM) | Resource Domain Controller | ARM® TrustZone® High Assurance Boot support | SHE, Encryption Engine AES-128, AES-256, 3DES, RC4, RSA4096, TRNG SHA-1, SHA-2, SHA-256, MD-5 | RSA-1024, 2048, 3072, 40
Operating Systems
Linux
Yocto
Android
Temperature
Operating Temperature Range: 0 to +60°C commercial grade | -40 to +85°C industrial grade
Storage Temperature Range: -40 to +85°C
Humidity
Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.
Video Interfaces
1 x dual channel 24-bit LVDS | 1x HDMI 2.0a | 1x MIPI-DSI 4-lane shared with second LVDS channel
2 x MIPI-CSI 4-lane onboard connectors | 2x integrated Image Signal Processor (ISP) for cameras with up to 12 MP resolution
Size
70 x 70 mm (2,75" x 2,75")

Documents

All documents found on this page are updated without notification. Always check this page for the latest version.

Data Sheet

Data Sheet for conga-QMX8-Plus
30.10.2024

Manual

User's Guide for conga-QMX8-Plus
30.10.2024

Product Variants

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      There are 1,000's of possible configurations of our products, and therefore every possible configuration may not be shown with this tool.
      If you don't find the configuration you require contact your congatec Sales representative for further assistance.
      conga-QMX8-Plus/QC-NPU-4G eMMC16 (P/N 016600)

      Qseven module with low-power 14nm NXP i.MX 8M Plus Quad processor. Features 4x ARM® Cortex®-A53 @ 1.8GHz +1x ARM® Cortex®-M7 + NPU, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Commercial temperature range from 0°C to 60°C.

      conga-QMX8-Plus/QC-NPU-2G eMMC16 (P/N 016601)

      Qseven module with low-power 14nm NXP i.MX 8M Plus Quad processor. Features 4x ARM® Cortex®-A53 @ 1.8GHz +1x ARM® Cortex®-M7 + NPU, 2GB onboard LPDDR4 memory and 16GB onboard eMMC. Commercial temperature range from 0°C to 60°C.

      conga-QMX8-Plus/i-QC-NPU-4G eMMC16 (P/N 016620)

      Qseven module with low-power 14nm NXP i.MX 8M Plus Quad processor. Features 4x ARM® Cortex®-A53 @ 1.6GHz +1x ARM® Cortex®-M7 + NPU, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Industrial grade temperature range from -40°C to 85°C.

      conga-QMX8-Plus/i-QC-NPU-2G eMMC16 (P/N 016621)

      Qseven module with low-power 14nm NXP i.MX 8M Plus Quad processor. Features 4x ARM® Cortex®-A53 @ 1.6GHz +1x ARM® Cortex®-M7 + NPU, 2GB onboard LPDDR4 memory and 16GB onboard eMMC. Industrial grade temperature range from -40°C to 85°C.

      Ecosystem Details

      Cooling Solutions

      conga-QMX8-Plus/HSP-T (P/N 016650)

      Standard heatspreader for Qseven module conga-QMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are 2.5mm thread.

      conga-QMX8-Plus/HSP-B (P/N 016651)

      Standard heatspreader for Qseven module conga-QMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole.

      Carrierboards

      conga-QEVAL/Qseven 2.0 ARM (P/N 007005)

      Evaluation carrier board for Qseven 2.0 modules based on ARM architecture.

      Module services

      Design-In Training (P/N 27000001)

      Design-Training to develop carrier boards for Computer on Modules

      Conformal Coating Qseven, SMARC, Type 10 (P/N )

      HumiSeal® 1A33 coating for Qseven, SMARC and Type 10 modules; MIL-I-46058C qualified, IPC-CC-830 and RoHS
      Directive 2002/95/EC compliant and recognized under UL File Number E105698.

      Ext. temperature screening (-40°C to +85°C) (P/N )

      congatec Wide Temperature Range Screening
      Standard screening profile with 12h temperature screening and cold soak test
      Including functional test and several boot-ups (before & after screening)

      Ext. temperature screening (-25°C to +80°C) (P/N )

      congatec Wide Temperature Range Screening
      Standard screening profile with 12h temperature screening and cold soak test
      Including functional test and several boot-ups (before & after screening)

      Accessories

      More about conga-QEVAL/Qseven 2.0

      conga-QEVAL/Qseven 2.0

      Qseven を使った開発をすぐに始められるように、すべての Qseven 信号を標準のインタフェースコネクタに出力する評価キャリアボード

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      conga-DP/HDMI 4k Adapter

      DP++ to HDMI evaluation adapter for development purpose