COM-HPC Client module based on Intel® Core™ 7-251E LGA 1700 processor with 8 P-cores 2.1GHz up to 5.6GHz Turbo and 16 E-cores 1.6GHz up to 4.4 GHz Turbo |36MB Intel® Smart Cache | Intel® UHD Graphics 770 with 32EUs | Dual channel DDR5 memory interface | Chipset R680E | Intel® code name: Bartlett Lake S
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conga-HPC/cBLS
インテル® Core™ プロセッサー(シリーズ2)(コードネーム「Bartlett Lake S」)を搭載した COM-HPC Client Size C ハイパフォーマンス モジュール
Selected ecosystem parts
Virtualization

Operating Systems
IOT Software

Cooling Solutions

Carrierboards

Memory

Module services
Value adding ecosystem offerings
Virtualization

Operating Systems
IOT Software

Cooling Solutions

Carrierboards

Memory

Module services
conga-HPC/cBLS
インテル® Core™ プロセッサー(シリーズ2)(コードネーム「Bartlett Lake S」)を搭載した COM-HPC Client Size C ハイパフォーマンス モジュール
- パフォーマンスコアと高効率コアを組み合わせた インテル® ハイブリッド設計
- 最高 Xe アーキテクチャの インテル® UHD グラフィックス 770
- PCI Express Gen 4/5 | USB 3.2 Gen 2x2
- インテル® ディープラーニング・ブースト(VNNI)による AI アクセラレーション
- プレスリリースはこちら
Value adding ecosystem offerings
Virtualization

Operating Systems
IOT Software

Cooling Solutions

Carrierboards

Memory

Module services
Specification
Storage: -20°C to 80°C
Software
Use for BIOS update or customization and panel configuration. Linux source version.
Important note: Only compatible with cgos 1.03.032 and older!
Important note: Only compatible with cgos 1.03.032 and older!
Important note: Only compatible with cgos 1.03.032 and older!
Important note: Only compatible with cgos 1.03.032 and older!
Product Variants
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- 2.7W W
- 3W W
- 3W W
- 3W W
- 3.6W W
- 3.9W W
- 4W W
- 4.3W W
- 4.5W W
- 5W W
- 5.5W W
- 6W W
- 6.4W W
- 6.4W W
- 6.5W W
- 7W W
- 7.5W W
- 9W W
- 9.5W W
- 10W W
- 11.5W W
- 12W W
- 15W W
- 16W W
- 17W W
- 18W W
- 19W W
- 20W W
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- 28 W W
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- 31W W
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- 50W W
- 52W W
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- 65W W
- 67W W
- 77W W
- 80W W
- 85W W
- 100W W
- 100W W
- 100W W
- 118W W
- 135W W
- Microsoft® Windows 11 IoT Enterprise upon request
- Microsoft® Windows 11 upon request
- Ubuntu Linux LTS
- Microsoft® Windows 11 IoT Enterprise
- RTOS
- QNX
- Microsoft® Windows 11
- Microsoft® Windows IoT 10 Core
- Microsoft® Windows 10 IoT Enterprise
- Microsoft® Windows® 10 (64bit only)
- Microsoft® Windows® 10
- Microsoft® Windows 10 Enterprise
- Microsoft® Windows 10 Core Pro
- Microsoft® Windows® 7
- Android
- Linux
- Yocto
- Microsoft® Windows® XP
- Microsoft® Windows® embedded Standard
- Microsoft® Windows® CE 6.0
- Microsoft® Windows® CE 7.0
- Embedded POS Ready
- Windows Embedded Compact 7
- Microsoft Windows 8 embedded
- Microsoft® Windows® 8.1
- BSPs with OS drivers and tools
- Microsoft® Windows® 7/8 embedded Standard
- Microsoft® Windows Server 2016
- RHEL 6.8 & 7.2
- SUSE 12 SP1
- Fedora 22
- Ubuntu 14.10
- CentOS 6.6 & 7.1
- FreeBSD 10.3 & 11
- Yocto v2.0 (Jethro), Kernel 4.1
- VMware
- Microsoft® Windows Server 2012 R2
- Microsoft® Windows Server 2012
- Microsoft® Windows Server 2008 R2 SP1
- RHEL 6.6 & 7.1
- SuSE 11 SP4 & 12 SP1
- Yocto v.2.0 Kernel 4.1
- Wind River VxWorks 7
- ESXi
- Microsoft® Windows IoT Core
- Microsoft® Windows 10 (64bit only)
- Fedora 24
- Ubuntu
- SuSe
- Red Hat Enterprise
- Yocto Project v2.2
- Chromium 2
- Wind River VxWorks
- Microsoft® Windows 10 IoT Enterprise (64bit only)
- RTS Hypervisor
If you don't find the configuration you require contact your congatec Sales representative for further assistance.
COM-HPC Client module based on Intel® Core™ 5-211E LGA 1700 processor with 6 P-cores 2.7GHz up to 4.9GHz Turbo and 4 E-cores 2.0GHz up to 3.7GHz Turbo | 20MB Intel® Smart Cache | Intel® UHD Graphics 770 with 24EUs | Dual channel DDR5 memory interface | Chipset R680E | Intel® code name: Bartlett Lake S
COM-HPC Client module based on Intel® Core™ 3-201E LGA 1700 processor with 4 P-cores 3.6GHz up to 4.8GHz Turbo | 12MB Intel® Smart Cache | Intel® UHD Graphics 730 with 24EUs | Dual channel DDR5 memory interface | Chipset Q670E | Intel® code name: Bartlett Lake S
Ecosystem Details
Virtualization
Operating Systems
IOT Software
Cooling Solutions
Standard active cooling solution for COM-HPC module conga-HPC/cRLS with integrated heat pipes, 30mm overall height and two integrated 12V fans. All standoffs are with 2.7mm bore hole.
Standard active cooling solution for COM-HPC module conga-HPC/cRLS with integrated heat pipes, 30mm height and two integrated 12V fans. All standoffs are M2.5mm threaded.
Standard heatspreader for COM-HPC module conga-HPC/cRLS with integrated heat pipes, 13mm height. All standoffs are with 2.7mm bore hole.
Standard heatspreader for COM-HPC module conga-HPC/cRLS with integrated heat pipes, 13mm height. All standoffs are M2.5mm threaded.
Standard heatpipe adapter for COM-HPC module conga-HPC/cRLS.
Carrierboards
Evaluation Carrier Board for COM-HPC Client type Modules.
COM-HPC Client µATX Application Carrier Board suitable for congatec COM-HPC modules with Size A,B and C.
Memory
DDR5 SODIMM memory module with up to 4800 MT/s and 8GB RAM, commercial temp 0°C to +60°C
DDR5 SODIMM memory module with up to 4800 MT/s and 16GB RAM, commercial temp 0°C to +60°C
DDR5 SODIMM memory module with up to 4800 MT/s and 32GB RAM, commercial temp 0°C to +60°C
DDR5 SODIMM memory module with up to 4800 MT/s and 16GB RAM with ECC, commercial temp 0°C to +60°C
DDR5 SODIMM memory module with up to 4800 MT/s and 32GB RAM with ECC, commercial temp 0°C to +60°C
Module services
Design-Training to develop carrier boards for Computer on Modules
congatec Wide Temperature Range Screening
Standard screening profile with 12h temperature screening and cold soak test
Including functional test and several boot-ups (before & after screening)
congatec Wide Temperature Range Screening
Standard screening profile with 12h temperature screening and cold soak test
Including functional test and several boot-ups (before & after screening)
Accessories
conga-HPC/uATX-Client
COM-HPC Client タイプ モジュール用アプリケーション キャリアボード(Size A、B、C)
conga-HPC/EVAL-Client
COM-HPC Clientタイプ モジュール用 評価キャリアボード