conga-TFS/R-272F (P/N 041103)
COM Express Type 6 Basic Module with AMD Embedded R-272F Processor Dual Core 2.7GHz/3.2GHz in socket with 512KB L2 cache and 1600MT/s DDR3 SODIMM memory interface for up to 16GB and AMD A70M Controller Hub.
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conga-TFS (EOL)
前例のないグラフィックス性能を持つAMD組込R-シリーズプラットフォームベースのCOM Express™ Type 6モジュール
Selected module variant
Selected ecosystem parts
Carrierboards
Memory
Cooling Solutions
Value adding ecosystem offerings
Carrierboards
Memory
Cooling Solutions
conga-TFS (EOL)
前例のないグラフィックス性能を持つAMD組込R-シリーズプラットフォームベースのCOM Express™ Type 6モジュール
Specification
Formfactor
COM Express Basic
CPU
AMD Embedded R-464L
(4 x 2.3 GHz, 2)
AMD Embedded R-460H
(4 x 1.9 GHz, 2, 35W)
AMD Embedded R-272F
(2 x 2.7 GHz, 1, 35W)
DRAM
max. 16 GByte DDR3 1600 MHz
Ethernet
Realtek RTL8111E GbE
I/O Interfaces
7 x PCI Express™
4 x SATA
4 x USB 3.0
8 x USB 2.0
2 x Express Card®
1 x LPC bus
1 x I²C bus
1 x SDIO
1 x PEG
Graphics
High performance DirectX®11 GPU supports OpenCL™ 1.1 and OpenGL 4.2
congatec Board Controller
Multi Stage Watchdog, non-volatile User Data Storage, Manufacturing and Board information, Board Statistics, BIOS Setup, Data Backup, I²C bus (fast mode, 400 kHz, multi-master), Power Loss Control
Security
All congatec COM Express Basic boards can be optionally eqipped with a discrete "Trusted Platform Module" (TPM).
It is capable of calculating efficient hash and RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and e commerce will benefit also with improved authentication, integrity and confidence levels.
It is capable of calculating efficient hash and RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and e commerce will benefit also with improved authentication, integrity and confidence levels.
Power Management
ACPI 3.0
ACPI 3.0 compliant, Smart Battery Management
ACPI 3.0 compliant, Smart Battery Management
Temperature
Standard
Operating: 0 to +60°C Storage: -20 to +80°C
Operating: 0 to +60°C Storage: -20 to +80°C
Humidity
Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.
Video Interfaces
3 x DisplayPort
1 x DDI
1 x VGA
1 x LVDS 2x24
Size
95 x 125 mm (3.74" x 4.92")
Documents
All documents found on this page are updated without notification. Always check this page for
the latest
version.
Manual
15.06.2015
15.06.2015
15.06.2015
Image
15.06.2015
15.06.2015
15.06.2015
15.06.2015
15.06.2015
Data Sheet
15.06.2015
Software
[ DOS ]
[ Linux ]
[ Windows 7 ]
[ Windows 8 ]
[ Windows 8 Embedded ]
[ Windows Embedded Standard 7 ]
[ Windows XP ]
[ Windows XP embedded ]
CGOS API programmers manual
CGOS API programmers manual
CGOS legacy driver 1.03.022 for 32bit Linux (Kernel version 2.6.x, 3.x and 4.x)
CGOS legacy driver 1.03.032 for 64bit Linux (Kernel version 3.x, 4.x, 5.x and 6.x).
For kernel versions >= 5.8 please refer to readme.txt and/or consider using the cgoslx-x64-1.03.032_vmalloc.tar.xz package.
CGOS legacy driver 1.03.032 for 64bit Linux (Kernel versions 5.8 or higher). Modified driver package with Kernel patch as a workaround for memory allocation issues with Kernels >= 5.8
CgosPy is a Python package containing the cgos module which provides ctypes wrapper functions for accessing the CGOS API.
AMD AHCI compatible RAID driver for Windows 7 32/64Bit Rev. 3.3.1540.26.
AMD Catalyst Display Driver and Chipset Driver (all in one) for Windows 7 32/64Bit Rev. 12.101.
CGOS legacy driver 1.03.021 for 32bit and 64bit Windows.
CGOS API programmers manual
CGOS API Library for the .NET Framework
The CgosClr.dll is an assembly that allows easy access to the CGOS API from CLR (Common Language Runtime) .NET Framework languages like C#, Visual Basic, J#, and managed C++.
CgosPy is a Python package containing the cgos module which provides ctypes wrapper functions for accessing the CGOS API.
EAPI (Embedded Application Programming Interface) wrapper DLLs for 32bit and 64bit Windows.
AMD RAID Configuration Utility Rev. 3.3.1540.19.
Realtek Ethernet Driver for RTL8111E, RTL8111G, RTL8105E controller chips for Windows 7 32/64bit Rev. 7.069.
AMD Catalyst Display Driver and Chipset Driver (all in one) for Windows 8 32/64Bit Rev. 12.101
CGOS API programmers manual
CGOS API Library for the .NET Framework
The CgosClr.dll is an assembly that allows easy access to the CGOS API from CLR (Common Language Runtime) .NET Framework languages like C#, Visual Basic, J#, and managed C++.
CgosPy is a Python package containing the cgos module which provides ctypes wrapper functions for accessing the CGOS API.
EAPI (Embedded Application Programming Interface) wrapper DLLs for 32bit and 64bit Windows.
Realtek Ethernet Driver for RTL8111E, RTL8111G, RTL8105E controller chips for Windows 8 32/64bit Rev. 8.012.
CgosPy is a Python package containing the cgos module which provides ctypes wrapper functions for accessing the CGOS API.
Board Support Package for congatec CPU modules Rev. 1.5.1. Contains Windows Embedded Standard 8 driver files for video, SATA, sound, network and CGOS API.
Board Support Package for congatec CPU modules Rev. 1.5.1. Contains 64bit Windows Embedded Standard 8 driver files for video, SATA, sound, network.
CgosPy is a Python package containing the cgos module which provides ctypes wrapper functions for accessing the CGOS API.
Board Support Package Update for congatec CPU modules. Update for WES7 SP1. Requires cgwes7.zip
Board Support Package for congatec CPU modules Rev. 1.5.2. Contains 64bit Windows Embedded Standard 7 driver files for video, SATA, sound, network.
Board Support Package Update for congatec CPU modules. Update for 64bit WES7 SP1. Requires cgwes7x64.zip
Board Support Package for congatec CPU modules Rev. 1.5.2. Contains Windows Embedded Standard 7 driver files for video, SATA, sound, network and CGOS API.
AMD AHCI compatible RAID driver for Windows XP Rev. 3.3.1540.26.
AMD Catalyst Display Driver and Chipset Driver (all in one) for Windows XP 32/64Bit Rev. 9.00.
CGOS legacy driver 1.03.021 for 32bit and 64bit Windows.
CGOS API programmers manual
CGOS API Library for the .NET Framework
The CgosClr.dll is an assembly that allows easy access to the CGOS API from CLR (Common Language Runtime) .NET Framework languages like C#, Visual Basic, J#, and managed C++.
EAPI (Embedded Application Programming Interface) wrapper DLLs for 32bit and 64bit Windows.
AMD RAID Configuration Utility Rev. 3.3.1540.19.
Realtek Ethernet Driver for RTL8111E, RTL8111G, RTL8105E controller chips for Windows XP 32bit Rev. 5.810.
CGOS API programmers manual
Product Variants
conga-TFS/R-460H (P/N 041102)
COM Express Type 6 Basic Module with AMD Embedded R-460H Processor Quad Core 1.9GHz/2.8GHz in socket with 1MB L2 cache and 1600MT/s DDR3 SODIMM memory interface for up to 16GB and AMD A70M Controller Hub.
conga-TFS/R-464L (P/N 041101)
COM Express Type 6 Basic Module with AMD Embedded R-464L Processor Quad Core 2.3GHz/3.2GHz in socket with 1MB L2 cache and 1600MT/s DDR3 SODIMM memory interface for up to 16GB and AMD A70M Controller Hub.
Ecosystem Details
Carrierboards
conga-TEVAL (P/N 065800)
Evaluation Carrier Board for COM Express Type 6 Modules.
Memory
DDR3L-SODIMM-1600 (8GB) (P/N 068757)
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 8GB RAM.
DDR3L-SODIMM-1600 (4GB) (P/N 068756)
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 4GB RAM.
DDR3L-SODIMM-1600 (2GB) (P/N 068755)
DDR3L SODIMM memory module with 1600MT/s (PC3L-12800S) and 2GB RAM.
Cooling Solutions
conga-TFS/CSA-VC-T (P/N 041155)
Standard active cooling solution for high performance COM Express module conga-TFS with integrated vapor chamber, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.
conga-TFS/CSA-VC-B (P/N 041154)
Standard active cooling solution for high performance COM Express module conga-TFS with integrated vapor chamber, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
conga-TFS/HSP-VC-T (P/N 041151)
Standard heatspreader for high performance COM Express module conga-TFS with integrated vapor chamber. All standoffs are M2.5mm thread.
conga-TFS/HSP-VC-B (P/N 041150)
Standard heatspreader for high performance COM Express module conga-TFS with integrated vapor chamber. All standoffs are with 2.7mm bore hole.
Accessories
conga-Cdebug (EOL)
COM Express® Type 2モジュールとキャリアボード用のデバッグプラットフォーム
conga-LDVI
LVDSからDVIへ変更モジュール
conga-TEVAL/COMe 2.1 (EOL)
COM Express® Type 6モジュール評価用キャリアボード
https://www.congatec.com/jp/products/login/formdownload/
