congatec Whitepapers

The economic value of the industrial robotics market is growing rapidly and is expected to reach $US 214.60 billion, with a 22.80% compound annual growth rate (CAGR) by 2030. This will be driven, in part, by the integration of new technologies like artificial intelligence (AI), which is expected to contribute $US 44.5 billion to this figure.

Data processing is surging in sectors like manufacturing, energy, and smart cities, creating a booming market for edge servers. According to Global Market Insights, this will create a $29 billion opportunity for near- and far-edge computing solutions by 2025 

Cyber attacks against industrial operations increased by 140% in 2022. Preventing such attacks is non-negotiable, but it can be a significant challenge for industrial operators.

Software functions define the capabilities of autonomous robots. Consolidating all functions on one system can help to make your designs more powerful, cost effective, and resilient. Learn what is possible and what to consider in our whitepaper.

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Etteplan Develops Next-Generation, All-in-One Evaluation Platform to Accelerate Customers’ Product Development

Three new computer-on-modules for high performance computing (COM-HPC) products from congatec bring the power of a server from the data center to the edge, including industrial environments and outdoor applications.

congatec’s COM-HPC module delivers the design flexibility and high performance needed to power AI, graphics, and other data-intensive applications driving modern healthcare systems.

The 12th generation Intel Core mobile and desktop processors have recently arrived in the embedded computing space, with implementations on the high-performance Computer-on-Module standards COM-HPC and COM Express.

With COM-HPC Server and Intel Xeon D technology, edge server installations are freed from the tight thermal constraints of climate-controlled server rooms.

congatec COM Express Type 6 modules with soldered memory for shock and vibration resistant applications.

IoT gateways and edge computers can hardly get enough cores. With AMD Ryzen™ Embedded V2000 processor technology and RTS hypervisor support OEMs can design a whole new class of IoT gateway applications.

COM-HPC is defines an interface specification for the out-of-band management of embedded system platforms. OEMs benefit from the ability to remotely monitor systems, install updates and patches, and resolve issues remotely without being physically present in the server room.

Embedded vision integration is critical to the success of AI-enabled systems, whether in self-driving vehicles, video surveillance, or collaborative robotics. Preconfigured embedded vision building blocks make it easy for developers to quickly create custom solutions. Read the full story here.

Built on 11th Gen Intel® Core™ processors, congatec’s conga-TS570 COM Express Type 6 and conga-HPC/cTLH COM-HPC Client modules bring near real- time performance, scalability, security, and resilience to a new class of edge computing applications.

Le elevate prestazioni sono sicuramente il tratto distintivo dei microserver e server embedded da utilizzare alla periferia della rete (edge). Chiunque voglia sviluppare sistemi scalabili ad alte prestazioni di questo tipo utilizzando i server-on-module progettati per l’uso in ambienti gravosi devono poter disporre di un ecosistema basato su moduli COM Express con pinout Type 7 che supportino il funzionamento in modalità fanless (ovvero senza ventole) con un TDP (che fornisce un’indicazione del calore dissipato da un microprocessore) massimo di 100 W.
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The way in which embedded integration is realized determines the success of AI-based systems in biomedical engineering applications – whether for diagnoses, defibrillators, or live images from minimally invasive surgery. Preconfigured embedded modules help developers find specific solutions for medical applications faster.

It’s a new era for high-end embedded processors that are now available on two COM form factors: The brand-new COM-HPC® Client and COM Express® Type 6. With the emergence of the 11th Gen Intel® Core® processor generation (codenamed Tiger Lake), developers now have the ability to choose the most appropriate form factor that best suits their project requirements.

congatec is expanding its SMARC platform with a new module with an NXP i.MX 8M Plus processor especially for embedded AI applications. Thanks to the extensive ecosystem with application-ready 3.5-inch carrier board, Basler cameras, and AI software stack, fast proof of concept is possible.

La visione artificiale tridimensionale non è sicuramente la tecnologia più semplice da utilizzare per il riconoscimento degli oggetti. Tuttavia, poiché si tratta della modalità più simile a quella utilizzata dall’occhio umano, la visione 3D trova spazio in molteplici applicazioni e viene utilizzata in misura sempre maggiore in abbinamento con l’apprendimento automatico.

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The growing need to lower latency and reduce energy-hungry data traffic over long distances is leading to rapidly rising deployment of server technology and data centers at the edge. Server-on-Modules based on the COM-HPC and COM Express standards offer a highly efficient design basis for this.

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Industrial edge server designs must be highly flexible to integrate the ability to perform diverse tasks. Increasingly, virtual machines are being used to consolidate a variety of
Industry 4.0 workloads. Learn more about hardware consolidation and modular edge computing

With the emergence of 5G technologies and the arrival of 10+ GbE networks in the industrial sector, real-time processing leveraging time-sensitive networking in tactile Internet environments is becoming an important new application area. What are the requirements for TSN-enabled edge computers?

Color video technology paired with artificial intelligence is a large development field for the future optimization of patient care. Mobile systems have an important role to play in this context, and OEMs need solutions that integrate embedded vision and embedded computer technology.

COM-HPC™ is the new and coming PICMG standard for high-performance Computer-on-Modules. The pinout and therefore also the functionality were recently officially approved. Elektronik is revealing further- details.

In questo articolo verranno illustrate le principali aree applicative di questi nuovi server-on-module di fascia alta ed evidenziate alcune limitazioni.

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COM-HPC is the upcoming new standard for modular high-end edge servers. It provides significantly faster and almost twice as many interfaces as COM Express. As a result, carrier board design requirements are increasing exponentially. How can developers prepare for the new challenges?

Computer-based vision is growing more and more important in robotic systems. But how do you fuse hard real-time applications and time-sensitive networking (TSN) with vision systems and artificial intelligence (AI)?

Sparse Modeling featuring slim but powerful artificial intelligence for embedded systems

Connecting their fleets to the clouds is a must for transport operators today. The Spanish
solution provider Datik is specialized in such cloud-based solutions for public transport.

The Service Robotics Research Center of Ulm University of Applied Sciences is developing
a modular software framework to make it easier to program robots. The goal is to provide
software components that can be used universally, for instance to swap robotic gripping
arms from different manufacturers as required to generate new robotics solutions via
plug and play.

Nel settore dell’automazione, accanto a IIoT (Industrial Internet of Things), Industry 4.0 e fabbriche “smart” basate su sistemi cyber-fisici, gli altri megatrend (ovvero le grandi mutazioni a livello sociale, tecnologico e ambientale) sono sicuramente la visione e l’intelligenza artificiale..

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Server processors are getting more and more energy efficient. Embedded application developers use them to boost performance, which also opens up completely new application fields for them. congatec supports such OEM designs with application-ready COM Express Type 7 modules and platforms.

SMARC 2.0 is the great new Computer-on-Modules standard for the efficient design of powerful and feature-rich small form factor (SFF) applications.

SMARC 2.0 - A New Standard to Bridge the Gap between Qseven and COM Express

With the coming of 5G technology and the implementation of 10+ GbE networks in factories, real-time data processing for OPC UA and other tactile Internet applications is emerging as an important new area of use.

In the past, electronic components were tailored to specific automotive platforms in order to reduce costs in series production. But in the cockpits of tomorrow, the days of proprietary controller platforms for dedicated functions are over; the future lies in clustering individual mobility functions by using universally applicable computing cores.

SMARC 2.0 modules stand out with their rich choice of graphics, camera, sound, network and optional wireless interfaces. The updated specification SMARC 2.1 extends this feature set even further. Two PCI Express lanes can be used alternatively as additional Ethernet ports. Extra two MIPI CSI interfaces and additional GPIOs also extends the possibilities of SMARC modules.