Webinar | Realtime and AI integration with COM-HPC
COM-HPC is a brand new PICMG standard optimized for modular system designs utilizing the latest high-speed interface technologies, such as PCIe Gen4, USB 4.0 and ultra-fast connectivity with up to 2x25 GbE, as well as integrated AI capabilities.
You can start new designs with congatec’s PICMG COM-HPC Computer-on-Modules based on the latest 11th Gen Intel Core vPro, Intel Xeon W-11000E, and Intel Celeron processors. They impress with integrated AI accelerators, up to 8 high-performance CPU cores and the integrated graphics. This enables you to seamlessly run AI and deep learning inference algorithms either massively parallel on the integrated GPU, or on the CPU with built-in Intel Deep Learning Boost.
As real-time support is mandatory for many target applications, you will also learn how to run RTOSes such as real-time Linux and Wind River VxWorks in parallel with multi-purpose OSes utilizing Real-Time Systems’ hypervisor technology, which is also officially supported by Intel.
So if your goal is to design real-time AI systems on the basis of the COM-HPC ecosystem, you should watch this webinar.
COM-HPC concept (10 min.)
Christian Eder, Chairman COM-HPC at the PICMG
11th Gen Intel Core processors based COM products (20 min.)
Andreas Bergbauer, Senior Product Line Manager at congatec
COM-HPC interface technology and design challenges (30 min.)
Christian Riesinger, Senior Field Application Engineer at congatec
Virtualization for consolidating deterministic real-time (20 min.)
Michael Reichlin, Manager WW Sales at Realtime Systems
Deep learning analytics & software tool kits (25 min.)
Roy Allela, Deep Learning SW Engineer at Intel
Q&A & Summary
Speaker
Christian Eder, congatec GmbH
Christian Eder is a cofounder and serves as director of marketing for EMEA at congatec. Christian – with his 30 years of experience in embedded computing – is the chairman of the COM-HPC workgroup of PICMG
Andreas Bergbauer, congatec GmbH
Andreas Bergbauer is Senior Product Manager at congatec and is responsible for the COM Express and COM HPC product lines.
Michael Reichlin, Real-Time-Systems GmbH
Michael Reichlin is Head of Sales & Marketing at RTS. The company specializes in consolidating deterministic real-time operating systems (RTOS) with other, less critical applications on a single hardware platform.
Roy Allela, Intel Corporation
Roy Allela is Senior Deep Learning Software Engineer focused on Computer Vision & AI at Intel Germany GmbH in Munich.
Christian Riesinger, congatec GmbH
Christian Riesinger is cofounder and Senior Field Application Engineer at congatec and responsible for the new COM-HPC formfactor.
More information about COM-HPC
COM-HPC carrier board designs
COM-HPC is the upcoming new standard for modular high-end edge servers. It provides significantly faster and almost twice as many interfaces as COM Express. As a result, carrier board design requirements are increasing exponentially. How can developers prepare for the new challenges?
COM HPC Server – the new Server-on-Module standard
What are the most important markets and applications for the new high-end Server-on-Modules and what are the limits?
COM-HPC: What developers and users need to know
The embedded computing industry is about to launch COM-HPC as the next-generation standard for modular system designs. Since COM-HPC is complex and sometimes
misunderstood, there is a need for clear information.
COM-HPC
COM-HPC™ is the new and coming PICMG standard for high-performance Computer-on-Modules. The pinout and therefore also the functionality were recently officially approved. Elektronik is revealing further- details.
