conga-UMX6/DC-1G eMMC4 (P/N 016202)
µQseven module with ultra low power, full featured NXP ARM® Cortex™ A9 i.MX6 1GHz Dual processor with 1MB L2 cache, 1GB onboard DDR3L memory and 4GB onboard eMMC. Commercial temperature range.
Your item has been added to the inquiry
conga-UMX6 (EOL)
μQseven module with up to NXP i.MX6 Dual ARM Cortex A9 processor
Selected module variant
Value adding ecosystem offerings
Cooling Solutions
Add-On Cards
conga-UMX6 (EOL)
μQseven module with up to NXP i.MX6 Dual ARM Cortex A9 processor
- Up to NXP i.MX6 Dual ARM Cortex A9
- Full HD multimedia performance HDMI & LVDS
- Extended longevity, 10+ years
- Temperature range up to -40°C .. +85°C
- End of Life
Specification
Formfactor
Qseven
CPU
NXP i.MX6 Solo ARM Cortex A9
(1 x 1.0 GHz, 512kB L2 cache, 3W)
NXP i.MX6 Dual ARM Cortex A9
(2 x 1.0 GHz, 1MB L2 cache, 3W)
NXP i.MX6 Dual Lite ARM Cortex A9
(2 x 1.0 GHz, 512kB L2 cache, 3W)
DRAM
Up to 1 GByte onboard DDR3 memory, 1066 MT/s
Ethernet
Gigabit Ethernet
I/O Interfaces
4 x USB 2.0
1 x SATA
1 x SDIO
1 x USB OTG client
1 x PCIe 2.0
1 x I²C bus
1 x CAN Bus
1 x SPI
Graphics
Integrated in NXP i.MX6 Series Video (VPU) | 2D Graphics (GPU2D) and 3D Graphics (GPU3D) | 3D graphics with 4 shaders up to 200MT/s dual stream 1080p/720p decoder/encoder. OpenGL | OpenCL and OpenVG 1.1
Temperature
Operating: 0 to +60°C commercial grade | -40 t o +85°C industrial grade / Storage: -40 to +85°C
Humidity
Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.
Video Interfaces
1 x DDI
LVDS 2x24
Size
70 x 40 mm (2¾” x 1¹/2”)
Documents
All documents found on this page are updated without notification. Always check this page for
the latest
version.
Data Sheet
15.09.2015
Manual
16.09.2016
Image
15.09.2015
15.09.2015
15.09.2015
Software
README for setting up Android 7.1.1
(Nougat) on conga-QMX6 and conga-UMX6
(Nougat) on conga-QMX6 and conga-UMX6
README for setting up Android 8.0.0
(Oreo) on conga-QMX6 and conga-UMX6
(Oreo) on conga-QMX6 and conga-UMX6
Sample image for conga-QMX6 and conga-UMX6 based on
Android 7.1.1 (Nougat)
Android 7.1.1 (Nougat)
Sample image for conga-QMX6 and conga-UMX6 based on
Android 8.0.0 (Oreo)
Android 8.0.0 (Oreo)
Application note for downloading and installing the NXP manufacturing tool and the manufcaturing profiles from the congatec git server.
Note to inform the change of providing the FslMfgTool
In order to access the conga-UMX6 source code repositories, please visit:
http://git.congatec.com/public
http://git.congatec.com/public
README for setting up Yocto 2.2(Morty) on conga-QMX6 and conga-UMX6 based on NXP yocto release
README for setting up Yocto 2.5(Sumo) on conga-QMX6 and conga-UMX6
Product Variants
conga-UMX6/DCL-1G eMMC4 (P/N 016201)
µQseven module with ultra low power, full featured NXP ARM® Cortex™ A9 i.MX6 1GHz DualCore Lite processor with 512kB L2 cache, 1GB onboard DDR3L memory and 4GB onboard eMMC. Commercial temperature range.
conga-UMX6/iDC-1G eMMC4 (P/N 016212)
µQseven module with ultra low power, full featured NXP ARM® Cortex™ A9 i.MX6 800MHz Dual coreprocessor with 1MB L2 cache, 1GB onboard DDR3L memory and 4GB onboard eMMC. Industrial grade temperature range from -40°C to 85°C.
conga-UMX6/iDCL-1G eMMC4 (P/N 016211)
µQseven module with ultra low power, full featured NXP ARM® Cortex™ A9 i.MX6 800MHz Dual Lite processor with 512kB L2 cache, 1GB onboard DDR3L memory and 4GB onboard eMMC. Industrial grade temperature range from -40°C to 85°C.
conga-UMX6/SC-1G eMMC4 (P/N 016200)
µQseven module with ultra low power, full featured Freescale ARM® Cortex™ A9 i.MX6 1GHz SingleCore processor with 512kB L2 cache, 1GB onboard DDR3L memory and 4GB onboard eMMC. Commercial temperature range.
Ecosystem Details
Cooling Solutions
conga-UMX6/HSP1-T (P/N 016250)
Standard heatspreader for conga-UMX6 module with Lidded FCBGA CPU.Stand-offs are with 2x M2.5 threaded and 2x borehole 2,7mm variants.
conga-UMX6/HSP2-T (P/N 016251)
Standard heatspreader for conga-UMX6 module with MAPBGA CPU.Stand-offs are with 2x M2.5 threaded and 2x borehole 2,7mm variants.
conga-UMX6/HSP3-T (P/N 016252)
Standard heatspreader for conga-UMX6 module with Non-Lidded FCBGA CPU.Stand-offs are with 2x M2.5 threaded and 2x borehole 2,7mm variants.
Add-On Cards
conga-Qseven/MFG-Serial-Adapter (P/N 011127)
MFG-header adapter on the QEV2 baseboard for RS-232 console-communication with UMX6 / QMX6.
This adapter provides the ability to access the console in/output of the conga-QMX6 and mainly the conga-UMX6 product family (due to the fact that there isn't any console-connector on the conga-UMX6 module) via the MFG-header on the congatec part number 007005 conga-QEVAL/Qseven 2.0 ARM evaluation carrier board.
Accessories
conga-LDVI
DVI Converter Module for LVDS
conga-QEVAL/Qseven 2.0
Per ottenere un avvio rapido con Qseven, congatec offre una scheda carrier di valutazione, che indirizza tutti i segnali Qseven ® ai connettori di interfaccia standard.
conga-QKIT/ARM (EOL)
This complete kit provides the ability to start evaluating Qseven® ARM modules immediately
conga-QKIT/ARM (EOL)
Questo kit completo offre la possibilità di iniziare a valutare immediatamente i moduli Qseven ARM ®
conga-LDVI
Covertitore di moduli DVI perLVDS
conga-QEVAL/Qseven 2.0
To achieve a quick start with Qseven congatec offers an evaluation carrier board, which routes all the Qseven® signals to standard interface connectors.
https://www.congatec.com/it/prodotti/login/formdownload/
