COM Express Type 6 Basic module with Coffeelake-H Refresh Intel® Core™ i7-9850HE, 45W hexa core processor with 2.7GHz, 9MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface. Chipset QM370. TPM 2.0.
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conga-TS370
COM Express Type 6 Basic module based on 8th Generation Intel® Core™ processor family
- 8th Generation Intel® Core™ processor with up to 6 Cores
- Intel® Xeon® processors for data center applications
- Support for USB 3.1 Gen2 with 10Gbit/s
- Intel® Optane™ memory support
- ECC memory support
- Up to 64 GByte dual channel DDR4 memory
Value adding ecosystem offerings

Cooling Solutions

Memory

Carrierboards

Module services
Specification
up to three independent displays: DDI / DisplayPort 1.2 / eDP 1.4 | MPEG-2 , WMV9 (VC-1), H.265 decoding | HEVC, VP9 encoding
-25 to +80°C (burn-in & cold-soak) | -40 to +85°C (burn-in & cold-soak)
Documents
Data Sheet
Software
Use for BIOS update or customization and panel configuration. Linux source version.
Important note: Only compatible with cgos 1.03.032 and older!
Important note: Only compatible with cgos 1.03.032 and older!
Important note: Only compatible with cgos 1.03.032 and older!
Product Variants
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- 118W W
- 135W W
- Ubuntu Linux LTS
- Microsoft® Windows 11 IoT Enterprise
- RTOS
- QNX
- Microsoft® Windows 11
- Microsoft® Windows IoT 10 Core
- Microsoft® Windows 10 IoT Enterprise
- Microsoft® Windows® 10 (64bit only)
- Microsoft® Windows® 10
- Microsoft® Windows 10 Enterprise
- Microsoft® Windows 10 Core Pro
- Microsoft® Windows® 7
- Android
- Linux
- Yocto
- Microsoft® Windows® XP
- Microsoft® Windows® embedded Standard
- Microsoft® Windows® CE 6.0
- Microsoft® Windows® CE 7.0
- Embedded POS Ready
- Windows Embedded Compact 7
- Microsoft Windows 8 embedded
- Microsoft® Windows® 8.1
- BSPs with OS drivers and tools
- Microsoft® Windows® 7/8 embedded Standard
- Microsoft® Windows Server 2016
- RHEL 6.8 & 7.2
- SUSE 12 SP1
- Fedora 22
- Ubuntu 14.10
- CentOS 6.6 & 7.1
- FreeBSD 10.3 & 11
- Yocto v2.0 (Jethro), Kernel 4.1
- VMware
- Microsoft® Windows Server 2012 R2
- Microsoft® Windows Server 2012
- Microsoft® Windows Server 2008 R2 SP1
- RHEL 6.6 & 7.1
- SuSE 11 SP4 & 12 SP1
- Yocto v.2.0 Kernel 4.1
- Wind River VxWorks 7
- ESXi
- Microsoft® Windows IoT Core
- Microsoft® Windows 10 (64bit only)
- Fedora 24
- Ubuntu
- SuSe
- Red Hat Enterprise
- Yocto Project v2.2
- Chromium 2
- Wind River VxWorks
- Microsoft® Windows 10 IoT Enterprise (64bit only)
- RTS Hypervisor
If you don't find the configuration you require contact your congatec Sales representative for further assistance.
COM Express Type 6 Basic module with Coffeelake-H Refresh Intel® Core™ i7-9850HL, 25W hexa core processor with 1.9GHz, 9MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface. Chipset QM370. TPM 2.0.
COM Express Type 6 Basic module with Coffeelake-H Refresh Intel® Core™ i3-9100HL, 25W quad core processor with 1.6GHz, 6MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface. Chipset HM370. TPM 2.0.
COM Express Type 6 Basic module with Coffeelake-H Refresh Intel® Xeon® Processor E-2276ME, 45W hexa core processor with 2.8GHz, 12MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface with ECC support. Chipset CM246. TPM 2.0.
COM Express Type 6 Basic module with Coffeelake-H Refresh Intel® Xeon® Processor E-2276ML, 25W hexa core processor with 2.0GHz, 12MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface with ECC support. Chipset CM246. TPM 2.0.
COM Express Type 6 Basic module with Coffeelake-H Refresh Intel® Xeon® Processor E-2254ME, 45W quad core processor with 2.6GHz, 8MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface with ECC support. Chipset CM246. TPM 2.0.
COM Express Type 6 Basic module with Coffeelake-H Refresh Intel® Xeon® Processor E-2254ML, 25W quad core processor with 1.7GHz, 8MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface with ECC support. Chipset CM246. TPM 2.0.
COM Express Type 6 Basic module with Coffeelake-H Refresh Intel® Celeron® Processor G4930E, 35W dual core processor with 2.4GHz, 2MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface. Chipset HM370. TPM 2.0.
COM Express Type 6 Basic module with Coffeelake-H Refresh Intel® Celeron® Processor G4932E, 25W dual core processor with 1.9GHz, 2MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface. Chipset HM370. TPM 2.0.
COM Express Type 6 Basic module with Coffeelake-H Intel® Core™ i7-8850H hexa core processor with 2.6GHz, 9MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface. Chipset QM370. TPM 2.0.
COM Express Type 6 Basic module with Coffeelake-H Intel® Core™ i5-8400H quad core processor with 2.5GHz, 8MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface. Chipset QM370. TPM 2.0.
COM Express Type 6 Basic module with Coffeelake-H Intel® Core™ i3-8100H quad core processor with 3.0GHz, 6MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface. Chipset HM370. TPM 2.0.
COM Express Type 6 Basic module with Coffeelake-H Intel® Xeon® Processor E-2176M, hexa core processor with 2.7GHz, 12MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface with ECC support. Chipset CM246. TPM 2.0.
Ecosystem Details
Cooling Solutions
Standard active cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
Standard active cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.
Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All standoffs are with 2.7mm bore hole.
Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All standoffs are M2.5mm thread.
Standard heatspreader for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes. All standoffs are with 2.7mm bore hole.
Standard heatspreader for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes. All standoffs are M2.5mm thread.
Memory
DDR4 SODIMM memory module with 2666 MT/s and 4GB RAM
DDR4 SODIMM memory module with 2666 MT/s and 8GB RAM
DDR4 SODIMM memory module with 2666 MT/s and 16GB RAM
DDR4 SODIMM memory module with 2666 MT/s and 32GB RAM
DDR4 ECC SODIMM memory module with 2666 MT/s and 4GB RAM
DDR4 ECC SODIMM memory module with 2666 MT/s and 8GB RAM
DDR4 ECC SODIMM memory module with 2666 MT/s and 16GB RAM
DDR4 ECC SODIMM memory module with 2666 MT/s and 32GB RAM
Carrierboards
Evaluation Carrier Board for COM Express Type 6 Modules.
Module services
Design-Training to develop carrier boards for Computer on Modules
HumiSeal® 1A33 coating for COM Express Basic and Compact modules; MIL-I-46058C qualified, IPC-CC-830 and
RoHS Directive 2002/95/EC compliant and recognized under UL File Number E105698.
congatec Wide Temperature Range Screening
Standard screening profile with 12h temperature screening and cold soak test
Including functional test and several boot-ups (before & after screening)
congatec Wide Temperature Range Screening
Standard screening profile with 12h temperature screening and cold soak test
Including functional test and several boot-ups (before & after screening)
Accessories
conga-TEVAL/COMe 3.0
Evaluation Carrier Board for COM Express® Type 6 Modules Rev. 3.0
conga-IT6 (EOL)
COM Express Type 6 Carrier Board on Mini-ITX form factor