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conga-TS370

COM Express Type 6 Basic module based on 8th Generation Intel® Core™ processor family

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            conga-TS370

            COM Express Type 6 Basic module based on 8th Generation Intel® Core™ processor family

            • 8th Generation Intel® Core™ processor with up to 6 Cores
            • Intel® Xeon® processors for data center applications
            • Support for USB 3.1 Gen2 with 10Gbit/s
            • Intel® Optane™ memory support
            • ECC memory support
            • Up to 64 GByte dual channel DDR4 memory
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            Specification

            Formfactor
            COM Express Basic
            CPU
            Intel® Xeon® E-2176M (6 x 2.7 GHz, 12MB cache, 45W)
            Intel® Xeon® E-2276ME (6 x 2.8 GHz, 12MB cache, 45W)
            Intel® Xeon® E-2254ME (4 x 2.6 GHz, 8MB cache, 45W)
            Intel® Xeon® E-2276ML (6 x 2.0 GHz, 12MB cache, 25W)
            Intel® Xeon® E-2254ML (4 x 1.7 GHz, 8MB cache, 25W)
            Intel® Core™ i7-8850H (6 x 2.6 GHz, 9MB cache, 45W)
            Intel® Core™ i7-9850HE (6 x 2.7 GHz, 9MB cache, 45W)
            Intel® Core™ i7-9850HL (6 x 1.9 GHz, 9MB cache, 25W)
            Intel® Core™ i5-8400H (4 x 2.5 GHz, 8MB cache, 45W)
            Intel® Core™ i3-8100H (4 x 3.0 GHz, 6MB cache, 45W)
            Intel® Core™ i3-9100HL (4 x 1.6 GHz, 6MB cache, 25W)
            Intel® Celeron® G4930E (2 x 2.4 GHz, 2MB cache, 35W)
            Intel® Celeron® G4932E (2 x 1.9 GHz, 2MB cache, 25W)
            DRAM
            Dual channel DDR4 up to 2666 MT/s | 2x SO-DIMM | up to 2x 32 GByte (optionally with ECC support for Intel® Xeon®)
            Ethernet
            Intel® i219-LM GbE LAN Controller with AMT 12.0 support
            I/O Interfaces
            8 x PCI Express GEN 3.0 lanes
            4 x Serial ATA Gen 3
            4 x USB 3.1 Gen 2 @ 10 GBit/s
            8 x USB 2.0
            1 x PEG x16 Gen 3
            LPC bus
            I²C bus (fast mode, 400 kHz, multi-master)
            2 x UART
            Graphics
            Intel® Gen9 HD Graphics Engine with OpenCL 2.0, OpenGL 4.3/4.4 and DirectX 11/12
            up to three independent displays: DDI / DisplayPort 1.2 / eDP 1.4 | MPEG-2 , WMV9 (VC-1), H.265 decoding | HEVC, VP9 encoding
            congatec Board Controller
            Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | LVDS backlight control I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control
            embedded BIOS Features
            AMI AptioV® UEFI 2.x firmware
            32 MByte serial SPI firmware flash
            Security
            TPM 2.0 Infineon SLB9665
            Power Management
            ACPI 4.0 with battery support
            Operating Systems
            Microsoft® Windows 10 (64bit only)
            Microsoft® Windows 10 IoT Enterprise (64bit only)
            Linux
            Temperature
            Commercial: Operating: 0 .. +60°C | Storage: -40 .. +85°C
            Extended Temperature
            Screening service on request:
            -25 to +80°C (burn-in & cold-soak) | -40 to +85°C (burn-in & cold-soak)
            Humidity
            Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.
            Video Interfaces
            3x DDI / DisplayPort 1.2 with support for Multi-Stream Transport (MST) | resolutions up to 4k
            Dual channel LVDS transmitter, Supports flat panels 2x24 Bit interface | VESA and openLDI colour mappings | resolutions up to 1920x1200 Automatic Panel Detection via EDID/EPI
            1 x VGA
            Size
            95 x 125 mm (3.74" x 4.92")

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