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conga-TFS (EOL)
Piattaforma embedded AMD serie R su modulo COM Express di tipo 6 con prestazioni grafiche senza precedenti
- Elaborazione x86 ad alte prestazioni e ad efficienza energetica
- Capacità grafiche integrate senza precedenti
- Supporto di elaborazione parallela ad alte prestazioni
Specification
It is capable of calculating efficient hash and RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and e commerce will benefit also with improved authentication, integrity and confidence levels.
ACPI 3.0 compliant, Smart Battery Management
Operating: 0 to +60°C Storage: -20 to +80°C
Documents
Image
Manual
Data Sheet
Software
Product Variants
Ecosystem Details
Carrierboards
Evaluation Carrier Board for COM Express Type 6 Modules.
Memory
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 8GB RAM.
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 4GB RAM.
DDR3L SODIMM memory module with 1600MT/s (PC3L-12800S) and 2GB RAM.
Cooling Solutions
Standard active cooling solution for high performance COM Express module conga-TFS with integrated vapor chamber, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.
Standard active cooling solution for high performance COM Express module conga-TFS with integrated vapor chamber, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
Standard heatspreader for high performance COM Express module conga-TFS with integrated vapor chamber. All standoffs are M2.5mm thread.
Standard heatspreader for high performance COM Express module conga-TFS with integrated vapor chamber. All standoffs are with 2.7mm bore hole.
Accessories
conga-Cdebug (EOL)
Piattaforma COM Express® Debug per Muduli Type 2 e Schede Carrier
conga-LDVI
Covertitore di moduli DVI perLVDS
conga-TEVAL/COMe 2.1 (EOL)
Scheda Carrier di valutazione per i Moduli COM Express® Type 6