conga-TC570r Preview image
  • conga-TC570r Image 1
  • conga-TC570r Image 2
  • conga-TC570r - New ultra-rugged 11th Gen Intel® Core® congatec modules with soldered RAM

Your item has been added to the inquiry

conga-TC570r Image

conga-TC570r

COM Express Type 6 Compact module based on 11th Gen Intel® Core™ processor family (code name "Tiger Lake") and soldered down memory

Selected module variant

    Selected ecosystem parts

    Cooling Solutions

      Memory

        Carrierboards

          Module services

            Value adding ecosystem offerings


            Cooling Solutions

            Memory

            Carrierboards

            Module services

            conga-TC570r

            COM Express Type 6 Compact module based on 11th Gen Intel® Core™ processor family (code name "Tiger Lake") and soldered down memory

            Virtualization Ready
            • Embedded/Industrial use condition
            • Extended temperature options available
            • PCI Express Gen 4
            • Up to 32 GByte dual channel LPDDR4X soldered down memory with 4266 MT/ s IBECC
            • AI/DL Instruction Sets including VNNI
            • Product video
            Congatec Logo
            Do you want to add further ecosystem parts (carrier boards, memory,...) to your request?

            Value adding ecosystem offerings

            Cooling Solutions

            Memory

            Carrierboards

            Module services

            Specification

            Formfactor
            COM Express Compact
            CPU
            Intel® Celeron® 6305E (2 x 1.8 GHz, 4MB cache, 15W)
            Intel® Core™ i7-1185GRE (4 x 1.8 GHz, 12 MB cache, 15W)
            Intel® Core™ i5-1145GRE (4 x 1.5 GHz, 8 MB cache, 15W)
            Intel® Core™ i3-1115GRE (2 x 2.2 GHz, 6 MB cache, 15W)
            DRAM
            Up to 32 GByte LPDDR4X 4266MT/s SDRAM | memory down | dual channel IBECC
            Ethernet
            1 x 2.5 GbE with TSN support via Intel® i226 Ethernet controller series
            I/O Interfaces
            8 x PCI Express GEN 3.0 lanes
            PEG support x4 (PCIe Gen4)
            4 x USB 3.1 Gen2
            8 x USB 2.0
            2 x SATA III (6Gb/s)
            SPI
            2 x UART
            8 x GPIOs
            Graphics
            Integrated Xe (Gen 12) graphics engine with up to 96 EU (Execution Units) | Supporting 4 independent display units (4x 4k/2x 8K) | Enhanced media (AV1/12b) with up to 2 Vdbox | Next Gen IPU6 with DPHY2.1 | DP 1.4
            congatec Board Controller
            Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection
            Security
            Trusted Platform Module (TPM 2.0)
            Power Management
            ACPI 5.0 with battery support
            Hypervisor
            RTS Real-Time Hypervisor
            Temperature
            Industrial: Operating: -40 to +85°C | Storage: -40 to +85°C
            Commercial: Operating: 0 to +60°C | Storage: -40 to +85°C
            Humidity
            Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.
            Video Interfaces
            3x DDI/DP++ | eDP/LVDS | VGA (optional)
            Size
            95 x 95 mm (3,74" x 3,74")

            Documents

            Software

            Product Variants

            Ecosystem Details

            Accessories