COM Express Type 6 Compact module based on Intel® Core™ i7-1185GRE 4-core processor with 1.8GHz up to 4.4GHz turbo boost, 12MB cache, Intel® Iris® Xe Graphics with 96EU and 32 GBytedual channel LPDDR4X 4266 MT/s memory down (Intel Tiger Lake). Industrial temperature range.
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conga-TC570r
COM Express Type 6 Compact module based on 11th Gen Intel® Core™ processor family (code name "Tiger Lake") and soldered down memory
Selected ecosystem parts

Cooling Solutions

Memory

Carrierboards

Module services
Value adding ecosystem offerings

Cooling Solutions

Memory

Carrierboards

Module services
conga-TC570r
COM Express Type 6 Compact module based on 11th Gen Intel® Core™ processor family (code name "Tiger Lake") and soldered down memory
- Embedded/Industrial use condition
- Extended temperature options available
- PCI Express Gen 4
- Up to 32 GByte dual channel LPDDR4X soldered down memory with 4266 MT/ s IBECC
- AI/DL Instruction Sets including VNNI
- Product video
Value adding ecosystem offerings

Cooling Solutions

Memory

Carrierboards

Module services
Specification
Commercial: Operating: 0 to +60°C | Storage: -40 to +85°C
Documents
Data Sheet
Other
Manual
Software
Use for BIOS update or customization and panel configuration. Linux source version.
Important note: Only compatible with cgos 1.03.032 and older!
Important note: Only compatible with cgos 1.03.032 and older!
Important note: Only compatible with cgos 1.03.032 and older!
Important note: Only compatible with cgos 1.03.032 and older!
Product Variants
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- 9.5W W
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- 85W W
- 100W W
- 100W W
- 100W W
- 118W W
- 135W W
- Ubuntu Linux LTS
- Microsoft® Windows 11 IoT Enterprise
- RTOS
- QNX
- Microsoft® Windows 11
- Microsoft® Windows IoT 10 Core
- Microsoft® Windows 10 IoT Enterprise
- Microsoft® Windows® 10 (64bit only)
- Microsoft® Windows® 10
- Microsoft® Windows 10 Enterprise
- Microsoft® Windows 10 Core Pro
- Microsoft® Windows® 7
- Android
- Linux
- Yocto
- Microsoft® Windows® XP
- Microsoft® Windows® embedded Standard
- Microsoft® Windows® CE 6.0
- Microsoft® Windows® CE 7.0
- Embedded POS Ready
- Windows Embedded Compact 7
- Microsoft Windows 8 embedded
- Microsoft® Windows® 8.1
- BSPs with OS drivers and tools
- Microsoft® Windows® 7/8 embedded Standard
- Microsoft® Windows Server 2016
- RHEL 6.8 & 7.2
- SUSE 12 SP1
- Fedora 22
- Ubuntu 14.10
- CentOS 6.6 & 7.1
- FreeBSD 10.3 & 11
- Yocto v2.0 (Jethro), Kernel 4.1
- VMware
- Microsoft® Windows Server 2012 R2
- Microsoft® Windows Server 2012
- Microsoft® Windows Server 2008 R2 SP1
- RHEL 6.6 & 7.1
- SuSE 11 SP4 & 12 SP1
- Yocto v.2.0 Kernel 4.1
- Wind River VxWorks 7
- ESXi
- Microsoft® Windows IoT Core
- Microsoft® Windows 10 (64bit only)
- Fedora 24
- Ubuntu
- SuSe
- Red Hat Enterprise
- Yocto Project v2.2
- Chromium 2
- Wind River VxWorks
- Microsoft® Windows 10 IoT Enterprise (64bit only)
- RTS Hypervisor
If you don't find the configuration you require contact your congatec Sales representative for further assistance.
COM Express Type 6 Compact module based on Intel® Core™ i5-1145GRE 4-core processor with 1.5GHz up to 4.1GHz turbo boost, 8MB cache, Intel® Iris® Xe Graphics with 80EU and 16GByte dual channel LPDDR4X 4266 MT/s memory down (Intel Tiger Lake). Industrial temperature range.
COM Express Type 6 Compact module based on Intel® Core™ i3-1115G4E 2-core processor with 2.2GHz up to 3.9GHz turbo boost, 6MB cache, Intel® UHD Graphics with 48EU and 8 GBytedual channel LPDDR4X 4266 MT/s memory down (Intel Tiger Lake). Industrial temperature range.
COM Express Type 6 Compact module based on Intel® Celeron® 6305E2-core processor with 1.8GHz, 4MB cache, Intel® UHD Graphics with 48EU and 4 GBytedual channel LPDDR4X 4266 MT/s memory down (Intel Tiger Lake). Commercial temperature range.
Ecosystem Details
Cooling Solutions
Standard active cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
Standard active cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.
Standard passive cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are with 2.7mm bore hole.
Standard passive cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are M2.5mm thread.
Standard heatspreader for high performance COM Express module conga-TC570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole.
Standard heatspreader for high performance COM Express module conga-TC570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are M2.5mm thread.
Memory
DDR4 SODIMM memory module with 3200 MT/s and 4GB RAM
DDR4 SODIMM memory module with 3200 MT/s and 8GB RAM
DDR4 SODIMM memory module with 3200 MT/s and 16GB RAM
DDR4 SODIMM memory module with up to 3200 MT/s and 4GB RAM, industrial temp -40°C to +85°C
DDR4 SODIMM memory module with up to 3200 MT/s and 16GB RAM, industrial temp -40°C to +85°C
Carrierboards
Evaluation carrier board for COM Express Type6 Rev. 3.0 modules.
Module services
Design-Training to develop carrier boards for Computer on Modules
HumiSeal® 1A33 coating for COM Express Basic and Compact modules; MIL-I-46058C qualified, IPC-CC-830 and
RoHS Directive 2002/95/EC compliant and recognized under UL File Number E105698.
congatec Wide Temperature Range Screening
Standard screening profile with 12h temperature screening and cold soak test
Including functional test and several boot-ups (before & after screening)
congatec Wide Temperature Range Screening
Standard screening profile with 12h temperature screening and cold soak test
Including functional test and several boot-ups (before & after screening)
Accessories
conga-TEVAL/COMe 3.0
Evaluation Carrier Board for COM Express® Type 6 Modules Rev. 3.0