How to design robotic brains
The economic value of the industrial robotics market is growing rapidly and is expected to reach $US 214.60 billion, with a 22.80% compound annual growth rate (CAGR) by 2030. This will be driven, in part, by the integration of new technologies like artificial intelligence (AI), which is expected to contribute $US 44.5 billion to this figure.
Adapting industrial edge servers to evolving markets
Data processing is surging in sectors like manufacturing, energy, and smart cities, creating a booming market for edge servers. According to Global Market Insights, this will create a $29 billion opportunity for near- and far-edge computing solutions by 2025
Ensuring cybersecurity at the industrial edge
Cyber attacks against industrial operations increased by 140% in 2022. Preventing such attacks is non-negotiable, but it can be a significant challenge for industrial operators.
System consolidation in autonomous mobile robots
Software functions define the capabilities of autonomous robots. Consolidating all functions on one system can help to make your designs more powerful, cost effective, and resilient. Learn what is possible and what to consider in our whitepaper.
Etteplan Evaluation Platform leverages congatec Computer-on-Modules (COMs)
Etteplan Develops Next-Generation, All-in-One Evaluation Platform to Accelerate Customers’ Product Development
COM-HPC Intel Xeon D Solution Brief
Three new computer-on-modules for high performance computing (COM-HPC) products from congatec bring the power of a server from the data center to the edge, including industrial environments and outdoor applications.
Solution Brief: COM-HPC for Medical Applications
congatec’s COM-HPC module delivers the design flexibility and high performance needed to power AI, graphics, and other data-intensive applications driving modern healthcare systems.
12th Gen Intel Core Computer-on-Modules
The 12th generation Intel Core mobile and desktop processors have recently arrived in the embedded computing space, with implementations on the high-performance Computer-on-Module standards COM-HPC and COM Express.
Intel Xeon D processors on COM-HPC Server-on-Modules
With COM-HPC Server and Intel Xeon D technology, edge server installations are freed from the tight thermal constraints of climate-controlled server rooms.
Rugged Computer-on-Modules
congatec COM Express Type 6 modules with soldered memory for shock and vibration resistant applications.
Multitasking at the edge
IoT gateways and edge computers can hardly get enough cores. With AMD Ryzen™ Embedded V2000 processor technology and RTS hypervisor support OEMs can design a whole new class of IoT gateway applications.
Remote management made easy
COM-HPC is defines an interface specification for the out-of-band management of embedded system platforms. OEMs benefit from the ability to remotely monitor systems, install updates and patches, and resolve issues remotely without being physically present in the server room.
NPU-trained eyes
Embedded vision integration is critical to the success of AI-enabled systems, whether in self-driving vehicles, video surveillance, or collaborative robotics. Preconfigured embedded vision building blocks make it easy for developers to quickly create custom solutions. Read the full story here.
11th Gen Intel Core Solution Brief
Built on 11th Gen Intel® Core™ processors, congatec’s conga-TS570 COM Express Type 6 and conga-HPC/cTLH COM-HPC Client modules bring near real- time performance, scalability, security, and resilience to a new class of edge computing applications.
Maximum performance for COM Express Type 7 servers
Embedded edge servers and microservers need high performance. Anyone wanting to develop such high-performance systems scalably with server-on-modules for harsh environments needs an ecosystem based on COM Express Type 7 with fanless support for TDPs of up to 100 W.
Human-Like Cognition with a NPU for Enhanced Patient Care
The way in which embedded integration is realized determines the success of AI-based systems in biomedical engineering applications – whether for diagnoses, defibrillators, or live images from minimally invasive surgery. Preconfigured embedded modules help developers find specific solutions for medical applications faster.
COM Express Type 6 et COM-HPC Client
Pour la première fois depuis de nombreuses années, des processeurs embarqués haut de gamme sont disponibles sur deux formats de Computer-on-Module, COM-HPC® Client et COM Express® Type 6. L’arrivée des processeurs Intel® Core® de 11e génération (nom de code Tiger Lake) offre aux développeurs la possibilité de décider quel format correspond le mieux aux exigences de leur projet.
Download Whitepaper
SMARC modules with NXP i.MX 8M Plus Processor
congatec is expanding its SMARC platform with a new module with an NXP i.MX 8M Plus processor especially for embedded AI applications. Thanks to the extensive ecosystem with application-ready 3.5-inch carrier board, Basler cameras, and AI software stack, fast proof of concept is possible.
COM-HPC modules accelerate machine vision
Three-dimensional machine vision is admittedly not the simplest of technologies to recognize things. However, because it is closest to the human eye, 3D vision has a wide range of applications and is increasingly being used alongside machine learning.
Embedded server modules for edge data centers
The growing need to lower latency and reduce energy-hungry data traffic over long distances is leading to rapidly rising deployment of server technology and data centers at the edge. Server-on-Modules based on the COM-HPC and COM Express standards offer a highly efficient design basis for this.
The edge is modular
Industrial edge server designs must be highly flexible to integrate the ability to perform diverse tasks. Increasingly, virtual machines are being used to consolidate a variety of
Industry 4.0 workloads. Learn more about hardware consolidation and modular edge computing
Importance des réseaux Ethernet temps réel pour l’IIoT
Avec l’émergence des technologies 5G et l’arrivée des réseaux GbE 10+ dans le secteur industriel, le traitement en temps réel tirant parti des réseaux sensibles au temps dans les environnements Internet tactile est en train de devenir un nouveau domaine d’application important. Quelles sont les exigences requises pour les ordinateurs de périphérie compatibles TSN?
Zoom sur les appareils mobiles
La technologie vidéo en couleur associée à l’intelligence artificielle est un vaste domaine de
développement pour l’optimisation future des soins aux patients. Les systèmes mobiles ont
un rôle important à jouer dans ce contexte, et les OEM ont besoin de solutions qui intègrent
la vision et la technologie informatique embarquées.
Conception des cartes porteuses COM-HPC
COM-HPC est la nouvelle norme à venir pour les serveurs périphériques modulaires haut de gamme. Il offre des interfaces nettement plus rapides et presque deux fois plus nombreuses que COM Express. Par conséquent, les exigences de conception des cartes porteuses augmentent fortement. Comment les développeurs se préparent à relever ces nouveaux défis ?
AI vision platform for robotics
Computer-based vision is growing more and more important in robotic systems. But how do you fuse hard real-time applications and time-sensitive networking (TSN) with vision systems and artificial intelligence (AI)?
Hacarus AI
Sparse Modeling featuring slim but powerful artificial intelligence for embedded systems
Driving fleets into the cloud
Connecting their fleets to the clouds is a must for transport operators today. The Spanish
solution provider Datik is specialized in such cloud-based solutions for public transport.
Modules for cooperative robotics
The Service Robotics Research Center of Ulm University of Applied Sciences is developing
a modular software framework to make it easier to program robots. The goal is to provide
software components that can be used universally, for instance to swap robotic gripping
arms from different manufacturers as required to generate new robotics solutions via
plug and play.
De gros gains de performances pour les environnements hostiles
Les processeurs pour serveurs deviennent de plus en plus efficaces sur le plan énergétique. Les développeurs d’applications embarquées les utilisent pour améliorer les performances, ce qui leur ouvre également des champs d’application totalement nouveaux.
Device development with SMARC 2.0
SMARC 2.0 is the great new Computer-on-Modules standard for the efficient design of powerful and feature-rich small form factor (SFF) applications.
SMARC 2.0 Whitepaper
SMARC 2.0 - A New Standard to Bridge the Gap between Qseven and COM Express
Real-time capable Ethernet becomes standard
With the coming of 5G technology and the implementation of 10+ GbE networks in factories, real-time data processing for OPC UA and other tactile Internet applications is emerging as an important new area of use.
Computing Core Standard for Mobility IT
In the past, electronic components were tailored to specific automotive platforms in order to reduce costs in series production. But in the cockpits of tomorrow, the days of proprietary controller platforms for dedicated functions are over; the future lies in clustering individual mobility functions by using universally applicable computing cores.
SMARC 2.1 Whitepaper
SMARC 2.0 modules stand out with their rich choice of graphics, camera, sound, network and optional wireless interfaces. The updated specification SMARC 2.1 extends this feature set even further. Two PCI Express lanes can be used alternatively as additional Ethernet ports. Extra two MIPI CSI interfaces and additional GPIOs also extends the possibilities of SMARC modules.
