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conga-HPC/cBLS

COM-HPC Client Size C high performance module based on 13th Gen Intel® Core™ 2xx series (code name "Bartlett Lake-S")

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Value adding ecosystem offerings


Virtualization

Operating Systems

Cooling Solutions

Carrierboards

Memory

Module services

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conga-HPC/cBLS

COM-HPC Client Size C high performance module based on Intel® Core™ processor (series 2) (formerly codenamed: Bartlett Lake S)

Virtualization Ready
  • Intel® hybrid design combines Performance-cores with Efficient–cores
  • Up to Intel® UHD Graphics 770 driven by Xe Architecture
  • PCI Express Gen 4 and 5 | USB 3.2 Gen 2x2
  • AI Acceleration based on Intel® Deep Learning Boost (VNNI)
  • Read the press release here
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Do you want to add further ecosystem parts (carrier boards, memory,...) to your request?

Value adding ecosystem offerings

Virtualization

Operating Systems

Cooling Solutions

Carrierboards

Memory

Module services

Specification

Formfactor
COM-HPC
CPU
Intel® Core™ 3 201E (4 P-cores 3.6 GHz up to 4.8 GHz, 12MB cache)
Intel® Core™ 5 211E (6 P-cores 2.7 GHz up to 4.9 GHz, 4 E-cores 2.0 GHz up to 3.7 GHz, 20MB cache)
Intel® Core™ 7 251E (8 P-cores 2.1 GHz up to 5.6 GHz, 16 E-cores 1.6 GHz up to 4.4 GHz, 36MB cache)
DRAM
4 SO-DIMM sockets for DDR5 memory modules up to 32 GByte each | max. 128 GByte RAM system capacity |up to 4.000 MT/s | ECC Support on selected product variants
Ethernet
2 x 2.5 GbE with TSN support via Intel® i226 Ethernet controller series
I/O Interfaces
1x16 PCIe Gen 5 (PEG port)
3x4 PCIe Gen 4
up to 3x4 PCIe Gen 3
1x2 PCIe Gen3
4 x USB 3.2 Gen2x2
8 x USB 2.0
2 x SATA
2 x UART
12 x GPIOs
Graphics
Up to Intel® UHD Graphics 770 driven by Xe Architecture | up to 32 EU
congatec Board Controller
Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection
embedded BIOS Features
AMI Aptio UEFI
32 Mbyte serial SPI with congatec Embedded BIOS feature
OEM Logo
OEM CMOS Defaults
LCD Control
Display Auto Detection
Backlight Control
Flash Update
Security
Trusted Platform Module (TPM 2.0)
Power Management
ACPI 5.0a with battery support
Operating Systems
Microsoft® Windows 11
Microsoft® Windows 11 IoT Enterprise
Microsoft® Windows® 10
Microsoft® Windows 10 IoT Enterprise
Linux
Yocto
Hypervisor
RTS Real-Time Hypervisor
Temperature
Operating: 0°C to 60°C
Storage: -20°C to 80°C
Humidity
Operating: 10 to 85% r. H. non cond. / Storage 5 to 85% r. H. non cond.
Video Interfaces
3x DDI | eDP
Size
120 x 160 mm

Documents

All documents found on this page are updated without notification. Always check this page for the latest version.

Other

Data sheet for conga-HPC/cBLS
02.12.2024

Product Variants

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    There are 1,000's of possible configurations of our products, and therefore every possible configuration may not be shown with this tool.
    If you don't find the configuration you require contact your congatec Sales representative for further assistance.
    conga-HPC/cBLS-7-251E (P/N 049820)

    COM-HPC Client module based on Intel® Core™ 7-251E LGA 1700 processor with 8 P-cores 2.1GHz up to 5.6GHz Turbo and 16 E-cores 1.6GHz up to 4.4 GHz Turbo |36MB Intel® Smart Cache | Intel® UHD Graphics 770 with 32EUs | Dual channel DDR5 memory interface | Chipset R680E | Intel® code name: Bartlett Lake S

    conga-HPC/cBLS-5-211E (P/N 049821)

    COM-HPC Client module based on Intel® Core™ 5-211E LGA 1700 processor with 6 P-cores 2.7GHz up to 4.9GHz Turbo and 4 E-cores 2.0GHz up to 3.7GHz Turbo | 20MB Intel® Smart Cache | Intel® UHD Graphics 770 with 24EUs | Dual channel DDR5 memory interface | Chipset R680E | Intel® code name: Bartlett Lake S

    conga-HPC/cBLS-3-201E (P/N 049822)

    COM-HPC Client module based on Intel® Core™ 3-201E LGA 1700 processor with 4 P-cores 3.6GHz up to 4.8GHz Turbo | 12MB Intel® Smart Cache | Intel® UHD Graphics 730 with 24EUs | Dual channel DDR5 memory interface | Chipset Q670E | Intel® code name: Bartlett Lake S

    Ecosystem Details

    Virtualization

    RTS Hypervisor (P/N 300501)

    Operating Systems

    ctrlX OS (P/N )
    Ubuntu Pro (P/N N/A)

    Cooling Solutions

    conga-HPC/cRLS-CSA-HP-B (P/N 049650)

    Standard active cooling solution for COM-HPC module conga-HPC/cRLS with integrated heat pipes, 30mm overall height and two integrated 12V fans. All standoffs are with 2.7mm bore hole.

    conga-HPC/cRLS-CSA-HP-T (P/N 049651)

    Standard active cooling solution for COM-HPC module conga-HPC/cRLS with integrated heat pipes, 30mm height and two integrated 12V fans. All standoffs are M2.5mm threaded.

    conga-HPC/cRLS-HSP-HP-B (P/N 049652)

    Standard heatspreader for COM-HPC module conga-HPC/cRLS with integrated heat pipes, 13mm height. All standoffs are with 2.7mm bore hole.

    conga-HPC/cRLS-HSP-HP-T (P/N 049653)

    Standard heatspreader for COM-HPC module conga-HPC/cRLS with integrated heat pipes, 13mm height. All standoffs are M2.5mm threaded.

    conga-HPC/cRLS-HPA (P/N 049654)

    Standard heatpipe adapter for COM-HPC module conga-HPC/cRLS.

    Carrierboards

    conga-HPC/EVAL-Client (P/N 065600)

    Evaluation Carrier Board for COM-HPC Client type Modules.

    conga-HPC/uATX-Client (P/N 065620)

    COM-HPC Client µATX Application Carrier Board suitable for congatec COM-HPC modules with Size A,B and C.

    Memory

    DDR5 SODIMM 4800 (8GB) (P/N 068901)

    DDR5 SODIMM memory module with up to 4800 MT/s and 8GB RAM, commercial temp 0°C to +60°C

    DDR5-SODIMM 4800 (16GB) (P/N 068902)

    DDR5 SODIMM memory module with up to 4800 MT/s and 16GB RAM, commercial temp 0°C to +60°C

    DDR5-SODIMM-4800 (32GB) (P/N 068903)

    DDR5 SODIMM memory module with up to 4800 MT/s and 32GB RAM, commercial temp 0°C to +60°C

    DDR5-SODIMM-4800 ECC (16GB) (P/N 068912)

    DDR5 SODIMM memory module with up to 4800 MT/s and 16GB RAM with ECC, commercial temp 0°C to +60°C

    DDR5-SODIMM-4800 ECC (32GB) (P/N 068913)

    DDR5 SODIMM memory module with up to 4800 MT/s and 32GB RAM with ECC, commercial temp 0°C to +60°C

    Module services

    Design-In Training (P/N 27000001)

    Design-Training to develop carrier boards for Computer on Modules

    Ext. temperature screening (-40°C to +85°C) (P/N )

    congatec Wide Temperature Range Screening
    Standard screening profile with 12h temperature screening and cold soak test
    Including functional test and several boot-ups (before & after screening)

    Ext. temperature screening (-25°C to +80°C) (P/N )

    congatec Wide Temperature Range Screening
    Standard screening profile with 12h temperature screening and cold soak test
    Including functional test and several boot-ups (before & after screening)

    Accessories

    More about conga-HPC/EVAL-Client

    conga-HPC/EVAL-Client

    Evaluation Carrier Board for COM-HPC Client Type Modules

    More about conga-HPC/uATX-Client

    conga-HPC/uATX-Client

    Application Carrier Board for COM-HPC Client Type Modules (Sizes A, B, C)