Our COM Express Type 7 Server-on-Module ecosystem targets enhanced micro servers and other server-like applications that permit only low power consumption but require high computing performance and communication throughput. We also provide passive cooling solutions for designs with up to 100 W heat dissipation to simplify the design-in of these ultra-powerful COM Express modules. For embedded server applications requiring more than 4x10 GbE and 32x PCIe lanes, designers should also check out our COM-HPC Server ecosystem.
Details about the COM Express Type 7 Specification
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There are 1,000's of possible configurations of our products, and therefore every possible configuration may not be shown with this tool.
If you don't find the configuration you require contact your congatec Sales representative for further assistance.
If you don't find the configuration you require contact your congatec Sales representative for further assistance.
conga-B7XI
- Intel® Xeon® D1700 processors
- Up to 10 cores
- Up to 128 GB RAM
- Extended temperature options
- Up to 4x 10 GbE supporting CEI/KR/SFI
conga-B7E3
- AMD EPYC™ Embedded 3000 Series
- Up to 16 cores
- Up to 96 GB RAM
- Extended temperature options
- 4x 10 GbE with KR interface support
conga-B7AC
- Intel Atom® C3000 processor family
- Up to 16 cores
- Extended temperature options
- Power-optimized design
- 4x 10 GbE with KR interface support
conga-B7XD
- Intel® Xeon® D1500 and Intel® Pentium® processors
- Up to 16 cores
- Up to 96 GB RAM
- Optional ECC support
- 2x 10 GbE with KR interface support
conga-X7EVAL
- Evaluation carrier board for COM Express Type 7
- 4x PCIe slots for 32 lanes
- 4x 10 Gigabit Ethernet SFP+
- BMC with VGA, iKVM, virtual storage
- Extended temperature options
