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conga-TC750

COM Express Type 6 Compact module based on Intel® Core™ Ultra processors (code name "Arrow Lake")

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Value adding ecosystem offerings


Virtualization

Operating Systems

Cooling Solutions

Memory

Carrierboards

Module services

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conga-TC750

COM Express Type 6 Compact module based on Intel® Core™ Ultra processors (code name "Arrow Lake")

Virtualization Ready
  • Cutting edge Intel® Arc™ Graphics with XMX Systolic Arrays and up to 128 EUs
  • Next level Edge AI performance up to 99 TOPS total
  • Up to 128 GB RAM with in-band ECC
  • Intel® performance hybrid architecture with up to 16 cores and 22 threads
  • PCI Express Gen 4 | USB 4
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Do you want to add further ecosystem parts (carrier boards, memory,...) to your request?

Value adding ecosystem offerings

Virtualization

Operating Systems

Cooling Solutions

Memory

Carrierboards

Module services

Specification

Formfactor
COM Express Compact
CPU
Intel® Core™ Ultra 9-285H (6 P-cores 2.9Ghz up to 5.4GHz, 8 E-Cores 2.7GHz up to 4.5GHz, 2 Low Power E-cores 1GHz up to 2.5GHz, 24MB Intel® Smart Cache)
Intel® Core™ Ultra 7-255H (6 P-cores 2.0Ghz up to 5.1GHz, 8 E-Cores 1.5GHz up to 4.4GHz, 2 Low Power E-cores 700MHz up to 2.5GHz, 24MB Intel® Smart Cache)
Intel® Core™ Ultra 5-225H (4 P-cores 1.7Ghz up to 4.9GHz, 8 E-Cores 1.3GHz up to 4.3GHz, 2 Low Power E-cores 700MHz up to 2.5GHz, 18MB Intel® Smart Cache)
Intel® Core™ Ultra 7-255U (2 P-cores 2.0Ghz up to 5.2GHz, 8 E-Cores 1.7GHz up to 4.2GHz, 2 Low Power E-cores 700MHz up to 2.4GHz, 12MB Intel® Smart Cache)
Intel® Core™ Ultra 5-225U (2 P-cores 1.5Ghz up to 4.8GHz, 8 E-Cores 1.3GHz up to 3.8GHz, 2 Low Power E-cores 700MHz up to 2.4GHz, 12MB Intel® Smart Cache)
DRAM
2x SO-DIMM sockets for DDR5 memory modules up to 64 GB each (max. 128 GB RAM system capacity) |up to 6400 MT/s | in-band ECC
Ethernet
2.5 GbE with TSN support via Intel® i226 Ethernet controller series
Supporting TSN - Time Sensitive Networking (selected PNs)
Software Definable Pin (SDP) to be used for IEEE 1588
I/O Interfaces
Up to 8 PCIe Gen5 PEG (H-Series) or up to 2x4 PCIe Gen4 PEG (U-Series)
up to 8 PCIe Gen4
up to 2x USB4
4x USB 3.2 Gen2 (incl. USB 2.0) + 8x USB 2.0
up to 2x SATA
2 x UART
GPIOs
SPI
LPC
SM-Bus
I²C
Mass storage
NVMe x4 SSD (optional) up to 1 TB capacity
Graphics
Intel® Arc™ Graphics architecture | up to 8 Xᵉ Cores with 128 EUs
NPU/AI Acceleration
Integrated NPU accelerator on all part numbers
Up to 99 TOPS (platform total)
congatec Board Controller
Next Gen 6 congatec Board Controller | Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code
embedded BIOS Features
AMI Aptio® UEFI firmware
64Mbyte serial SPI with congatec Embedded BIOS feature
OEM Logo
OEM CMOS Defaults
LCD Control
Display Auto Detection
Backlight Control
Flash Update
Security
Trusted Platform Module (TPM 2.0)
Power Management
ACPI 6.0 with battery support
Operating Systems
Microsoft® Windows 11 IoT Enterprise
Microsoft® Windows 11
Microsoft® Windows 10 IoT Enterprise
Linux
Yocto
Hypervisor
RTS Real-Time Hypervisor
Temperature
Embedded Temp.: Operating 0°C to 60°C | Storage -20°C to 80°C
Humidity
Operating: 10 to 85% r. H. non cond. / Storage 5 to 85% r. H. non cond.
Video Interfaces
Up to 3x DDI (2x shared with USB4)
LVDS or eDP
4 x independent displays up to 8k
Size
95 x 95 mm (3,74" x 3,74")

Documents

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Data Sheet

Data sheet for conga-TC750
13.02.2025

Product Variants

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    There are 1,000's of possible configurations of our products, and therefore every possible configuration may not be shown with this tool.
    If you don't find the configuration you require contact your congatec Sales representative for further assistance.
    conga-TC750/ultra5-225U (P/N 045724)

    COM Express Type 6 Compact module based on Intel® Coreâ„¢ Ultra 5 processor with 2 P-cores, 8 E-cores and 2 Low Power E-cores | P-cores 1.5Ghz up to 4.8GHz (turbo) | E-Cores 1.3GHz up to 3.8GHz (turbo) | Low Power E-cores up to 2.4GHz (turbo) |Integrated NPU | 12MB Intel® Smart Cache | Intel® Graphics with 4 Xe cores (64 EU) |Dual channel SODIMM DDR5 memory interface up to 5600 MT/s | 15W Base-TDP | Intel® code name Arrow Lake-U

    conga-TC750/ultra7-255U (P/N 045723)

    COM Express Type 6 Compact module based on Intel® Core™ Ultra 7 processor with 2 P-cores, 8 E-cores and 2 Low Power E-cores | P-cores 2.0Ghz up to 5.2GHz (turbo) | E-Cores 1.7GHz up to 4.2GHz (turbo) | Low Power E-cores up to 2.4GHz (turbo) |Integrated NPU | 12MB Intel® Smart Cache | Intel® Graphics with 4 Xe cores (64 EU) |Dual channel SODIMM DDR5 memory interface up to 5600 MT/s | 15W Base-TDP | Intel® code name Arrow Lake-U

    conga-TC750/ultra5-225H (P/N 045722)

    COM Express Type 6 Compact module based on Intel® Core™ Ultra 5 processor with 4 P-cores, 8 E-cores and 2 Low Power E-cores | P-cores 1.7Ghz up to 4.9GHz (turbo) | E-Cores 1.3GHz up to 4.3GHz (turbo) | Low Power E-cores up to 2.5GHz (turbo) |Integrated NPU | 18MB Intel® Smart Cache | Intel® Arc™ 130T graphics with 7 Xe cores (112 EU) | Dual channel SODIMM DDR5 memory interface up to 5600 MT/s | 28W Base-TDP | Intel® code name Arrow Lake-H

    conga-TC750/ultra7-255H (P/N 045721)

    COM Express Type 6 Compact module based on Intel® Core™ Ultra 7 processor with 6 P-cores, 8 E-cores and 2 Low Power E-cores | P-cores 2.0Ghz up to 5.1GHz (turbo) | E-Cores 1.5GHz up to 4.4GHz (turbo) | Low Power E-cores up to 2.5GHz (turbo) |Integrated NPU | 24MB Intel® Smart Cache | Intel® Arc™ 140T graphics with 8 Xe cores (128 EU) | Dual channel SODIMM DDR5 memory interface up to 5600 MT/s |28W Base-TDP | Intel® code name Arrow Lake-H

    conga-TC750/ultra9-285H (P/N 045720)

    COM Express Type 6 Compact module based on Intel® Core™ Ultra 9 processor with 6 P-cores, 8 E-cores and 2 Low Power E-cores | P-cores 2.9Ghz up to 5.4GHz (turbo) | E-Cores 2.7GHz up to 4.5GHz (turbo) | Low Power E-cores up to 2.5GHz (turbo) |Integrated NPU | 24MB Intel® Smart Cache | Intel® Arc™ 140T graphics with 8 Xe cores (128 EU) | Dual channel SODIMM DDR5 memory interface up to 5600 MT/s |45W Base-TDP | Intel® code name Arrow Lake-H

    Ecosystem Details

    Virtualization

    RTS Hypervisor (P/N 300501)

    Operating Systems

    ctrlX OS (P/N )
    Ubuntu Pro (P/N N/A)

    Cooling Solutions

    conga-TC700/CSA-HP-B (P/N 045750)

    Standard active cooling solution for high performance COM Express module conga-TC700 with integrated heat pipes, 25.5mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole.

    conga-TC700/CSA-HP-T (P/N 045751)

    Standard active cooling solution for high performance COM Express module conga-TC700 with integrated heat pipes, 25.5mm height and integrated 12V fan. All standoffs are M2.5mm threaded.

    conga-TC700/CSP-HP-B (P/N 045752)

    Standard passive cooling solution for high performance COM Express module conga-TC700 with integrated heat pipes, 24.7mm height. All standoffs are with 2.7mm bore hole.

    conga-TC700/CSP-HP-T (P/N 045753)

    Standard passive cooling solution for high performance COM Express module conga-TC700 with integrated heat pipes, 24.7mm height. All standoffs are M2.5mm threaded.

    conga-TC700/HSP-HP-B (P/N 045754)

    Standard heatspreader for high performance COM Express module conga-TC700 with integrated heat pipes, 11mm height. All standoffs are with 2.7mm bore hole.

    conga-TC700/HSP-HP-T (P/N 045755)

    Standard heatspreader for high performance COM Express module conga-TC700 with integrated heat pipes, 11mm height. All standoffs are M2.5mm threaded.

    Memory

    DDR5-SODIMM-5600 (8GB) (P/N 068930)

    DDR5 SODIMM memory module with up to 5600 MT/s and 8GB RAM, commercial temp 0°C to +60°C

    DDR5-SODIMM-5600 (16GB) (P/N 068931)

    DDR5 SODIMM memory module with up to 5600 MT/s and 16GB RAM, commercial temp 0°C to +60°C

    DDR5-SODIMM-5600 (32GB) (P/N 068932)

    DDR5 SODIMM memory module with up to 5600 MT/s and 32GB RAM, commercial temp 0°C to +60°C

    DDR5-SODIMM-5600 (48GB) (P/N 068933)

    DDR5 SODIMM memory module with up to 5600 MT/s and 48GB RAM, commercial temp 0°C to +60°C

    Carrierboards

    conga-TEVAL2 (P/N 065810)

    Evaluation carrier board for COM Express Type6 Rev. 3.0 modules.

    conga-TEVAL3/COMe3.1 (P/N 065820)

    congatec COM Express Type 6 evaluation carrier compliant to COM Express 3.1 specification. Industrial temperature range. From -40°C to 85°C

    Module services

    Design-In Training (P/N 27000001)

    Design-Training to develop carrier boards for Computer on Modules

    Conformal Coating COM Express Basic and Compact (P/N )

    HumiSeal® 1A33 coating for COM Express Basic and Compact modules; MIL-I-46058C qualified, IPC-CC-830 and
    RoHS Directive 2002/95/EC compliant and recognized under UL File Number E105698.