Evaluation carrier board for COM Express Type6 Rev. 3.0 modules.
Your item has been added to the inquiry
conga-TEVAL/COMe 3.0
Evaluation Carrier Board for COM Express® Type 6 Modules Rev. 3.0
- COM Express Type 6 Rev. 3.0 Evaluation Carrier Board
- Reference Carrier Board
Specification
Evaluation Carrier Board for COM Express® Type 6 modules. To achieve a quick start with COM Express® congatec offers an evaluation carrier board, which routes all the COM Express® signals to standard interface connectors. Supports COM Express® Compact and Basic modules using connector Pinout Type 6.
I/O
- PCI Express x4
- 5x PCI Express x1
- PCI Express for Graphics x16
- M.2 key B size 3042/2260/2280
- mini PCI Express Half/Full size
- 4x USB 3.1 Type-A
- 2x USB 2.0 Type-A
- USB Client Type-B
- Gigabit Ethernet (RJ45)
- SDP header
Audio
- 2x Audio Jack (Line Out/MIC In)
- Optical S/PDIF Out
- External Codec header
Storage
- 4x SATA; SATADOM support
- SATA Power, SD/SDIO
Misc
- COM RS-232/422/485
- COM RS-232
- CAN Bus
- Power/Reset/Sleep Buttons
- 2x FAN
- Feature header
Video
- 3x Dual-Mode DisplayPort
- eDP
- LVDS
- VGA
Power
- ATX 24pin PoweR
- 12V Banana 4mm Sockets, CMOS/RTC Battery
Size
- 294 x 244 mm²
Environment
- Temperature: Operation: -40° to + 85°C | Storage-40° to + 85°C
- Humity: Operation: 10% to 90% Storage: 5% to 95%
Documents
All documents found on this page are updated without notification. Always check this page for
the latest
version.
Data Sheet
06.05.2020
Manual
30.10.2024
30.10.2024
05.02.2021
05.02.2021
Ecosystem Details
Carrierboards
conga-TEVAL2 (P/N 065810)
Accessories
conga-FPA2 (EOL)
Universal Flat Panel Adapter Board
conga-TC570
COM Express Type 6 Compact module based on 11th Gen Intel® Core™ processor family (code name "Tiger Lake")
conga-TC570r
COM Express Type 6 Compact module based on 11th Gen Intel® Core™ processor family (code name "Tiger Lake") and soldered down memory
conga-LDVI
DVI Converter Module for LVDS
conga-LDVI
Module convertisseur DVI pour LVDS