Designed for high-performance embedded and edge computing applications, our performance-class modules integrate latest multicore CPUs as well as GPUs for immersive graphics and/or accelerating AI inference workloads. They offer extremely high scalability for applications ranging from powerful PLCs, HMIs and shop-floor systems to immersive digital signage systems and high-performance medical equipment.


COM-HPC Client

Is ideal for next-generation high-end embedded and edge computing applications

More about conga-HPC/cRLS

conga-HPC/cRLS

Virtualization Ready
  • 13th/14th Generation Intel® Core™
  • Intel® performance hybrid architecture
  • Performance-optimized design
  • Up to 24 cores
  • PCIe Gen 5
More about conga-HPC/cRLP

conga-HPC/cRLP

Virtualization Ready
  • 13th Generation Intel® Core™
  • Intel® performance hybrid architecture
  • Rugged soldered processor
  • Industrial temperature support
  • PCIe Gen 5
More about conga-HPC/cTLH

conga-HPC/cTLH

Virtualization Ready
  • 11th Generation Intel® Core™
  • Intel® Xe graphics engine
  • Rugged soldered processor
  • Industrial temperature support
  • PCIe Gen 4

COM-HPC Mini

Offers extraordinary performance and I/O density for space- and power-restricted applications

More about conga-HPC/mRLP

conga-HPC/mRLP

Virtualization Ready
  • 13th Generation Intel® Core™
  • Intel® Xe graphics engine
  • Rugged soldered processor
  • Industrial temperature support
  • PCIe Gen 4

COM Express Type 6

Is the most elaborated high-performance ecosystem for the entire range of embedded computing applications

More about conga-TCR8

conga-TCR8

Virtualization Ready
  • Up to 8 Zen 4 cores
  • AMD Radeon™ RDNA™ 3 Graphics
  • AMD XDNA™ NPU
  • Up to 128 GB RAM (optional with ECC)
  • TDP Range from 15W to 54W
  • Onboard NVMe™ SSD (option)
More about conga-TC700

conga-TC700

Virtualization Ready
  • Intel® Core™ Ultra processors
  • Up to 16 cores
  • Up to 96 GB DDR5 with in-band ECC
  • Built-in Intel® Arc™ GPU
  • Integrated Intel® AI Boost NPU
More about conga-TC675r

conga-TC675r

Virtualization Ready
  • 13th Generation Intel® Core™
  • Soldered memory
  • Extended temperature range options
  • Up to 14 cores
  • PCIe Gen 4
More about conga-TC675

conga-TC675

Virtualization Ready
  • 13th Generation Intel® Core™
  • Intel® Performance Hybrid Architecture
  • Extended temperature range options
  • Up to 14 cores
  • PCIe Gen 4
More about conga-TS570

conga-TS570

Virtualization Ready
  • 11th Generation Intel® Core™
  • Performance-optimized design
  • Up to 8 cores
  • Extended temperature range options
  • PCIe Gen 4
More about conga-TCV2

conga-TCV2

Virtualization Ready
  • AMD Embedded Ryzen V2000 processor series
  • High-performance Zen 2 CPU & VEGA GPU
  • Superior cost/performance ratio
  • Up to 8 cores
  • Wide TDP range from 10-54 W