How to design robotic brains
The economic value of the industrial robotics market is growing rapidly and is expected to reach $US 214.60 billion, with a 22.80% compound annual growth rate (CAGR) by 2030. This will be driven, in part, by the integration of new technologies like artificial intelligence (AI), which is expected to contribute $US 44.5 billion to this figure.
Adapting industrial edge servers to evolving markets
Data processing is surging in sectors like manufacturing, energy, and smart cities, creating a booming market for edge servers. According to Global Market Insights, this will create a $29 billion opportunity for near- and far-edge computing solutions by 2025
Ensuring cybersecurity at the industrial edge
Cyber attacks against industrial operations increased by 140% in 2022. Preventing such attacks is non-negotiable, but it can be a significant challenge for industrial operators.
System consolidation in autonomous mobile robots
Software functions define the capabilities of autonomous robots. Consolidating all functions on one system can help to make your designs more powerful, cost effective, and resilient. Learn what is possible and what to consider in our whitepaper.
Etteplan Evaluation Platform leverages congatec Computer-on-Modules (COMs)
Etteplan Develops Next-Generation, All-in-One Evaluation Platform to Accelerate Customers’ Product Development
COM-HPC Intel Xeon D Solution Brief
Three new computer-on-modules for high performance computing (COM-HPC) products from congatec bring the power of a server from the data center to the edge, including industrial environments and outdoor applications.
Solution Brief: COM-HPC for Medical Applications
congatec’s COM-HPC module delivers the design flexibility and high performance needed to power AI, graphics, and other data-intensive applications driving modern healthcare systems.
12th Gen Intel Core Computer-on-Modules
The 12th generation Intel Core mobile and desktop processors have recently arrived in the embedded computing space, with implementations on the high-performance Computer-on-Module standards COM-HPC and COM Express.
Intel Xeon D processors on COM-HPC Server-on-Modules
With COM-HPC Server and Intel Xeon D technology, edge server installations are freed from the tight thermal constraints of climate-controlled server rooms.
Multitasking at the edge
IoT gateways and edge computers can hardly get enough cores. With AMD Ryzen™ Embedded V2000 processor technology and RTS hypervisor support OEMs can design a whole new class of IoT gateway applications.
Remote management made easy
COM-HPC is defines an interface specification for the out-of-band management of embedded system platforms. OEMs benefit from the ability to remotely monitor systems, install updates and patches, and resolve issues remotely without being physically present in the server room.
NPU-trained eyes
Embedded vision integration is critical to the success of AI-enabled systems, whether in self-driving vehicles, video surveillance, or collaborative robotics. Preconfigured embedded vision building blocks make it easy for developers to quickly create custom solutions. Read the full story here.
11th Gen Intel Core Solution Brief
Built on 11th Gen Intel® Core™ processors, congatec’s conga-TS570 COM Express Type 6 and conga-HPC/cTLH COM-HPC Client modules bring near real- time performance, scalability, security, and resilience to a new class of edge computing applications.
Maximum performance for COM Express Type 7 servers
Embedded edge servers and microservers need high performance. Anyone wanting to develop such high-performance systems scalably with server-on-modules for harsh environments needs an ecosystem based on COM Express Type 7 with fanless support for TDPs of up to 100 W.
Human-Like Cognition with a NPU for Enhanced Patient Care
The way in which embedded integration is realized determines the success of AI-based systems in biomedical engineering applications – whether for diagnoses, defibrillators, or live images from minimally invasive surgery. Preconfigured embedded modules help developers find specific solutions for medical applications faster.
COM Express Type 6 y COM-HPC Client
Por primera vez en muchos años, los procesadores embebidos de alta gama están disponibles en dos opciones de factor de forma COM (Computer on Module), COM-HPC® Client y COM Express® Type 6. La llegada de la 11ª generación de procesadores Intel® Core® (nombre en código Tiger Lake) ofrece a los desarrolladores la oportunidad de decidir qué factor de forma se ajusta más a los requisitos de su proyecto.
Download Whitepaper
SMARC modules with NXP i.MX 8M Plus Processor
congatec is expanding its SMARC platform with a new module with an NXP i.MX 8M Plus processor especially for embedded AI applications. Thanks to the extensive ecosystem with application-ready 3.5-inch carrier board, Basler cameras, and AI software stack, fast proof of concept is possible.
COM-HPC modules accelerate machine vision
Three-dimensional machine vision is admittedly not the simplest of technologies to recognize things. However, because it is closest to the human eye, 3D vision has a wide range of applications and is increasingly being used alongside machine learning.
Embedded server modules for edge data centers
The growing need to lower latency and reduce energy-hungry data traffic over long distances is leading to rapidly rising deployment of server technology and data centers at the edge. Server-on-Modules based on the COM-HPC and COM Express standards offer a highly efficient design basis for this.
The edge is modular
Industrial edge server designs must be highly flexible to integrate the ability to perform diverse tasks. Increasingly, virtual machines are being used to consolidate a variety of
Industry 4.0 workloads. Learn more about hardware consolidation and modular edge computing
The significance of real-time Ethernet networks for the IIoT
With the emergence of 5G technologies and the arrival of 10+ GbE networks in the industrial sector, real-time processing leveraging time-sensitive networking in tactile Internet environments is becoming an important new application area. What are the requirements for TSN-enabled edge computers?
Focus on mobile devices
Color video technology paired with artificial intelligence is a large development field for the future optimization of patient care. Mobile systems have an important role to play in this context, and OEMs need solutions that integrate embedded vision and embedded computer technology.
Diseños de placas base COM-HPC
COM-HPC es el nuevo estándar para los servidores modulares de gama alta. Ofrece una velocidad mucho mayor y casi el doble de interfaces que COM Express. Por lo tanto, los requisitos de diseño de las placas base están aumentando exponencialmente. ¿Cómo pueden los desarrolladores prepararse para los nuevos retos?
AI vision platform for robotics
Computer-based vision is growing more and more important in robotic systems. But how do you fuse hard real-time applications and time-sensitive networking (TSN) with vision systems and artificial intelligence (AI)?
Hacarus AI
Sparse Modeling featuring slim but powerful artificial intelligence for embedded systems
Modules for cooperative robotics
The Service Robotics Research Center of Ulm University of Applied Sciences is developing
a modular software framework to make it easier to program robots. The goal is to provide
software components that can be used universally, for instance to swap robotic gripping
arms from different manufacturers as required to generate new robotics solutions via
plug and play.
i.MX 8X en los módulos SMARC 2.0 y Qseven de congatec
La versión 8X del procesador NXP i.MX 8 tiene un consumo de energía extremadamente bajo, es robusta y viene con muchas características de seguridad funcional. Ahora es compatible en los estándares de módulos SMARC 2.0 y Qseven de congatec
Download Whitepaper
Performance boost for harsh environments
Server processors are getting more and more energy efficient. Embedded application developers use them to boost performance, which also opens up completely new application fields for them. congatec supports such OEM designs with application-ready COM Express Type 7 modules and platforms.
Device development with SMARC 2.0
SMARC 2.0 is the great new Computer-on-Modules standard for the efficient design of powerful and feature-rich small form factor (SFF) applications.
SMARC 2.0 Whitepaper
SMARC 2.0 - A New Standard to Bridge the Gap between Qseven and COM Express
Real-time capable Ethernet becomes standard
With the coming of 5G technology and the implementation of 10+ GbE networks in factories, real-time data processing for OPC UA and other tactile Internet applications is emerging as an important new area of use.
Computing Core Standard for Mobility IT
In the past, electronic components were tailored to specific automotive platforms in order to reduce costs in series production. But in the cockpits of tomorrow, the days of proprietary controller platforms for dedicated functions are over; the future lies in clustering individual mobility functions by using universally applicable computing cores.
SMARC 2.1 Whitepaper
SMARC 2.0 modules stand out with their rich choice of graphics, camera, sound, network and optional wireless interfaces. The updated specification SMARC 2.1 extends this feature set even further. Two PCI Express lanes can be used alternatively as additional Ethernet ports. Extra two MIPI CSI interfaces and additional GPIOs also extends the possibilities of SMARC modules.
