SMARC Module based on high-performance industrial TI TDA4VM Arm® Application processor. Features 2x ARM Cortex-A72 @ 2.0GHz + 6x ARM Cortex-R5F + 8 TOPS MMA (deep-learning matrix multiply accelerator), 4GB onboard LPDDR4x memory and 32GB onboard eMMC. Features Ublox Wifi/BT module MAYA-W260. Industrial grade temperature range from -40°C to 85°C.
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conga-STDA4
SMARC Module based on TI Processors TDA4VM and DRA829J
- SMARC Module based on TI TDA4VM application processor and DRA829J Arm® networking processor
- Heterogenous architecture with dual Arm® Cortex®-A72, DSP and accelerators for deep learning and multimedia
- Arm® Cortex®-R5F MCUs to offload real-time communication
- Highest reliability for harsh environment applications
- Industrial temperature range -40°C to +85°C
Value adding ecosystem offerings

Cooling Solutions

Carrierboards

Module services
Specification
Up to 8 MB of on-chip L3 RAM with ECC and coherency | 512KB on-chip SRAM in MAIN domain, protected by ECC
Commercial: Operating: 0 to +60°C | Storage: -40 to +85°C
Documents
Data Sheet
Manual
Product Variants
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- Microsoft® Windows 11 IoT Enterprise upon request
- Microsoft® Windows 11 upon request
- Ubuntu Linux LTS
- Microsoft® Windows 11 IoT Enterprise
- RTOS
- QNX
- Microsoft® Windows 11
- Microsoft® Windows IoT 10 Core
- Microsoft® Windows 10 IoT Enterprise
- Microsoft® Windows® 10 (64bit only)
- Microsoft® Windows® 10
- Microsoft® Windows 10 Enterprise
- Microsoft® Windows 10 Core Pro
- Microsoft® Windows® 7
- Android
- Linux
- Yocto
- Microsoft® Windows® XP
- Microsoft® Windows® embedded Standard
- Microsoft® Windows® CE 6.0
- Microsoft® Windows® CE 7.0
- Embedded POS Ready
- Windows Embedded Compact 7
- Microsoft Windows 8 embedded
- Microsoft® Windows® 8.1
- BSPs with OS drivers and tools
- Microsoft® Windows® 7/8 embedded Standard
- Microsoft® Windows Server 2016
- RHEL 6.8 & 7.2
- SUSE 12 SP1
- Fedora 22
- Ubuntu 14.10
- CentOS 6.6 & 7.1
- FreeBSD 10.3 & 11
- Yocto v2.0 (Jethro), Kernel 4.1
- VMware
- Microsoft® Windows Server 2012 R2
- Microsoft® Windows Server 2012
- Microsoft® Windows Server 2008 R2 SP1
- RHEL 6.6 & 7.1
- SuSE 11 SP4 & 12 SP1
- Yocto v.2.0 Kernel 4.1
- Wind River VxWorks 7
- ESXi
- Microsoft® Windows IoT Core
- Microsoft® Windows 10 (64bit only)
- Fedora 24
- Ubuntu
- SuSe
- Red Hat Enterprise
- Yocto Project v2.2
- Chromium 2
- Wind River VxWorks
- Microsoft® Windows 10 IoT Enterprise (64bit only)
- RTS Hypervisor
If you don't find the configuration you require contact your congatec Sales representative for further assistance.
SMARC Module based on high-performance industrial TI TDA4VM Arm® Application processor. Features 2x ARM Cortex-A72 @ 2.0GHz + 6x ARM Cortex-R5F + 8 TOPS MMA (deep-learning matrix multiply accelerator), 4GB onboard LPDDR4x memory and 32GB onboard eMMC. Industrial grade temperature range from -40°C to +85°C.
SMARC Module based on high-performance industrial TI TDA4VM Arm® Application processor. Features 2x ARM Cortex-A72 @ 2.0GHz + 6x ARM Cortex-R5F + 8 TOPS MMA (deep-learning matrix multiply accelerator), 2GB onboard LPDDR4x memory and 32GB onboard eMMC. Industrial grade temperature range from -40°C to +85°C.
SMARC Module based on high-performance industrial TI DRA829J Arm® Networking processor. Features 2x ARM Cortex-A72 @ 2.0GHz + 6x ARM Cortex-R5F + 8 TOPS MMA (deep-learning matrix multiply accelerator), 4GB onboard LPDDR4x memory and 32GB onboard eMMC. Industrial grade temperature range from -40°C to +85°C.
SMARC Module based on high-performance industrial TI DRA829J Arm® Networking processor. Features 2x ARM Cortex-A72 @ 2.0GHz + 6x ARM Cortex-R5F + 8 TOPS MMA (deep-learning matrix multiply accelerator), 2GB onboard LPDDR4x memory and 32GB onboard eMMC. Industrial grade temperature range from -40°C to +85°C
Ecosystem Details
Cooling Solutions
Passive cooling solution for SMARC Module conga-STDA4 based onTI ARM Jacinto 7 ARM processor. All standoffs are with 2.7 mm bore hole.
Standard heats preaderfor SMARC Module conga-STDA4 based onTI ARM Jacinto 7 ARM processor. All standoffs are with 2.7 mm bore hole.
Active cooling solution adapter for SMARC 2.1 modules used in combination with module heat spreader.
Carrierboards
Evaluation Carrier Board for SMARC 2.0 modules.
Compact sized SMARC 2.0 Carrier Board for ARM based SMARC Modules
Module services
Design-Training to develop carrier boards for Computer on Modules
HumiSeal® 1A33 coating for Qseven, SMARC and Type 10 modules; MIL-I-46058C qualified, IPC-CC-830 and RoHS
Directive 2002/95/EC compliant and recognized under UL File Number E105698.
congatec Wide Temperature Range Screening
Standard screening profile with 12h temperature screening and cold soak test
Including functional test and several boot-ups (before & after screening)
congatec Wide Temperature Range Screening
Standard screening profile with 12h temperature screening and cold soak test
Including functional test and several boot-ups (before & after screening)
Accessories
conga-SEVAL
Evaluation Carrier Board compatible with SMARC modules
conga-SMC1/SMARC-ARM
Compact sized Carrier Board for ARM based SMARC 2.0 modules