COM-HPC Size D module based on Intel® Xeon® D-2899NT 22-core processor with 2.2 GHz, 30MB cache and quad channel DDR4 3200 MT/s memory interface (formerly Ice Lake-D HCC Refresh). Commercial temperature range.
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conga-HPC/sILH
COM-HPC Server Size D module based on Intel® Xeon® D processor series (code name "Ice Lake")
Selected ecosystem parts
Virtualization

Operating Systems
IOT Software

Cooling Solutions

Carrierboards

Memory

Add-On Cards
Value adding ecosystem offerings
Virtualization

Operating Systems
IOT Software

Cooling Solutions

Carrierboards

Memory

Add-On Cards
Value adding ecosystem offerings
Virtualization

Operating Systems
IOT Software

Cooling Solutions

Carrierboards

Memory

Add-On Cards
Specification
*Optional 8 sockets on Size E, up to 1TB
Industrial: Operating Temperature: -40 to +80°C | Storage Temperature: -40 to +80°C
Optional available on Size E, 200 x 160mm
Documents
Data Sheet
Other
Software
Use for BIOS update or customization and panel configuration. Linux source version.
Important note: Only compatible with cgos 1.03.032 and older!
Product Variants
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- Ubuntu Linux LTS
- Microsoft® Windows 11 IoT Enterprise
- RTOS
- QNX
- Microsoft® Windows 11
- Microsoft® Windows IoT 10 Core
- Microsoft® Windows 10 IoT Enterprise
- Microsoft® Windows® 10 (64bit only)
- Microsoft® Windows® 10
- Microsoft® Windows 10 Enterprise
- Microsoft® Windows 10 Core Pro
- Microsoft® Windows® 7
- Android
- Linux
- Yocto
- Microsoft® Windows® XP
- Microsoft® Windows® embedded Standard
- Microsoft® Windows® CE 6.0
- Microsoft® Windows® CE 7.0
- Embedded POS Ready
- Windows Embedded Compact 7
- Microsoft Windows 8 embedded
- Microsoft® Windows® 8.1
- BSPs with OS drivers and tools
- Microsoft® Windows® 7/8 embedded Standard
- Microsoft® Windows Server 2016
- RHEL 6.8 & 7.2
- SUSE 12 SP1
- Fedora 22
- Ubuntu 14.10
- CentOS 6.6 & 7.1
- FreeBSD 10.3 & 11
- Yocto v2.0 (Jethro), Kernel 4.1
- VMware
- Microsoft® Windows Server 2012 R2
- Microsoft® Windows Server 2012
- Microsoft® Windows Server 2008 R2 SP1
- RHEL 6.6 & 7.1
- SuSE 11 SP4 & 12 SP1
- Yocto v.2.0 Kernel 4.1
- Wind River VxWorks 7
- ESXi
- Microsoft® Windows IoT Core
- Microsoft® Windows 10 (64bit only)
- Fedora 24
- Ubuntu
- SuSe
- Red Hat Enterprise
- Yocto Project v2.2
- Chromium 2
- Wind River VxWorks
- Microsoft® Windows 10 IoT Enterprise (64bit only)
- RTS Hypervisor
If you don't find the configuration you require contact your congatec Sales representative for further assistance.
COM-HPC Size D module based on Intel® Xeon® D-2796TE 20-core processor with 2.0 GHz, 30MB cache and quad channel DDR4 2933 MT/s memory interface (formerly Ice Lake-D HCC). Industrial temperature range.
COM-HPC Size D module based on Intel® Xeon® D-2775TE 16-core processor with 2.0 GHz, 25MB cache and quad channel DDR4 2933 MT/s memory interface (formerly Ice Lake-D HCC). Industrial temperature range.
COM-HPC Size D module based on Intel® Xeon® D-2752TER 12-core processor with 1.8 GHz, 20MB cache and quad channel DDR4 2666 MT/s memory interface (formerly Ice Lake-D HCC). Industrial temperature range.
COM-HPC Size D module based on Intel® Xeon® D-2733NT 8-core processor with 2.1 GHz, 15MB cache and quad channel DDR4 2666 MT/s memory interface (formerly Ice Lake-D HCC). Commercial temperature range.
COM-HPC Size D module based on Intel® Xeon® D-2712T 4-core processor with 1.9 GHz, 15MB cache and quad channel DDR4 2666 MT/s memory interface (formerly Ice Lake-D HCC). Commercial temperature range.
COM-HPC Size D module based on Intel® Xeon® D-2796TE 20-core processor with 2.0 GHz, 30MB cache and quad channel DDR4 2933 MT/s memory interface (formerly Ice Lake-D HCC). Industrial temperature range. With DPLL option for ITU-T Synchronous Ethernet (SyncE) and IEEE1588 PTP support.
COM-HPC Size D modulebasedon Intel® Xeon® D-2775TE 16-core processorwith2.0 GHz, 25MB cacheand quadchannelDDR4 2933 MT/s memoryinterface (formerlyIce Lake-D HCC). Industrial temperaturerange. WithDPLL optionforITU-T SynchronousEthernet (SyncE) and IEEE1588 PTP support.
Ecosystem Details
Virtualization
Operating Systems
IOT Software
Cooling Solutions
Standard active cooling solution for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes, 32.9mm overall cooling height and integrated 12V fan. Through hole mounting with bore hole standoffs Ø2.7mm.
Standard active cooling solution for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes, 32.9mm overall cooling height and integrated 12V fan. Threaded mounting with threaded standoffs M2.5.
Standard heatspreader for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes and 11mm overall cooling height. Through hole mounting with bore hole standoffs Ø2.7mm.
Standard heatspreader for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes and 11mm overall cooling height. Threaded mounting with threaded standoffs M2.5.
Heat pipe Adapter for COM-HPC Server modules conga-HPC/sILH. Suitable for standard 8 mm heat pipes to optimize heat distribution. Through hole mounting with bore hole standoffs Ø2.7mm.
Heat pipe Adapter for COM-HPC Server modules conga-HPC/sILH. Suitable for standard 8 mm heat pipes to optimize heat distribution. Threaded mounting with threaded standoffs M2.5.
Retention frame for conga-HPC/sILH
Carrierboards
conga-HPC/EVAL-Server
Memory
DDR4 ECC LRDIMM memory module with 3200 MT/s and 128GB RAM
Industrial DDR4 ECC LRDIMM memory module with 3200 MT/s and 128GB RAM
DDR4 UDIMM memory module with 3200 MT/s and 16GB RAM
DDR4 ECC UDIMM memory module with 3200 MT/s and 16GB RAM
Industrial DDR4 UDIMM memory module with 3200 MT/s and 16GB RAM
Industrial DDR4 ECC UDIMM memory module with 3200 MT/s and 16GB RAM
DDR4 UDIMM memory module with 3200 MT/s and 32GB RAM
DDR4 ECC UDIMM memory module with 3200 MT/s and 32GB RAM
Industrial DDR4 UDIMM memory module with 3200 MT/s and 32GB RAM
Industrial DDR4 ECC UDIMM memory module with 3200 MT/s and 32GB RAM
DDR4 ECC RDIMM memory module with 3200 MT/s and 16GB RAM
Industrial DDR4 ECC RDIMM memory module with 3200 MT/s and 16GB RAM
DDR4 ECC RDIMM memory module with 3200 MT/s and 32GB RAM
Industrial DDR4 ECC RDIMM memory module with 3200 MT/s and 32GB RAM
DDR4 ECC RDIMM memory module with up to 3200 MT/s and 64GB RAM
Industrial DDR4 ECC VLP RDIMM memory module with up to 3200 MT/s and 16GB RAM
DDR4 ECC VLP RDIMM memory module with up to 3200 MT/s and 16GB RAM
DDR4 ECC VLP RDIMM memory module with up to 3200 MT/s and 32GB RAM
Add-On Cards
COM-HPC Mezzanine card with Intel C827-IM, 4xSFP28
COM-HPC Mezzanine card with 2x Intel XL827-AM, 8xSFP+
COM-HPC Mezzanine card with Intel C827-IM, 2x QSFP28
Accessories
conga-HPC/EVAL-Server
Evaluation Carrier Board for COM-HPC Server Type Modules
conga-HPC/uATX-Server
Application Carrier Board for COM-HPC Server Type Modules (Size D)