Comprehensive COM-HPC Client Ecosystem
Micro-ATX ecosystem for instant prototyping and roll-out of high-performance embedded and edge computing systems
The new COM-HPC standard hosted by the PICMG opens a completely new level of high-performance embedded and edge computing applications. With congatec’s comprehensive COM-HPC ecosystem consisting of industrial-grade COMs, application-ready Micro-ATX industry-standard carrier board and perfectly matched cooling solutions, OEMs can now develop the next generation of future-oriented high-performance embedded and edge computing systems faster and more reliably than ever before.
Benefits besides significantly reduced time-to-market are also lowest non-recurring engineering costs and highest design-security. Furthermore, congatec’s eco system building blocks enables designers to react very quickly to changing market requirements and efficiently scale the performance of your COM-HPC based embedded systems and edge computing solutions.
The three COM-HPC ecosystem pillars:
Application ready carrier board
The Micro-ATX compliant COM-HPC carrier marks a perfect entry into the high-end industrial workstation and desktop client market. Designed to host all COM-HPC Client compliant modules it boasts embedded long-term availability of at least seven years reducing design risks and revision requirements. It acts not only as a cost-efficient off-the-shelf platform for system designs but can also be used as a fully compliant development platform and blueprint for custom designs.
COM-HPC Client Modules
congatec’s broad range of ultra-scalable COM-HPC client modules covers a broad performance range for ideal performance and watt balancing. Available in three different form factors and covering from low-power to high computing performance designers find a module to perfectly hit the sweet spot for their COM-HPC designs. All modules come with 7+ years long-term availability to maximize the ROI.
More details
Powerful cooling Solutions
No embedded high-performance system is complete without a powerful cooling solution to always draw the best performance from every COM-HPC module and offer highest reliability and availability at the same time. congatec offers a complete range of proven and sophisticated cooling solutions, from powerful active cooling to heat-pipe solutions for passively cooled rugged designs resisting even the harshest environments.
More details
On your marks, ready, go
With congatec’s ecosystem designers can start their new designs in three simple steps:
1. Choosing the preferred COM-HPC Computer-on-Module
conga-HPC/cRLS
- 13th/14th Generation Intel® Core™
- Intel® performance hybrid architecture
- Performance-optimized design
- Up to 24 cores
- PCIe Gen 5
conga-HPC/cRLP
- 13th Generation Intel® Core™
- Intel® performance hybrid architecture
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 5
conga-HPC/cTLH
- 11th Generation Intel® Core™
- Intel® Xe graphics engine
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 4
conga-HPC/cTLU
- 11th Generation Intel® Core™
- Power- and size-optimized design
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 4
2. Plug it on the application ready COM-HPC Client carrier conga-HPC/uATX
The processor socket and vendor independent COM-HPC carrier board conga-HPC/mATX can be equipped with any high-end Computer-on-Module available in COM-HPC Client Size A, B or C.
- Application carrier board for COM-HPC
- Scalable µATX motherboard
- Longevity by module concept
- Quick start to the COM-HPC world
3. Choose one of our powerful cooling solutions
As all congatec modules and boards always come with tailored board support packages featuring all required drivers and hardware-near software, designers are all set to install the applications and run programming, debugging and test routines to realize their next-gen applications with this new high-performance embedded computing standard.
If you are in doubt which module and cooling solution to choose, please contact our sales personnel. They will help you select the best fitting combo for your application.
Mixed-Critical System consolidation
To make full use of the performance the new COM-HPC Client modules offer by their high-performance multi-core processors it is recommended to use a real-time capable hypervisor. By this multiple tasks that previously required several dedicated systems can be consolidated on one single system. All congatec COM-HPC modules support by design the real-time capable hypervisor technology from Real-Time Systems. This bare metal hypervisor allows even mixed-critical system designs that will host real-time control with functional safety together with additional machines for HMI and/or IoT gateway functionality. Please visit www.real-time-systems.com to learn more.
New to COM-HPC? We can train you!
If you are new to COM-HPC we recommend our online training to gain relevant insights into this new open standard and ecosystem and the new application it enables. Please register here
Learn more about the COM-HPC world
and download our whitepapers
12th Gen Intel Core Computer-on-Modules
The 12th generation Intel Core mobile and desktop processors have recently arrived in the embedded computing space, with implementations on the high-performance Computer-on-Module standards COM-HPC and COM Express.
COM-HPC Intel Xeon D Solution Brief
Three new computer-on-modules for high performance computing (COM-HPC) products from congatec bring the power of a server from the data center to the edge, including industrial environments and outdoor applications.
COM-HPC carrier board designs
COM-HPC is the upcoming new standard for modular high-end edge servers. It provides significantly faster and almost twice as many interfaces as COM Express. As a result, carrier board design requirements are increasing exponentially. How can developers prepare for the new challenges?
