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conga-SMX8X

SMARC 2.0 module based on Ultra Low Power NXP i.MX8-X series

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          conga-SMX8X

          SMARC 2.0 module based on Ultra Low Power NXP i.MX8-X series

          • NXP i.MX8-X ARM Cortex-A35 and Cortex-M4F
          • Ultra Low Power 2-5W
          • Industrial grade, improved Reliability and Virtualization
          • 3D Graphics up to two independent HD displays
          • MIPI CSI-2 camera interface
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          Do you want to add further ecosystem parts (carrier boards, memory,...) to your request?

          Value adding ecosystem offerings

          Cooling Solutions

          Carrierboards

          Module services

          Specification

          Formfactor
          SMARC
          CPU
          NXP i.MX8 QuadXPlus (4, ARM Cortex-A35, 1x ARM Cortex-M4F, 4W)
          DRAM
          Up to 4 GByte onboard LPDDR4 memory | 2400 MT/s
          Ethernet
          2 x Gigabit Ethernet
          I/O Interfaces
          5 x USB 2.0 (shared with 1x USB OTG client)
          GPIOs
          2 x FlexCAN
          up to 4x UART (2x with Handshake (1x shared with FlexCAN)
          USB 2.0
          1 x eSPI
          1 x SPI
          I²C bus
          1 x PCI Express™ 3.0 lanes
          1 x SDIO 3.0
          1 x USB 3.0
          optional M.2 1216 WiFi module (soldered down)
          Graphics
          Integrated in NXP i.MX8-X Series single GT7000Lite multimedia GPU
          VPU up to 4K h.265 dec / 1080p h.264 enc/dec) | 3D Graphics with up to 4 high performance vec4 shaders and 16 execution units up to 2 independent displays | OpenGL ES 3.1 | Vulcan VX extensions | OpenCL 1.2 EP | OpenVG 1.1i
          Security
          High Assurance Boot support | Inline Encryption Engine (AES-128) TNG, AES-128, AES-256, 3DES, ARC4, RSA4096, SHA-1, SHA-2, SHA-256, MD-5 | RSA-1024, 2048, 3072, 4096
          Operating Systems
          Android
          Linux
          Yocto
          Video Interfaces
          1 x dual channel or 2x single channel LVDS 24 bit | 2x MIPI-DSI with 4-lanes shared with LVDS | 1x MIPI-CSI 4-lanes
          Size
          82 x 50 mm (3,23” x 1,97”)

          Documents

          All documents found on this page are updated without notification. Always check this page for the latest version.

          Data Sheet

          Data Sheet for conga-SMX8X
          30.10.2024

          Manual

          User's Guide for conga-SMX8X
          03.02.2025
          conga-SMX8X software Documentation

          Software

          [ Android ]      [ yocto ]     

          Android

          Link
          In order to fetch and build the Yocto-/Android-BSP for conga-SMX8-X, please follow:
          https://congatec.atlassian.net/wiki/spaces/I8D/pages/2654221/BSPs+conga-SMX8-X+conga-SMX8-X

          yocto

          Link
          In order to fetch and build the Yocto-/Android-BSP for conga-SMX8-X, please follow:
          https://congatec.atlassian.net/wiki/spaces/I8D/pages/2654221/BSPs+conga-SMX8-X+conga-SMX8-X

          Product Variants

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              There are 1,000's of possible configurations of our products, and therefore every possible configuration may not be shown with this tool.
              If you don't find the configuration you require contact your congatec Sales representative for further assistance.
              conga-SMX8-X/i-QXP-4G eMMC16 (P/N 051110)

              SMARC 2.0 module ultra low power NXP i.MX8 QuadXPlus processor with 4x ARM Cortex-A35 and 1x ARM Cortex-M4F, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Industrial temperature range.

              conga-SMX8-X/i-QXP-2G eMMC16 (P/N 051113)

              SMARC 2.0 module with ultra low-power NXP i.MX8-X QuadXPlus processor with 4x ARM Cortex-A35 and 1x ARM Cortex-M4F, 2GB onboard LPDDR4 memory and 16GB onboard eMMC. Industrial temperature range.

              Ecosystem Details

              Cooling Solutions

              conga-SMX8-X/i-CSP-B (P/N 051150)

              Passive cooling solution for SMARC module conga-SMX8-X with lidded NXP i.MX 8X ARM processor. All standoffs are with 2.7mm bore hole.

              conga-SMX8-X/i-HSP-B (P/N 051151)

              Heat spreader solution for SMARC module conga-SMX8-X with lidded NXP i.MX 8X ARM processor. All standoffs are with 2.7mm bore hole.

              Carrierboards

              conga-SEVAL (P/N 007010)

              Evaluation Carrier Board for SMARC 2.0 modules.

              conga-SMC1/SMARC-ARM (P/N 020750)

              Compact sized SMARC 2.0 Carrier Board for ARM based SMARC Modules

              Module services

              Design-In Training (P/N 27000001)

              Design-Training to develop carrier boards for Computer on Modules

              Conformal Coating Qseven, SMARC, Type 10 (P/N )

              HumiSeal® 1A33 coating for Qseven, SMARC and Type 10 modules; MIL-I-46058C qualified, IPC-CC-830 and RoHS
              Directive 2002/95/EC compliant and recognized under UL File Number E105698.

              Ext. temperature screening (-40°C to +85°C) (P/N )

              congatec Wide Temperature Range Screening
              Standard screening profile with 12h temperature screening and cold soak test
              Including functional test and several boot-ups (before & after screening)

              Ext. temperature screening (-25°C to +80°C) (P/N )

              congatec Wide Temperature Range Screening
              Standard screening profile with 12h temperature screening and cold soak test
              Including functional test and several boot-ups (before & after screening)

              Accessories

              More about conga-SEVAL

              conga-SEVAL

              Evaluation Carrier Board compatible with SMARC modules

              More about conga-SMC1/SMARC-ARM

              conga-SMC1/SMARC-ARM

              Compact sized Carrier Board for ARM based SMARC 2.0 modules