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conga-QMX6

Qseven quad core ARM Module

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            conga-QMX6

            Qseven quad core ARM Module

            • Based on NXP i.MX6 ARM Cortex A9 processors
            • Extended temperature range (optional)
            • Low power dissipation
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            Value adding ecosystem offerings

            Cooling Solutions

            Add-On Cards

            Carrierboards

            Module services

            Specification

            Formfactor
            Qseven
            CPU
            NXP i.MX6 Solo ARM Cortex A9 (1 x 1.0 GHz, 512kB L2 cache, 3W)
            NXP i.MX6 Dual ARM Cortex A9 (2 x 1.0 GHz, 1MB L2 cache, 3W)
            NXP i.MX6 Quad ARM Cortex A9 (4 x 1.0 GHz, 1MB L2 cache, 3W)
            NXP i.MX6 Dual Lite ARM Cortex A9 (2 x 1.0 GHz, 512kB L2 cache, 3W)
            DRAM
            Up to 4 GByte onboard DDR3L memory | 1066 MT/s
            Ethernet
            Gigabit Ethernet
            I/O Interfaces
            4 x USB 2.0
            1 x SATA
            1 x SDIO
            1 x I²C bus
            1 x CAN Bus
            1 x PCIe 2.0
            1 x USB OTG client
            1 x SPI
            Graphics
            Integrated in NXP i.MX6 Series Video (VPU) | 2D Graphics (GPU2D) and 3D Graphics (GPU3D) | 3D graphics with 4 shaders up to 200MT/s dual stream 1080p/720p decoder/encoder. OpenGL | OpenCL and OpenVG 1.1
            Operating Systems
            Android
            Windows Embedded Compact 7
            Linux
            BSPs with OS drivers and tools
            Temperature

            Operating: 0 to +60°C commercial grade | -40 t o +85°C industrial grade / Storage: -40 to +85°C
            Humidity
            Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.
            Video Interfaces
            1 x DDI
            LVDS 2x24
            Size
            70 x 70 mm (2,75" x 2,75")

            Documents

            All documents found on this page are updated without notification. Always check this page for the latest version.

            Data Sheet

            Product Variants

            Product Filter:

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              There are 1,000's of possible configurations of our products, and therefore every possible configuration may not be shown with this tool.
              If you don't find the configuration you require contact your congatec Sales representative for further assistance.
              conga-QMX6/SC-1G eMMC32 (P/N 016300)

              Qseven module with ultra low power NXP i.MX6 ARM Cortex-A9 1GHz Solo processor, 512kB L2 cache, 1GB onboard DDR3L memory and 32GB onboard eMMC. Commercial temperature range 0°C to 60°C.

              conga-QMX6/DCL-1G eMMC32 (P/N 016301)

              Qseven module with ultra low power NXP i.MX6 ARM Cortex-A9 1GHz Dual Lite processor, 512kB L2 cache, 1GB onboard DDR3L memory and 32GB onboard eMMC. Commercial temperature range 0°C to 60°C.

              conga-QMX6/DC-1G eMMC32 (P/N 016302)

              Qseven module with ultra low power NXP i.MX6 ARM Cortex-A9 1GHz Dual processor, 1MB L2 cache, 1GB onboard DDR3L memory and 32GB onboard eMMC. Commercial temperature range 0°C to 60°C.

              conga-QMX6/QC-1G eMMC32 (P/N 016303)

              Qseven module with ultra low power NXP i.MX6 ARM Cortex-A9 1GHz Quad processor, 1MB L2 cache, 1GB onboard DDR3L memory and 32GB onboard eMMC. Commercial temperature range 0°C to 60°C.

              conga-QMX6/QC-2G eMMC32 (P/N 016304)

              Qseven module with ultra low power NXP i.MX6 ARM Cortex-A9 1GHz Quad processor, 1MB L2 cache, 2GB onboard DDR3L memory and 32GB onboard eMMC. Commercial temperature range 0°C to 60°C.

              conga-QMX6/iSC-1G eMMC32 (P/N 016310)

              Qseven module with ultra low power NXP i.MX6 ARM Cortex-A9 800MHz Solo processor, 512kB L2 cache, 1GB onboard DDR3L memory and 32GB onboard eMMC. Industrial temperature range -40°C to 85°C.

              conga-QMX6/iDCL-1G eMMC32 (P/N 016311)

              Qseven module with ultra low power NXP i.MX6 ARM Cortex-A9 800MHz Dual Lite processor, 512kB L2 cache, 1GB onboard DDR3L memory and 32GB onboard eMMC. Industrial temperature range -40°C to 85°C.

              conga-QMX6/iDC-1G eMMC32 (P/N 016312)

              Qseven module with ultra low power NXP i.MX6 ARM Cortex-A9 800MHz Dual processor, 1MB L2 cache, 1GB onboard DDR3L memory and 32GB onboard eMMC. Industrial temperature range -40°C to 85°C

              conga-QMX6/iQC-1G eMMC32 (P/N 016313)

              Qseven module with ultra low power NXP i.MX6 ARM Cortex-A9 800MHz Quad processor, 1MB L2 cache, 1GB onboard DDR3L memory and 32GB onboard eMMC. Industrial temperature range -40°C to 85°C.

              Ecosystem Details

              Cooling Solutions

              QMX6/HSP1-T (P/N 016160)

              Standard heatspreader with 1mm gap pad for Qseven module conga-QMX6 for processors with LIDDED FCBGA package.

              QMX6/HSP2-T (P/N 016161)

              Standard heatspreader with 2mm gap pad for Qseven module conga-QMX6 for processors with plastic MAP BGA package.

              QMX6/HSP3-T (P/N 016162)

              Standard heatspreader with heat stack solution for Qseven module conga-QMX6 for processors with open silicon FCBGA package.

              Add-On Cards

              conga-Qseven/MFG-Serial-Adapter (P/N 011127)

              MFG-header adapter on the QEV2 baseboard for RS-232 console-communication with UMX6 / QMX6.

              This adapter provides the ability to access the console in/output of the conga-QMX6 and mainly the conga-UMX6 product family (due to the fact that there isn't any console-connector on the conga-UMX6 module) via the MFG-header on the congatec part number 007005 conga-QEVAL/Qseven 2.0 ARM evaluation carrier board.

              Carrierboards

              conga-QEVAL/Qseven 2.0 ARM (P/N 007005)

              Evaluation carrier board for Qseven 2.0 modules based on ARM architecture.

              Module services

              Design-In Training (P/N 27000001)

              Design-Training to develop carrier boards for Computer on Modules

              Conformal Coating Qseven, SMARC, Type 10 (P/N )

              HumiSeal® 1A33 coating for Qseven, SMARC and Type 10 modules; MIL-I-46058C qualified, IPC-CC-830 and RoHS
              Directive 2002/95/EC compliant and recognized under UL File Number E105698.

              Ext. temperature screening (-40°C to +85°C) (P/N )

              congatec Wide Temperature Range Screening
              Standard screening profile with 12h temperature screening and cold soak test
              Including functional test and several boot-ups (before & after screening)

              Ext. temperature screening (-25°C to +80°C) (P/N )

              congatec Wide Temperature Range Screening
              Standard screening profile with 12h temperature screening and cold soak test
              Including functional test and several boot-ups (before & after screening)

              Accessories

              More about conga-QEVAL/Qseven 2.0

              conga-QEVAL/Qseven 2.0

              To achieve a quick start with Qseven congatec offers an evaluation carrier board, which routes all the Qseven® signals to standard interface connectors.

              More about conga-MCB/Qseven-ARM (EOL)

              conga-MCB/Qseven-ARM (EOL)

              The conga-MCB/ARM is a full featured carrier board for Qseven ARM modules.

              More about conga-QKIT/ARM (EOL)

              conga-QKIT/ARM (EOL)

              This complete kit provides the ability to start evaluating Qseven® ARM modules immediately

              More about conga-LDVI

              conga-LDVI

              DVI Converter Module for LVDS

              More about conga-FPA2 (EOL)

              conga-FPA2 (EOL)

              Universal Flat Panel Adapter Board