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conga-TCR8

COM Express Type 6 Compact module based on AMD Ryzen Embedded 8000 processor series

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Value adding ecosystem offerings


Virtualization

Operating Systems

Cooling Solutions

Carrierboards

Memory

Module services

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conga-TCR8

COM Express Type 6 Compact module based on AMD Ryzen Embedded 8000 processor series

Virtualization Ready
  • Up to 8 Zen 4 cores
  • AMD Radeon™ RDNA™ 3 Graphics
  • AMD XDNA™ NPU
  • Up to 96 GB RAM (optional with ECC)
  • TDP Range from 15W to 54W
  • Onboard NVMe™ SSD (option)
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Do you want to add further ecosystem parts (carrier boards, memory,...) to your request?

Value adding ecosystem offerings

Virtualization

Operating Systems

Cooling Solutions

Carrierboards

Memory

Module services

Specification

Formfactor
COM Express Compact
CPU
AMD Ryzen™ Embedded 8640U (6 cores 3.2GHz up to 4.9GHz, 22MB cache)
AMD Ryzen™ Embedded 8645HS (6 cores 4.3GHz up to 5GHz, 22MB cache)
AMD Ryzen™ Embedded 8840U (8 cores 3.3GHz up to 5.1GHz, 24MB cache)
AMD Ryzen™ Embedded 8845HS (8 cores 3.8GHz up to 5.1GHz, 24MB cache)
DRAM
2 SO-DIMM sockets for DDR5 memory modules up to 48 GB each (max. 96 GB RAM system capacity) |up to 5600 MT/s | ECC (option)
Ethernet
2.5 GbE via Intel® i226 Ethernet controller series
I/O Interfaces
4 x USB 3.2 Gen2
4 x USB 2.0
2 x SATA 6Gb/s (if NVMe™ SSD option is not used)
6 x PCIe Gen4 (8 lanes)
PEG x8 Gen4
1 x I²C bus
1 x GPSPI
2 x UART
8 x GPIO
1 x SM-Bus
1 x LPC
Mass storage
NVMe™ SSD up to 1 TB capacity (option instead of SATA ports)
Graphics
Integrated AMD Radeon™ RDNA™ 3 Graphics with up to 6x WGPs (12 CUs)
NPU/AI Acceleration
Integrated XDNA™ NPU with up to 16 TOPs | Up to 39 TOPs total SoC performance
congatec Board Controller
Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection
embedded BIOS Features
AMI Aptio® UEFI firmware
32 Mbyte serial SPI with congatec Embedded BIOS feature
OEM Logo
OEM CMOS Defaults
LCD Control
Display Auto Detection
Backlight Control
Flash Update
Security
Trusted Platform Module (TPM 2.0) | AMD Secure Processor | AMD Memory Guard
Power Management
ACPI 6.0 with battery support
Operating Systems
Microsoft® Windows 11
Microsoft® Windows 11 IoT Enterprise
Microsoft® Windows® 10
Microsoft® Windows 10 IoT Enterprise
Linux
Hypervisor
RTS Real-Time Hypervisor
Temperature
Embedded Temp.: Operating 0°C to 60°C | Storage -20°C to 80°C
Humidity
Operating: 10 to 85% r. H. non cond. / Storage 5 to 85% r. H. non cond.
Video Interfaces
Up to 3x DDI
LVDS or eDP
4 x independent displays
Size
95 x 95 mm (3,74" x 3,74")

Documents

All documents found on this page are updated without notification. Always check this page for the latest version.

Data Sheet

Data Sheet for conga-TCR8
07.01.2025

Product Variants

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    There are 1,000's of possible configurations of our products, and therefore every possible configuration may not be shown with this tool.
    If you don't find the configuration you require contact your congatec Sales representative for further assistance.
    conga-TCR8/8845HS (P/N 051700)

    COM Express Type 6 Compact module based on AMD Ryzen™ Embedded 8845HS with 8 cores | 3.8GHz up to 5.1GHz (boost) | Integrated XDNA™ NPU | Integrated RDNA™ 3 Graphics | 24MB cache | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial temperature range 0 to +60°C.

    conga-TCR8/8840U (P/N 051701)

    COM Express Type 6 Compact module based on AMD Ryzen™ Embedded 8840U with 8 cores | 3.3GHz up to 5.1GHz (boost) | Integrated XDNA™ NPU | Integrated RDNA™ 3 Graphics | 24MB cache | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial temperature range 0 to +60°C.

    conga-TCR8/8645HS (P/N 051702)

    COM Express Type 6 Compact module based on AMD Ryzen™ Embedded 8645HS with 6 cores | 4.3GHz up to 5.0GHz (boost) | Integrated XDNA™ NPU | Integrated RDNA™ 3 Graphics | 22MB cache | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial temperature range 0 to +60°C.

    conga-TCR8/8640U (P/N 051703)

    COM Express Type 6 Compact module based on AMD Ryzen™ Embedded 8640U with 6 cores | 3.2GHz up to 4.9GHz (boost) | Integrated XDNA™ NPU | Integrated RDNA™ 3 Graphics | 22MB cache | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial temperature range 0 to +60°C.

    Ecosystem Details

    Virtualization

    RTS Hypervisor (P/N 300501)

    Operating Systems

    ctrlX OS (P/N )
    Ubuntu Pro (P/N N/A)

    Cooling Solutions

    conga-TCR8/CSA-HP-B (P/N 051750)

    Standard active cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes and 12V fan. All standoffs are with 2.7mm bore hole.

    conga-TCR8/CSA-HP-T (P/N 051751)

    Standard active cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes and 12V fan. All standoffs are M2.5mm threaded.

    conga-TCR8/CSP-HP-B (P/N 051752)

    Standard passive cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes. All standoffs are with 2.7mm bore hole.

    conga-TCR8/CSP-HP-T (P/N 051753)

    Standard passive cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes. All standoffs are M2.5mm threaded.

    conga-TCR8/HSP-HP-B (P/N 051754)

    Standard heatspreader for high performance COM Express module conga-TCR8 with integrated heat pipes. All standoffs are with 2.7mm bore hole.

    conga-TCR8/HSP-HP-T (P/N 051755)

    Standard heatspreader for high performance COM Express module conga-TCR8 with integrated heat pipes. All standoffs are M2.5mm threaded.

    Carrierboards

    conga-TEVAL3/COMe3.1 (P/N 065820)

    congatec COM Express Type 6 evaluation carrier compliant to COM Express 3.1 specification. Industrial temperature range. From -40°C to 85°C

    Memory

    DDR5-SODIMM-5600 (8GB) (P/N 068930)

    DDR5 SODIMM memory module with up to 5600 MT/s and 8GB RAM, commercial temp 0°C to +60°C

    DDR5-SODIMM-5600 (16GB) (P/N 068931)

    DDR5 SODIMM memory module with up to 5600 MT/s and 16GB RAM, commercial temp 0°C to +60°C

    DDR5-SODIMM-5600 (32GB) (P/N 068932)

    DDR5 SODIMM memory module with up to 5600 MT/s and 32GB RAM, commercial temp 0°C to +60°C

    DDR5-SODIMM-5600 (48GB) (P/N 068933)

    DDR5 SODIMM memory module with up to 5600 MT/s and 48GB RAM, commercial temp 0°C to +60°C

    DDR5-SODIMM-5600 ECC (8GB) (P/N 68940)

    DDR5 SODIMM memory module with up to 5600 MT/s and 8GB RAM with ECC, commercial temp 0°C to +60°C

    DDR5-SODIMM-5600 ECC (16GB) (P/N 68941)

    DDR5 SODIMM memory module with up to 5600 MT/s and 16GB RAM with ECC, commercial temp 0°C to +60°C

    DDR5-SODIMM-5600 ECC (32GB) (P/N 68942)

    DDR5 SODIMM memory module with up to 5600 MT/s and 32GB RAM with ECC, commercial temp 0°C to +60°C

    DDR5-SODIMM-5600 ECC (48GB) (P/N 68943)

    DDR5 SODIMM memory module with up to 5600 MT/s and 48GB RAM with ECC, commercial temp 0°C to +60°C

    Module services

    Design-In Training (P/N 27000001)

    Design-Training to develop carrier boards for Computer on Modules

    Conformal Coating COM Express Basic and Compact (P/N )

    HumiSeal® 1A33 coating for COM Express Basic and Compact modules; MIL-I-46058C qualified, IPC-CC-830 and
    RoHS Directive 2002/95/EC compliant and recognized under UL File Number E105698.