COM Express Type 6 Basic module with Intel® Xeon® Processor E3-1258L v4 Quad Core CPU with 1.8GHz, 47W, GT2 Graphics
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conga-TS97 (EOL)
COM Express® Type6 module based on 5th Generation Intel® Core i7 quad core processor and Intel® Xeon® E3-12xx processors
- 5th Gen. Intel® Core™ i7 quad core processor and Intel® Xeon® E3-12xx processors
- Up to Intel® Iris™ Pro Graphics P6300
- 3x DisplayPort 1.2, up to 4k resolution
- Intel® AVX 2.0 Vector extension for improved floating point computing
Specification
with OpenCL 1.2, OpenGL 4.0 and DirectX11.1 support; up to three independent displays: DDI, DVI, DP, VGA
Operating: 0 to +60°C Storage: -20 to +80°C
Documents
Data Sheet
Manual
Software
Use for BIOS update or customization and panel configuration. Linux source version.
Use for BIOS update or customization and panel configuration.
Use for BIOS update or customization and panel configuration.
Use for BIOS update or customization and panel configuration.
Use for BIOS update or customization and panel configuration.
Use for BIOS update or customization and panel configuration.
Product Variants
COM Express Type 6 Basic module with Intel® Xeon® Processor E3-1278L v4 Quad Core CPU with 2.0GHz, 47W, GT3 Graphics
COM Express Type 6 Basic module with Intel® Core™ i7-5700EQ Processor Quad Core CPU with 2.6GHz, 47W, GT2 Graphics
COM Express Type 6 Basic module with Intel® Core™ i7-5850EQ Processor Quad Core CPU with 2.7GHz, 47W, GT3 Graphics
Ecosystem Details
Carrierboards
Evaluation Carrier Board for COM Express Type 6 Modules.
Cooling solutions
Standard passive cooling solution for high performance COM Express module conga-TS87 and TS97 with flat heat pipes | 15mm fins and 20mm overall heat sink height. All standoffs are M2.5mm threaded
Standard passive cooling solution for high performance COM Express module conga-TS87 and TS97 with flat heat pipes | 15mm fins and 20mm overall heat sink height. All standoffs are with 2.7 mm bore hole
Standard active cooling solution for high performance COM Express module conga-TS87 and TS97 with flat heat pipes | 15mm fins | 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm threaded
Standard active cooling solution for high performance COM Express module conga-TS87 and TS97 with flat heat pipes | 15mm fins | 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole
Standard heatspreader for high performance COM Express module conga-TS87 and TS97 with flat heat pipes. All standoffs are M2.5mm threaded
Standard heatspreader for high performance COM Express module conga-TS87 and TS97 with flat heat pipes. All standoffs are with 2.7mm bore hole
Memory
DDR3L SODIMM memory module with 1600MT/s (PC3L-12800S) and 2GB RAM.
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 8GB RAM.
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 4GB RAM.
DDR3L SODIMM, 1,35V &1,5V memory module with 1600 MT/s and 16GB RAM
Accessories
conga-LDVI
DVI Converter Module for LVDS
conga-TEVAL/COMe 2.1 (EOL)
Evaluation Carrier Board for COM Express® Type 6 Modules Rev. 2.1