COM Express Type 6 Compact module based on AMD Ryzen™ Embedded V2748 8-core processor with 2.9GHz up to 4.25GHz boost freq., 4MB L2 cache, Radeon™ Vega Graphics with 7 CU and dual channel DDR4 3200 MT/s memory interface with ECC support. Commercial temperature range 0 to +60°C.
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Software
Use for BIOS update or customization and panel configuration. Linux source version.
Important note: Only compatible with cgos 1.03.032 and older!
Important note: Only compatible with cgos 1.03.032 and older!
Important note: Only compatible with cgos 1.03.032 and older!
Important note: Only compatible with cgos 1.03.032 and older!
Product Variants
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- Ubuntu Linux LTS
- Microsoft® Windows 11 IoT Enterprise
- RTOS
- QNX
- Microsoft® Windows 11
- Microsoft® Windows IoT 10 Core
- Microsoft® Windows 10 IoT Enterprise
- Microsoft® Windows® 10 (64bit only)
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- Microsoft® Windows® CE 7.0
- Embedded POS Ready
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- Microsoft Windows 8 embedded
- Microsoft® Windows® 8.1
- BSPs with OS drivers and tools
- Microsoft® Windows® 7/8 embedded Standard
- Microsoft® Windows Server 2016
- RHEL 6.8 & 7.2
- SUSE 12 SP1
- Fedora 22
- Ubuntu 14.10
- CentOS 6.6 & 7.1
- FreeBSD 10.3 & 11
- Yocto v2.0 (Jethro), Kernel 4.1
- VMware
- Microsoft® Windows Server 2012 R2
- Microsoft® Windows Server 2012
- Microsoft® Windows Server 2008 R2 SP1
- RHEL 6.6 & 7.1
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- Microsoft® Windows 10 (64bit only)
- Fedora 24
- Ubuntu
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- Red Hat Enterprise
- Yocto Project v2.2
- Chromium 2
- Wind River VxWorks
- Microsoft® Windows 10 IoT Enterprise (64bit only)
- RTS Hypervisor
If you don't find the configuration you require contact your congatec Sales representative for further assistance.
COM Express Type 6 Compact module based on AMD Ryzen™ Embedded V2546 6-core processor with 3.0GHz up to 3.95GHz boost freq., 3MB L2 cache, Radeon™ Vega Graphics with 6 CU and dual channel DDR4 3200 MT/s memory interface with ECC support. Commercial temperature range 0 to +60°C.
COM Express Type 6 Compact module based on AMD Ryzen™ Embedded V2718 8-core processor with 1.7GHz up to 4.15GHz boost freq., 4MB L2 cache, Radeon™ Vega Graphics with 7 CU and dual channel DDR4 3200 MT/s memory interface with ECC support. Commercial temperature range 0 to +60°C.
COM Express Type 6 Compact module based on AMD Ryzen™ Embedded V2516 6-core processor with 2.1GHz up to 3.95GHz boost freq., 3MB L2 cache, Radeon™ Vega Graphics with 6 CU and dual channel DDR4 3200 MT/s memory interface with ECC support. Commercial temperature range 0 to +60°C.
Ecosystem Details
Cooling Solutions
Standard active cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are with
2.7mm bore hole.
Standard active cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.
Standard passive cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are with 2.7mm bore hole.
Standard passive cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are M2.5mm thread.
Standard heatspreader for high performance COM Express module conga-TCV2 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole.
Standard heatspreader for high performance COM Express module conga-TCV2 with integrated heat pipes, 11mm overall heat sink height. All standoffs are M2.5mm thread.
Memory
DDR4 SODIMM memory module with 3200 MT/s and 4GB RAM
DDR4 SODIMM memory module with 3200 MT/s and 8GB RAM
DDR4 SODIMM memory module with 3200 MT/s and 16GB RAM
DDR4 ECC SODIMM memory module with 3200 MT/s and 4GB RAM
DDR4 ECC SODIMM memory module with 3200 MT/s and 8GB RAM
DDR4 ECC SODIMM memory module with 3200 MT/s and 16GB RAM
Carrierboards
Evaluation carrier board for COM Express Type6 Rev. 3.0 modules.
Module services
Design-Training to develop carrier boards for Computer on Modules
HumiSeal® 1A33 coating for COM Express Basic and Compact modules; MIL-I-46058C qualified, IPC-CC-830 and
RoHS Directive 2002/95/EC compliant and recognized under UL File Number E105698.
congatec Wide Temperature Range Screening
Standard screening profile with 12h temperature screening and cold soak test
Including functional test and several boot-ups (before & after screening)
congatec Wide Temperature Range Screening
Standard screening profile with 12h temperature screening and cold soak test
Including functional test and several boot-ups (before & after screening)
Accessories
conga-TEVAL/COMe 3.0
Evaluation Carrier Board for COM Express® Type 6 Modules Rev. 3.0