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conga-TCR8

COM Express Type 6 Compact module based on AMD Ryzen Embedded 8000 processor series

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                conga-TCR8

                COM Express Type 6 Compact module based on AMD Ryzen Embedded 8000 processor series

                Virtualization Ready
                • Up to 8 Zen 4 cores
                • AMD Radeon™ RDNA™ 3 Graphics
                • AMD XDNA™ NPU
                • Up to 96 GB RAM (optional with ECC)
                • TDP Range from 15W to 54W
                • Onboard NVMe™ SSD (option)
                Congatec Logo
                Do you want to add further ecosystem parts (carrier boards, memory,...) to your request?

                Value adding ecosystem offerings

                Virtualization

                Operating Systems

                Cooling Solutions

                Carrierboards

                Memory

                Module services

                Specification

                Formfactor
                COM Express Compact
                CPU
                AMD Ryzen™ Embedded 8640U (6 cores 3.2GHz up to 4.9GHz, 22MB cache)
                AMD Ryzen™ Embedded 8645HS (6 cores 4.3GHz up to 5GHz, 22MB cache)
                AMD Ryzen™ Embedded 8840U (8 cores 3.3GHz up to 5.1GHz, 24MB cache)
                AMD Ryzen™ Embedded 8845HS (8 cores 3.8GHz up to 5.1GHz, 24MB cache)
                DRAM
                2 SO-DIMM sockets for DDR5 memory modules up to 48 GB each (max. 96 GB RAM system capacity) |up to 5600 MT/s | ECC (option)
                Ethernet
                2.5 GbE via Intel® i226 Ethernet controller series
                I/O Interfaces
                4 x USB 3.2 Gen2
                4 x USB 2.0
                2 x SATA 6Gb/s (if NVMe™ SSD option is not used)
                6 x PCIe Gen4 (8 lanes)
                PEG x8 Gen4
                1 x I²C bus
                1 x GPSPI
                2 x UART
                8 x GPIO
                1 x SM-Bus
                1 x LPC
                Mass storage
                NVMe™ SSD up to 1 TB capacity (option instead of SATA ports)
                Graphics
                Integrated AMD Radeon™ RDNA™ 3 Graphics with up to 6x WGPs (12 CUs)
                NPU/AI Acceleration
                Integrated XDNA™ NPU with up to 16 TOPs | Up to 39 TOPs total SoC performance
                congatec Board Controller
                Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection
                embedded BIOS Features
                AMI Aptio® UEFI firmware
                32 Mbyte serial SPI with congatec Embedded BIOS feature
                OEM Logo
                OEM CMOS Defaults
                LCD Control
                Display Auto Detection
                Backlight Control
                Flash Update
                Security
                Trusted Platform Module (TPM 2.0) | AMD Secure Processor | AMD Memory Guard
                Power Management
                ACPI 6.0 with battery support
                Operating Systems
                Microsoft® Windows 11
                Microsoft® Windows 11 IoT Enterprise
                Microsoft® Windows® 10
                Microsoft® Windows 10 IoT Enterprise
                Linux
                Hypervisor
                RTS Real-Time Hypervisor
                Temperature
                Embedded Temp.: Operating 0°C to 60°C | Storage -20°C to 80°C
                Humidity
                Operating: 10 to 85% r. H. non cond. / Storage 5 to 85% r. H. non cond.
                Video Interfaces
                Up to 3x DDI
                LVDS or eDP
                4 x independent displays
                Size
                95 x 95 mm (3,74" x 3,74")

                Documents

                All documents found on this page are updated without notification. Always check this page for the latest version.

                Data Sheet

                Data Sheet for conga-TCR8
                07.01.2025

                Product Variants

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                  There are 1,000's of possible configurations of our products, and therefore every possible configuration may not be shown with this tool.
                  If you don't find the configuration you require contact your congatec Sales representative for further assistance.
                  conga-TCR8/8845HS (P/N 051700)

                  COM Express Type 6 Compact module based on AMD Ryzen™ Embedded 8845HS with 8 cores | 3.8GHz up to 5.1GHz (boost) | Integrated XDNA™ NPU | Integrated RDNA™ 3 Graphics | 24MB cache | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial temperature range 0 to +60°C.

                  conga-TCR8/8840U (P/N 051701)

                  COM Express Type 6 Compact module based on AMD Ryzen™ Embedded 8840U with 8 cores | 3.3GHz up to 5.1GHz (boost) | Integrated XDNA™ NPU | Integrated RDNA™ 3 Graphics | 24MB cache | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial temperature range 0 to +60°C.

                  conga-TCR8/8645HS (P/N 051702)

                  COM Express Type 6 Compact module based on AMD Ryzen™ Embedded 8645HS with 6 cores | 4.3GHz up to 5.0GHz (boost) | Integrated XDNA™ NPU | Integrated RDNA™ 3 Graphics | 22MB cache | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial temperature range 0 to +60°C.

                  conga-TCR8/8640U (P/N 051703)

                  COM Express Type 6 Compact module based on AMD Ryzen™ Embedded 8640U with 6 cores | 3.2GHz up to 4.9GHz (boost) | Integrated XDNA™ NPU | Integrated RDNA™ 3 Graphics | 22MB cache | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial temperature range 0 to +60°C.

                  Ecosystem Details

                  Virtualization

                  RTS Hypervisor (P/N 300501)

                  Operating Systems

                  ctrlX OS (P/N )
                  Ubuntu Pro (P/N N/A)

                  Cooling Solutions

                  conga-TCR8/CSA-HP-B (P/N 051750)

                  Standard active cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes and 12V fan. All standoffs are with 2.7mm bore hole.

                  conga-TCR8/CSA-HP-T (P/N 051751)

                  Standard active cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes and 12V fan. All standoffs are M2.5mm threaded.

                  conga-TCR8/CSP-HP-B (P/N 051752)

                  Standard passive cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes. All standoffs are with 2.7mm bore hole.

                  conga-TCR8/CSP-HP-T (P/N 051753)

                  Standard passive cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes. All standoffs are M2.5mm threaded.

                  conga-TCR8/HSP-HP-B (P/N 051754)

                  Standard heatspreader for high performance COM Express module conga-TCR8 with integrated heat pipes. All standoffs are with 2.7mm bore hole.

                  conga-TCR8/HSP-HP-T (P/N 051755)

                  Standard heatspreader for high performance COM Express module conga-TCR8 with integrated heat pipes. All standoffs are M2.5mm threaded.

                  Carrierboards

                  conga-TEVAL3/COMe3.1 (P/N 065820)

                  congatec COM Express Type 6 evaluation carrier compliant to COM Express 3.1 specification. Industrial temperature range. From -40°C to 85°C

                  Memory

                  DDR5-SODIMM-5600 (8GB) (P/N 068930)

                  DDR5 SODIMM memory module with up to 5600 MT/s and 8GB RAM, commercial temp 0°C to +60°C

                  DDR5-SODIMM-5600 (16GB) (P/N 068931)

                  DDR5 SODIMM memory module with up to 5600 MT/s and 16GB RAM, commercial temp 0°C to +60°C

                  DDR5-SODIMM-5600 (32GB) (P/N 068932)

                  DDR5 SODIMM memory module with up to 5600 MT/s and 32GB RAM, commercial temp 0°C to +60°C

                  DDR5-SODIMM-5600 (48GB) (P/N 068933)

                  DDR5 SODIMM memory module with up to 5600 MT/s and 48GB RAM, commercial temp 0°C to +60°C

                  DDR5-SODIMM-5600 ECC (8GB) (P/N 68940)

                  DDR5 SODIMM memory module with up to 5600 MT/s and 8GB RAM with ECC, commercial temp 0°C to +60°C

                  DDR5-SODIMM-5600 ECC (16GB) (P/N 68941)

                  DDR5 SODIMM memory module with up to 5600 MT/s and 16GB RAM with ECC, commercial temp 0°C to +60°C

                  DDR5-SODIMM-5600 ECC (32GB) (P/N 68942)

                  DDR5 SODIMM memory module with up to 5600 MT/s and 32GB RAM with ECC, commercial temp 0°C to +60°C

                  DDR5-SODIMM-5600 ECC (48GB) (P/N 68943)

                  DDR5 SODIMM memory module with up to 5600 MT/s and 48GB RAM with ECC, commercial temp 0°C to +60°C

                  Module services

                  Design-In Training (P/N 27000001)

                  Design-Training to develop carrier boards for Computer on Modules

                  Conformal Coating COM Express Basic and Compact (P/N )

                  HumiSeal® 1A33 coating for COM Express Basic and Compact modules; MIL-I-46058C qualified, IPC-CC-830 and
                  RoHS Directive 2002/95/EC compliant and recognized under UL File Number E105698.