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  • conga-TC370 - COM Express Compact Module with Intel® „Whiskey Lake U“ Core™ Mobile CPUs

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conga-TC370

COM Express Type 6 Compact module based on 8th Generation Intel® Core™ processor family

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            conga-TC370

            COM Express Type 6 Compact module based on 8th Generation Intel® Core™ processor family

            • 8th Generation Intel® Core™ SOC processor
            • Up to 4 cores at low-power TDP of 15W
            • New Intel® Gen 9 HD Graphics
            • Optional eMMC 5.1 on board mass storage
            • COM Express Compact Type 6 module 95x95 mm²
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            Specification

            Formfactor
            COM Express Compact
            CPU
            Intel® Core™ i7-8665UE (4 x 1.7 GHz, 8MB cache, 15W)
            Intel® Core™ i5-8365UE (4 x 1.6 GHz, 6MB cache, 15W)
            Intel® Core™ i3-8145UE (2 x 2.2 GHz, 4MB cache, 15W)
            Intel® Celeron® 4305UE (2 x 2.0 GHz, 2MB cache, 15W)
            DRAM
            Dual channel DDR4 up to 2400 MT/s | 2x SO-DIMM | up to 2x 32 Gbyte
            Ethernet
            1x Gigabit Ethernet | Intel i219LM
            I/O Interfaces
            8 x PCI Express GEN 3.0 lanes
            3 x Serial ATA® Gen 3 (can be configured as RAID)
            4 x USB 3.1 Gen2
            8 x USB 2.0
            LPC bus (no DMA)
            I²C bus
            2 x UART
            Graphics
            Intel® Gen9 HD Graphics Engine with OpenCL 2.1, OpenGL 4.5 and DirectX12 (for Windows 10) support
            up to three independent displays: DDI / DisplayPort 1.2 / eDP 1.4 | High performance hardware MPEG-2 decoding | WMV9 (VC-1) and H.265 (HEVC) support
            congatec Board Controller
            Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection
            embedded BIOS Features
            AMI Aptio® 4.X (UEFI) BIOS
            SM-BIOS
            BIOS Update
            Logo Boot
            Quiet Boot
            HDD Password
            Security
            TPM 2.0 Infineon SLB9670
            Operating Systems
            Microsoft® Windows® 10 (64bit only)
            Microsoft® Windows 10 IoT Enterprise (64bit only)
            Linux
            Temperature
            Commercial: Operating Temperature: 0 to +60°C | Storage Temperature: -20 to +80°C
            Extended Temperature
            Screening service on request:
            -25 to +80°C (burn-in & cold-soak) | -40 to +85°C (burn-in & cold-soak)
            Humidity
            Operating: 10 to 85% r. H. non cond. / Storage 5 to 85% r. H. non cond.
            Video Interfaces
            2x DDI | 18/24bit single/dual channel LVDS or eDP | LVDS interface with optional eDP overlay. Configuration of display mode by software
            Size
            95 x 95 mm (3,74" x 3,74")

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