COM Express Type 6 Compact module with Intel® Core™ i7-8665UE quad core processor with 1.7GHz, 8MB L2 cache, GT2 graphics and
2400MT/s dual channel DDR4 memory interface (15W).
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conga-TC370
COM Express Type 6 Compact module based on 8th Generation Intel® Core™ processor family
- 8th Generation Intel® Core™ SOC processor
- Up to 4 cores at low-power TDP of 15W
- New Intel® Gen 9 HD Graphics
- Optional eMMC 5.1 on board mass storage
- COM Express Compact Type 6 module 95x95 mm²
Value adding ecosystem offerings

Cooling Solutions

Memory

Carrierboards

Module services
Specification
up to three independent displays: DDI / DisplayPort 1.2 / eDP 1.4 | High performance hardware MPEG-2 decoding | WMV9 (VC-1) and H.265 (HEVC) support
-25 to +80°C (burn-in & cold-soak) | -40 to +85°C (burn-in & cold-soak)
Documents
Data Sheet
Software
Use for BIOS update or customization and panel configuration. Linux source version.
Important note: Only compatible with cgos 1.03.032 and older!
Important note: Only compatible with cgos 1.03.032 and older!
Important note: Only compatible with cgos 1.03.032 and older!
Product Variants
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- 7.5W W
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- 9.5W W
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- 11.5W W
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- 77W W
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- 100W W
- 100W W
- 100W W
- 118W W
- 135W W
- Ubuntu Linux LTS
- Microsoft® Windows 11 IoT Enterprise
- RTOS
- QNX
- Microsoft® Windows 11
- Microsoft® Windows IoT 10 Core
- Microsoft® Windows 10 IoT Enterprise
- Microsoft® Windows® 10 (64bit only)
- Microsoft® Windows® 10
- Microsoft® Windows 10 Enterprise
- Microsoft® Windows 10 Core Pro
- Microsoft® Windows® 7
- Android
- Linux
- Yocto
- Microsoft® Windows® XP
- Microsoft® Windows® embedded Standard
- Microsoft® Windows® CE 6.0
- Microsoft® Windows® CE 7.0
- Embedded POS Ready
- Windows Embedded Compact 7
- Microsoft Windows 8 embedded
- Microsoft® Windows® 8.1
- BSPs with OS drivers and tools
- Microsoft® Windows® 7/8 embedded Standard
- Microsoft® Windows Server 2016
- RHEL 6.8 & 7.2
- SUSE 12 SP1
- Fedora 22
- Ubuntu 14.10
- CentOS 6.6 & 7.1
- FreeBSD 10.3 & 11
- Yocto v2.0 (Jethro), Kernel 4.1
- VMware
- Microsoft® Windows Server 2012 R2
- Microsoft® Windows Server 2012
- Microsoft® Windows Server 2008 R2 SP1
- RHEL 6.6 & 7.1
- SuSE 11 SP4 & 12 SP1
- Yocto v.2.0 Kernel 4.1
- Wind River VxWorks 7
- ESXi
- Microsoft® Windows IoT Core
- Microsoft® Windows 10 (64bit only)
- Fedora 24
- Ubuntu
- SuSe
- Red Hat Enterprise
- Yocto Project v2.2
- Chromium 2
- Wind River VxWorks
- Microsoft® Windows 10 IoT Enterprise (64bit only)
- RTS Hypervisor
If you don't find the configuration you require contact your congatec Sales representative for further assistance.
COM Express Type 6 Compact module with Intel® Core™ i5-8365UE quad core processor with 1.6GHz, 6MB L2 cache, GT2 graphics and
2400MT/s dual channel DDR4 memory interface (15W).
COM Express Type 6 Compact module with Intel® Core™ i3-8145UE dual core processor with 2.2GHz, 4MB L2 cache, GT2 graphics and
2400MT/s dual channel DDR4 memory interface (15W).
COM Express Type 6 Compact module with Intel® Celeron® Processor 4305UE, dual core with 2.0GHz, 2MB L2 cache, GT1 graphics and
2400MT/s dual channel DDR4 memory interface (15W).
Ecosystem Details
Cooling Solutions
Standard active cooling solution for COM Express Compact modules conga-TC370 with integrated heat pipes, 25.5mm overall cooling
height and integrated 12V fan. Through hole mounting with bore hole standoffs Ø2.7mm.
Standard active cooling solution for COM Express Compact modules conga-TC370 with integrated heat pipes, 25.5mm overall cooling
height and integrated 12V fan. Threaded mounting with threaded standoffs M2.5.
Standard passive cooling solution for COM Express Compact modules conga-TC370 with integrated heat pipes and 24.3mm overall
cooling height. Through hole mounting with bore hole standoffs Ø2.7mm.
Standard passive cooling solution for COM Express Compact modules conga-TC370 with integrated heat pipes and 24.3mm overall
cooling height. Threaded mounting with threaded standoffs M2.5.
Standard heatspreader for COM Express Compact modules conga-TC370 with integrated heat pipes and 11mm overall cooling height.
Through hole mounting with bore hole standoffs Ø2.7mm.
Standard heatspreader for COM Express Compact modules conga-TC370 with integrated heat pipes and 11mm overall cooling height.
Threaded mounting with threaded standoffs M2.5.
Memory
DDR4 SODIMM memory module with 2400 MT/s and 4GB RAM
DDR4 SODIMM memory module with 2400 MT/s and 8GB RAM
DDR4 SODIMM memory module with 2400 MT/s and 16GB RAM
DDR4 SODIMM memory module with 2666 MT/s and 32GB RAM
Carrierboards
Evaluation carrier board for COM Express Type6 Rev. 3.0 modules.
Module services
Design-Training to develop carrier boards for Computer on Modules
HumiSeal® 1A33 coating for COM Express Basic and Compact modules; MIL-I-46058C qualified, IPC-CC-830 and
RoHS Directive 2002/95/EC compliant and recognized under UL File Number E105698.
congatec Wide Temperature Range Screening
Standard screening profile with 12h temperature screening and cold soak test
Including functional test and several boot-ups (before & after screening)
congatec Wide Temperature Range Screening
Standard screening profile with 12h temperature screening and cold soak test
Including functional test and several boot-ups (before & after screening)
Accessories
conga-TEVAL/COMe 3.0
Evaluation Carrier Board for COM Express® Type 6 Modules Rev. 3.0