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conga-HPC/uATX-Server

Application Carrier Board for COM-HPC Server Type Modules (Size D)

Selected module variant

    Selected ecosystem parts

    Carrierboards

      conga-HPC/uATX-Server

      Application Carrier Board for COM-HPC Server Type Modules (Size D)

      • Quick start for COM-HPC Server and Edge Computing
      • Unparalleled feature density
      • Industrial temperature support
      • Scalable µATX carrier board

      Specification


      Formfactor
      Standard Micro-ATX

      Board Variant
      Application Carrier Board for COM-HPC Server Type Modules (Size D)

      Internal Connectors and Features

      • 1x PCIe Gen4 x16
      • 1x PCIe Gen4 x8 (capable of housing x16 cards)
      • 1x M.2 Key B 2242/3042/3052/2280 (USB3.1 Gen1, PCIe, nano SIM) 2x M.2 Key M 2242/2280/22110 (PCIe x4 each)
      • 1x RS232/RS485 (BMC, header)
      • 2x SATA III
      • 1x General Purpose I2C header | 12x GPIO header
      • 4x 4-pin Fan connectors
      • 1x RTC CMOS battery holder
      • 1x SPI boot flash socket
      • 1x Power button + header | 1x Reset button + header
      • 1x ATX power connector 24-pin
      • 1x EPS CPU power connector 8-pin
      • 1x Power LED + header

      External Connectors

      • 4x SFP28/SFP+ cages for various transceiver technologies 1x 1GbE IPMI (BMC)
      • 3x 2.5GbE RJ45 with IEEE1588 support
      • 1x DP
      • 3x USB 3.1 Gen1  (Type A)
      • 1x USB 3.1 Gen1 (Type C)


      Board Management Controller

      • Aspeed AST2600

      Power Management
      ACPI 6.0

      Temperature Range
      Commercial: Operating Temperature: 0 to +60°C   |   Storage Temperature:  -20 to +70°C
      Industrial:     Operating Temperature: -40 to 85°C   |   Storage Temperature: -40 to +85°C

      Humidity
      Operating:  10% … 90% r. H. non cond.   |    Storage: 5% … 95% r. H. non cond.

      Size
      244 x 244 mm²

      Documents

      Ecosystem Details