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conga-HPC/uATX-Client

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Application Carrier Board for COM-HPC Client Type Modules (Sizes A, B, C)

Formfactor	Standard Micro-ATX
Board Type	Application Carrier Board for COM-HPC Client Type Modules (Sizes A, B, C)
Internal IO	2x PCIe Gen4 x16 \| 2x PCIe Gen4 x4 \| 2x SATA III \| 1x 2.5” Disk Drive Power connector 1x M.2 Key B 2242/3042/2260/2280 (USB2, PCIe x2, SIM) \| 1x M.2 Key E 2230/3030 (USB2, PCIe x2) 1x M.2 Key M 2242/2260/2280/22110 (PCIe x4, bottom side) 1x eDP (optional for LVDS) 1x DMIC header \| 1x I2S/SoundWire header 2x MIPI CSI2/3 4-lane camera FFC \| 2x UART native by module \| 2x UART by Super IO 1x General Purpose SPI \| 2x I2C header \| 1x SMB header \| 12x GPIO by header 1x Feature header with system control signals \| 1x System Fan \| 1x CPU Fan \| 1x RTC CMOS battery holder 1x Power button \| 1x Reset button \| 1x LID button \| 1x Sleep button 1x SPI boot flash socket \| 1x Intel ISP header \| 1x ATX power connector 24-pin \| 1x AT banana power jacks 8-20V
External IO	1x Dual USB 2 \| 2x Dual USB 3.2 up to 10Gbps \| 2x USB4 with Thunderbolt Retimer (1x with Power Delivery) \| 3x DP++ with 8.1 Gbps Re-driver \| 2x 10GbE RJ45 with IEEE1588 support 1x Audio Jack 4-pin \| on-carrier HDA codec
Power Management	ACPI 6.0
Operating Systems	Microsoft^® Windows 11 \| Microsoft^® Windows 10 \| Microsoft^® Windows 10 IoT Enterprise \| Linux \| Yocto
Temperature Range	Commercial: Operating Temperature: 0 to +60°C \| Storage Temperature: -20 to +80°C
Humidity	Operating: 10 to 85% r. H. non cond. / Storage: 5 to 85% r. H. non cond.
Size	244 x 244 mm²
Order Information	PN 065620 conga-HPC/uATX-Client

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Data Sheet

10.12.2024

Other

03.02.2025

conga-HPC/uATX-Client (P/N 065620)

COM-HPC Client µATX Application Carrier Board suitable for congatec COM-HPC modules with Size A,B and C.