Embedded World, 25 February 2014 * * * congatec AG, a leading manufacturer of embedded computer modules, is using the new Yocto project BSP (Board Support Package) for more stability for a large variety of customer requirements.
The Yocto project was launched at the end of 2010 by merging the CE Linux Forum with the Linux Foundation. Yocto project supports ARM, Intel, MIPS and power architecture platforms on the hardware side. Many drafts, templates, tools and methods that may be used with the Linux based system are available for the developer, regardless of the hardware architecture. congatec provides its BSP based on version 1.5.1 (Dora), so users may create their own Yocto project according to the specific application involved.
From now on, the Yocto project BSP is available for the conga-QMX6 module. The Computer-On-Module (COM) is equipped with the Freescale i.MX6 ARM Cortex A9 processor family, scalable from 1 to 4 ARM cores. With its modern 3D-compatible High End HD graphic interface, it is particularly suitable for demanding multimedia applications. Primary target markets are manufacturers of mobile and ultra mobile industrial devices as well as users in the fields of medical, automotive and industrial automation technologies.
