Archived Press Releases

Next-generation AI computing for the edge

More solutions offerings to maximize OEM value

Shock and vibration resistant for harsh environments

Digitizing the edge

The target: holistic consolidation and digitization offerings

Maximum performance for mini footprints

High-end edge AI and vision processing in ultra-low power envelop

Proven shock and vibration resistant for harsh environments

Small form factor to complete high-performance ecosystem

Building a high-performance ecosystem for Arm based SMARC modules

The goals: Reduce NRE costs, accelerate time-to-market, and improve product & supply security

Seoul, Korea / Taipei City, Taiwan, March 2, 2023 * * * congatec – a leading vendor of embedded and edge computing technology – will be presenting its enhanced high-performance landscape for edge…

Accelerating knowledge transfer

Small form factor to complete high-performance ecosystem

Deggendorf, Germany, 3 February, 2023 * * * We would like to inform you that Mr. Gerhard Edi, Managing Director and Chief Strategy Officer, is leaving the Management Board of the congatec group with…

The ultimate performance boost consolidated edge applications have been waiting for

Happy new year for high-end embedded computers: The world’s fastest Client Computer-on-Modules generation is here

Mini form factor for maximum performance

Performance boost now standard-compliant

Accelerating the real-time digitization

Healthcare and the cloud: secunet medical connect securely links medical devices and networks

Modular high-end Micro-ATX carrier for more sustainable and ultra-scalable COM-HPC based system designs

Award-winning: congatec’s support of customers through dramatic business challenges and technological change

Making the robotic edge modular

congatec launches five new COM-HPC Server Size D modules with Intel Xeon D-2700 processors following the “less is more” approach

Value partnership for creating medical edge computing systems that meet patient, data, and cybersecurity requirements

congatec extends its 12th Gen Intel Core processor based COM-HPC and COM Express Computer-on-Module portfolio with seven more power-efficient new processor variants

Arm Project Cassini completed: congatec modules with NXP i.MX 8M Plus processor now Arm SystemReady IR certified

congatec introduces Computer-on-Modules for collaborative 5G robots and material handling systems at Smart Factory & Automation World

Embedded computing engines that put smart vehicle developers into the fast lane

First joint project: Edge computer for mobile intralogistics

Focus on OEM platforms for regulated industries

congatec introduces three new Server-on-Module families with Intel Xeon D processors

congatec simplifies COM-HPC designs

A quantum leap in core count

Dr. Dirk Haft is new CEO, Daniel Jürgens new CFO

Round-the-clock accessibility

Computer-on-Modules meet functional safety and security

congatec introduces new platforms and design strategies for 5G connected mobile and stationary devices

Virtually latency free vision with up to 226.5 FPS

New congatec module with i.MX 8M Plus gives Qseven designs a massive performance boost for the future

Real-time Ethernet with open standards

congatec sets a new benchmark with the launch of 20 new Computer-on-Modules with 11th Gen Intel Core processors (formerly codenamed: Tiger Lake-H)

Shock and vibration resistant

Fast track to NPU accelerated smart vision

congatec announces the foundation of congatec Korea Ltd.

congatec technology makes healthcare smarter

Getting in the fast lane to Gen4

Low power flagship for embedded vision and AI

More power for low power 24/7 systems

Extended temperature range platforms for edge computing – from high-end COM-HPC to low power SMARC

congatec premiers AMD Ryzen™ Embedded V2000 processor on COM Express Compact

congatec extends its solution platform offering to rugged fog computing market

congatec introduces new ecosystem for COM-HPC

congatec introduces new platforms for tactile internet applications

New congatec modules with 11th Gen Intel Core processors for outdoor and in-vehicle applications

SCHURTER adds world-leading computer module vendor to its line card

Continuity in innovation for an ever-changing world

New state-of-the-art Computer-on-Modules

congatec welcomes Intel Atom® x6000E Series processor launch on five form factors

congatec fuels launch of 11th Gen Intel® Core™ processors with two great new design options

Leveraging synergies to increase customer benefits

Accelerating the future of edge computing

More performance and less dollars per watt

See and understand

Size-optimized congatec SMARC 2.1 carrier board makes Intel Atom® processor based 3.5-inch SBCs modular

West Pond is helping isolated seniors

Ultra-rugged quad core module

Dear Valued Customer,

As an immediate reaction to the current situation related to the spread of Covid-19 ("Corona Virus"), we decided to take the responsibility for our employees and…

Advanced connectivity for embedded vision and the edge

The mass makes the difference

congatec expands embedded vision portfolio for NXP i.MX 8 processor series

Keeping it cool

congatec expands 3.5-inch offering to NXP i.MX8 processors

Independent tests confirm the excellent performance of congatec’s 3.5-inch SBC

congatec to focus on embedded edge computing at Embedded World

A brand new low-end performance class for SMARC

Less is more

COM-HPC pinout approved

Think globally, act locally

Deggendorf, Germany, 24 September, 2019 * * *  congatec – a leading supplier of standardized and customized embedded computer boards and modules – has appointed Thomas Schultze as new member of the…

Maximum Performance for COM Express Type 7 Servers

Stunning performance – amazingly affordable

A new rugged class of data processing engines for the digitization of the oil and gas industry

The latest and greatest from Intel®

Up to 58% performance boost with extended availability

Next generation embedded vision computing in three different flavors at Japan IoT/M2M Expo

Everything you need to evaluate the new best in class NXP i.MX 8 QuadMax processors

Performance boost for rugged edge computing markets

congatec premieres with 40% performance boost

Consumer BGA processors on high-quality embedded boards - Opens new application areas - Supports first-to-market strategies

Jack-of-all trades server ready to take over industrial controls

congatec growth faster than the market

The goal: Fully automated checkout

congatec drives sales by broadening its market reach

New memory milestone for modules

More processing power for connected aircrafts, in-flight infotainment and augmented reality in aviation

Real-time networking of Industry 4.0 factories

Embedded vision made easy

The new benchmark for 2 - 4 watt applications

Fusion of embedded computing and vision technologies

New cost efficient entry-level platform for high-end embedded computing

Record revenue and increasing investments in sales and technical services further propel growth

Focus on modular IoT standards

Best-in-class ARM processor in application friendly shape

Smooth implementation of hard real-time

congatec and Real-Time Systems make a robot play piano

Powerful congatec six-pack for Type 6

congatec simplifies integration of smart vision at transportation checkpoints

SMARC makes digital cockpit designs smarter

Application-ready bundle for video analytics at the IIoT edge

congatec enables cost-efficient 10GbE edge server designs

congatec accelerates real-time hypervisor adoption for the embedded market

New AMD Ryzen Embedded Processors deliver up to 3X more GPU performance than competitive solutions

One for all: the embedded motherboard that suits all high-end applications

A trustful team: congatec ETX/XTX modules and AMD Geode

congatec expands French sales partner network

congatec modules accelerate first-to-market strategies

congatec brings German Industry 4.0 expertise to China

congatec presents virtualized fog server installation

New congatec modules with 10 GbE bandwidth raise the bar for embedded edge computing

congatec begins the industrial market transition to 10 GbE bandwidth

congatec lays foundation for modular micro server designs

Premium service for high-quality products are the key

Hannover Declaration of close cooperation shows first results

congatec again pushes standardization to boost design efficiency

congatec’s Type 7 Server-on-Modules are now PICMG standard

congatec further standardizes interface setup for SMARC 2.0

congatec simplifies orchestration of wireless sensor networks

Low profile motherboard solution with high value!

congatec’s latest OS implementation further simplifies development of IoT-connected devices

congatec's new modules are simply better

congatec boosts module-based high-end embedded computing

Offers more than any credit card sized COM Express module before

congatec strives to become embedded go-to provider in France

Martin C. Frederiksen joins congatec as Sales Director for Northern Europe

30% more processing power and 45% more graphics performance in 100% industrial-grade congatec quality

Everything you need for the evaluation of SMARC 2.0 and the new Intel® Atom™ low power processors (Apollo Lake)

One a great fit for the entry level, the other a perfect choice for the high end

Brand new form factor with brand new low-power processors

congatec's new Server-on-Modules première 10 Gigabit Ethernet performance

Easily customizable for rapid field deployments

Yasuyuki Tanaka joins congatec as Country Manager Japan

SMARC 2.0: A complementary solution well positioned between Qseven and COM Express

congatec introduces new Server-on-Modules with high transcoding performance based on the latest Intel® Xeon® processors

congatec integrates today’s most cost efficient Intel® Celeron® processor with fast DDR4 SO-DIMM memory support

High scalability for a wide variety of industrial applications

New congatec COM Express module with Intel® Xeon® processor and Intel® Iris™ Pro graphics

New conga-TR3 module based on AMD G-Series SOC offers up to 30% more graphics performance and fast DDR4 RAM

congatec appoints Technagon as sales technology partner

congatec fully supports the upcoming new SGET and PICMG Computer-on-Module specifications

congatec launches price-breaking boards and modules with the Intel® Atom™ x5-E8000 processor

congatec modules based on AMD Geode LX 800 processors now available at least until 2019

congatec appoints Fred Barden as Vice President, Worldwide Sales

congatec’s new COM Express modules deliver server-class embedded performance

Rich and vibrant SOC graphics, full HSA 2.0 support,

and even more performance starting at 12 watts

Flat, industrial-grade and powerful graphics at just 3 watts

Enhanced computing and graphics performance for credit card sized computer modules

congatec accelerates ongoing miniaturization trend by offering µQseven modules with Freescale i.MX 6 processors

New performance levels for 15 watt class of fanless embedded systems achieved

The new premium class of low-power modules supports up to three displays and 4k

Graphics-rich low-power Mini-ITX boards with SoC integrated AMD Radeon graphics and configurable TDP for industrial-grade system designs

First congatec COM Express module to deliver server-grade performance for demanding graphics applications

Jason Carlson appointed CEO, with the support of Gerhard Edi as CTO, Josef Wenzl as CFO and Matthias Klein as COO

The conga-QA4 module offers lower power dissipation, provides more processing power and comes with the new integrated Intel® Gen 8 graphics

Investment in new research & development facility and talent to help drive growth in Asia

Deggendorf, Germany, April 28th, 2015 * * * congatec AG, a leading technology company for embedded computer modules, single board computers and EDM services is pleased to announce that the conga-MA3…

congatec maintains its position as the number one vendor

for Computer-on-Modules in EMEA

Industrial single board computer based on Intel® Atom™ E3800 processor series (code named Bay Trail)

Qseven, COM Express, XTX and ETX Computer-on-Modules with AMD Embedded G Series SoC now with 10 years long-term availability instead of 7 years

At this year's Embedded World, congatec will present a wide range of innovations in Hall 1, Stand 358. Next to the conga-TC97 COM Express board, the company will also show the new Mini-ITX board conga-IC97

congatec evolves from start-up to EMEA market leader for Computer-on-Modules in just a decade

congatec to support customer development throughout the entire product life cycle with new EDM (Embedded Design & Manufacturing) services

New conga-MA3E, based on Intel® Atom™ E3800 series, provides memory error correction feature ensuring maximum reliability

Deggendorf, Germany, 1 September 2014 * * * congatec AG, a leading technology company for embedded computer modules, single board computers and ODM designs, announces the appointment of Neil Wood as…

Deggendorf, Germany, 25 August 2014 * * * congatec AG announces the appointment of Matthias Klein as Chief Operating Officer (COO) and member of the Executive Board.

Matthias Klein, who has worked as…

Deggendorf, Germany, 13 August 2014 * * * congatec AG, a leading technology and ODM company for embedded computer modules and single board computers, has entered into partnership with Eltech Ltd, a…

conga-TS87 COM Express Type 6 basic module: Unprecedented vector processing, floating point and graphics performance with no increase in power draw

Based on 2nd generation AMD Embedded G Series SOC "Steppe Eagle" processors, congatec's latest Qseven and COM Express Computer-on-Modules boost performance per watt and lower power consumption

The new congatec office is located in the world’s business centre Shanghai

congatec enters industrial Mini-ITX market with motherboard based on AMD Embedded G-Series SOC platform

The no. 2 computer-on-module supplier worldwide now ranks no. 1 in EMEA according to IHS

The new Yocto project is establishing itself as the Embedded Linux Operating System and is now available on Qseven conga-QMX6

The conga-QG requires 33% less power than previous module with AMD G-Series and offers optimized graphics performance

New Regional Sales Manager to drive growth in Russia and CIS

The conga-QA3 provides twice the performance over its predecessor plus an optimized product lifespan thanks to development with ceramic condensators

The low-cost COM Express Type 6 module conga-TS87/i3-4102E is scalable up to the quad-core Intel® Core™ i7

The congatec conga-TC87 COM Express compact module is equipped with the new embedded processors of the Intel® Core™ U-Series. Despite offering greater performance, the maximum thermal design power is only 15 watts.

congatec donates 52,000 Euro to the victims of the devastating floods to hit company HQ town

With sales of 60.6 million euros and 2.5 million euros in EBIT, congatec strengthens its position as the world’s number two player in Computer-on-Modules

conga-TS87 COM Express Type 6 basic module: Unprecedented vector processing, floating point and graphics performance with no increase in power draw

Full design-in includes Qseven Starter Kit, WEC7 software support, Linux BSP and tablet PC demonstrator

Based on the AMD Embedded G-Series SOC, the new conga-TCG combines compact design with improved graphics performance and power efficiency

embedded world, Nuremberg, 26 February 2013  * * *  congatec AG, a leading manufacturer of embedded computer modules, presents the Qseven Mobility Kit, a complete starter package for the rapid…

The Latest High-Performance, Low-Power Computer-On-Modules Enable Simpler, Faster and More Flexible Designs

Deggendorf, Germany, 20 February 2013 *** congatec AG, a leading manufacturer of embedded computer modules, introduces Intel® Celeron ® Dual-Core processors  with 3rd Generation Intel® Core™…

With 293 percent growth, congatec takes 22nd place in Deloitte Technology Fast 50 rankings for 2012

Turnover reaches € 16.7 million

The COM Express reference board offers a quick route to customized video wall system development and speeds time-to-market

Type 2 or Type 6 Pin-out – congatec has the appropriate graphics options for either

Deggendorf, Germany, 6 November 2012  * * *  congatec AG, a leading manufacturer of embedded computer modules, has announced its cooperation with Ineltro Halmer Electronics GmbH, headquartered in…

Increased computing performance with concurrent improvement in energy efficiency on pin-out Type 2 with PCI Express graphics (PEG) support

Statutes, objectives and regulations now available for download from SGET website

conga-TFS offers superb integrated graphics performance along with an excellent performance-per-watt ratio for demanding applications

conga-TM77: increased computing performance with improved energy efficiency

The conga-QMX6 runs on Freescale’s new i.MX6 ARM Cortex A9 processors; it’s trump cards include broad scalability, long-term availability, an extended temperature range and, above all, low power dissipation of less than 5W

Nuremberg, Embedded World, 28 February 2012  * * *  congatec AG, a leading manufacturer of embedded computer modules, announces a new cooling system based on cooling pipes which are integrated in…

The conga-TCA offers lower power consumption and significantly improved graphics performance

The new Standardization Group for Embedded Technologies (SGET) is on its way

Computer modules from congatec with AMD Fusion technology provide OpenCL support for ETX, XTX, COM Express and Qseven standards

conga-TS67 supports low-power Intel® processors including the Celeron® 807UE (1M Cache, 1.0 GHz) with just 10 Watt TDP

Growth of 1396% puts congatec in leading position in the Deloitte Technology Fast 50 2011

Cooperation with Freescale broadens future selection

of Computer-on- Modules

The new conga TM67 is based on the Type 6 Pin-out and supports the Intel® i7-2710QE Quad-core processor (2.1 GHz, 45W, PGA) and others

Nuremberg, SPS/IPC/Drives, 22 November 2011 * * *   congatec AG, a leading manufacturer of embedded computer modules, presents the conga-QMCB, a new mini carrier baseboard for space-critical…

New conga-QAF Qseven module steps to the top with its extremely high graphics and dual core performance for mobile applications

AMD Fusion architecture guarantees best price/performance ratio

Deggendorf / Germany, April 11, 2011   * * *   congatec AG announces a collaboration with Avnet Embedded to serve the industrial market in UK, Nordic and Baltic with congatec’s Computer-On-Modules.…

Sales increase by 75%

Combines AMD Fusion technology with ETX and XTX for a perfect

form-fit-function setup

conga-CA6 offers low power consumption with impressive graphics performance, even in the extended temperature range

Nuremberg, Embedded World, 02 March 2011   * * *   congatec AG, a leading manufacturer of embedded computer modules, introduces the new conga-MCB, a mini carrier board for COM Express Compact modules…

conga-BAF offers outstanding graphics performance with low power consumption

New conga-BM67 delivers with the Intel® CoreTM i7-2710QE processor (2.1 GHz, 45W, PGA), one of Intel's latest mobile quad-core processors supported for the embedded market

Embedded Building Blocks initiative facilitates embedded solutions for SMEs

Nuremberg, Germany, SPS/IPC/DRIVES, November 23, 2010   * * * congatec AG, a leading manufacturer of embedded computer modules, announces CAN (Controller Area Network) bus support on the conga-QA6…

Nuremberg, Germany, SPS/IPC/DRIVES, November 23, 2010   * * * congatec AG, a leading manufacturer of embedded computer modules, presents the first Qseven Starter Kit for automation. Low power…

New conga-BE57 (95 x 125 mm) provides memory error correction feature, which ensures maximum reliability

Munich, electronica, November 9, 2010   * * *   congatec AG, a leading manufacturer of embedded computer modules, announces support of up to three DisplayPort video interfaces for the current Type 2…

congatec Embedded BIOS features now implemented in UEFI

2010 sales increase by 86% compared to last year

Lars Hallberg has been appointed Territory Manager for the Nordic region

congatec expands its Qseven® portfolio with a new mobile module offering improved graphics performance and extended temperature range capabilities

Dialog IC and Qseven board demonstrated at Intel Developer Forum, booth 290

18.9 Million Euros Revenue in the First Half of 2010

San Diego, California, and Toronto, Ontario August 23, 2010   * * *   Connect Tech and congatec announced today that Connect Tech has based the design of its latest PCI/104-Express Single Board…

Bob Pickles has been appointed Business Development Manager for the new UK office

The new conga-BS57 (95 x 125 mm) provides maximum computing power and graphics performance combined with lower power consumption

conga-CS45, conga-BS45 and conga-BM45 provide interchangeability and great scalability for all applications

Deggendorf, Germany, March 30th, 2010 * * *   congatec AG announces the appointment of Axel Petrak to the Executive Board where he will be representing Sales and Marketing with immediate effect.…

Deggendorf, January 26, 2010  * * *   congatec AG, a leading supplier of embedded computer modules, has announced that Christian Eder will be taking on the position of Sales Manager EMEA with…

New conga-BM57 delivers maximum computing performance paired with highest graphics speed from the integrated graphics controller

German manufacturer of COM Express, XTX, ETX and Qseven Computer-On-Modules was launched on the 1st of January, 2005

Uses the latest generation of Intel® processors

Nuremberg, Germany, SPS/IPC/Drives,  24 November 2009   * * *    congatec AG will be presenting a starter kit for APIX technology at SPS/IPC/Drives. APIX was originally developed for transferring…

Deggendorf, 18 November 2009   * * *   congatec AG, a leading provider of embedded computer modules, announces that the company has qualified itself for Premier Member status in the Intel® Channel…

Orders for current financial year up by 30 % compared to previous year

Deggendorf, Germany, 22 September 2009   * * *   congatec AG, a leading supplier of embedded computer modules, has appointed Axel Petrak as its new International Sales and Business Development…

Deggendorf, Germany, 23 July 2009  * * * congatec AG announces that Technofonds Bayern (The Bavarian Technology Fund) of Bayern Kapital GmbH (Bavaria Capital) intends to increase its holding in the …

Combining the Intel® Atom™ Processor N270 with the mobile Intel® 945GME Express chipset makes for powerful graphics performance

Deggendorf, May 29th, 2009   * * *   congatec AG, a leading provider of embedded computer modules, announced that the company has been elevated from Affiliate to Associate status in the Intel®…

The world’s best end-to-end manufacturing services provider has joined the Qseven standard thereby ensuring the long-term

availability of MXM connectors

Version 1.0 of the design specification has been completed under the auspices of congatec AG

Deggendorf, Germany, March 31, 2009   * * *   congatec AG, a leading supplier of embedded computer modules headquartered in Deggendorf, Germany, announces that the company will be further extending…

The new compact COM Express™ compatible module is specified for the full industrial temperature range.

Nuremberg, Embedded World, March 3rd, 2009   * * *   congatec AG presents the Qseven Mobility Starter Kit. A complete rapid prototyping package for battery-powered, embedded systems.

The compact size…

The starter kit consists of both hardware and software as a design basis for PLC manufacturers

Embedded specialist is confident for the future, despite economic crisis

congatec AG presents its fourth embedded computer module based on the low power consuming Intel® Atom™ processor family.

System solution hardware costs can be reduced by up to 50%

First product based on the new Qseven module standard addresses the portable device market

Munich, electronica, November 11, 2008   * * *  Applications based on the latest Intel® Atom™ processors offer high performance with minimal power consumption and are thus optimal for use on the go. …

Munich, electronica, 11 November 2008   * * *   congatec AG announces a collaboration with leading systems service provider TQ (TQ-Systems / TQ-Components). The new partner will immediately begin…

First product based on the new Qseven module standard addresses the portable device market

Awards for young and successful companies from the three-country region that includes Eastern Bavaria, Upper Austria and Southern Bohemia

Economically-Priced, Low-Power Compact Module Targeted At Full-Featured Mobile Applications

The Qseven™ Consortium reaches a total of 11 participating members

- 2007 sales revenue exceeded in the first half of 2008

- Sales revenue has increased by 162% in comparison to the previous year

conga-BM45: congatec's new COM Express modules utilizes the 45nm Intel® Core™ 2 Duo Processor T9400 with 6 MByte cache and up to 8 Gbyte DDR3 memory

The Qseven™ Consortium publishes the official release of the Qseven embedded computer module specification

The Qseven™ Consortium reaches a total of 10 participating members

Rapid Growth in Europe and Asia Brings the Embedded Computer Board Manufacturer to U.S.

Features the brand new Intel® Atom™ processor Z5xx series and the Intel® System Controller Hub US15W

Nuremberg, Embedded World, February 26, 2008   * * *  congatec AG, a leading innovator in embedded computing, has introduced conga-CMEN, the electronic industry’s first COM Express module based on…

Nuremberg, Embedded World, February 26, 2008 * * * congatec AG and SECO S.r.l., leaders in advanced embedded technologies, have jointly created a new form factor for embedded computing.

This new…

congatec AG has introduced a SMART Battery Manager Module to support its popular range of COM Express™ modules.

congatec cooling solutions simplify cooling for COM Express™, XTX™ and ETX®

Featuring onboard DRAM and PCI-to-ISA bridge: conga-ELXeco is the rugged replacement for ISA based ETX® solutions

conga-B915: Offering the best price/performance ratio for COM Express

An engineering head start is offered by the congatec COM Express™ starterkit

Data Modul has expanded its industrial product range to include Embedded Systems with an international cooperation agreement with congatec AG.

conga-E855 is based on Intel® 855GME chipset featuring low power Intel processors

congatec AG Marketing Manager elected to be Draft Editor; Subcommittee to draft new “COM Express Carrier Design Guide”

The COM Express™ PnP initiative is pleased to welcome AAEON Technology Inc. as its latest member.

conga-X965: High Performance Graphics based on Intel® Core™ 2 Duo Processor and the Intel® Mobile Express Chipset GM965

COMPANIES UNITE AROUND COMMON DOCUMENTATION EASING COM EXPRESS DESIGNS

XTX carrier board with a rich set of features

The XTX Consortium is pleased to welcome AAEON and Fastwel as new participating members.

The new industrial computer for forklift and vehicle applications MPC 6 from DLoG features XTX embedded computer modules from congatec AG

conga-E855 is based on Intel® Pentium® M up to 1.8 GHz and supports the ISA bus

conga-X945/64: High Performance XTX Module based on Intel® Core® 2 Duo

conga-B945/64: High Performance COM Express Board with 64 Bit Dual Core Technology

conga-B945: High Performance COM Express Module with Intel Core Duo Technology and Dual Channel Memory Support

The XTX Consortium has released the XTX Specification Rev. 1.1

PLG AG is a new Solution Partner for congatec AG

conga-ELX is the ideal replacement for existing Geode-GX1 designs.

Advantech, Ampro and congatec, three leading embedded platform providers, announced today a new alliance to help promote the XTX standard for computer on modules.

An engineering head start is offered by the congatec XTX starterkit

As a result of its recent cooperative development agreement with congatec AG, SSV Embedded Systems is now offering custom development of the XTX module-based baseboards.

This year's embedded world exhibition marks the start of the cooperation of two industry specialists: SMA Technologie AG will provide custom baseboard solutions for congatec XTX modules. The advantages for the customer resulting from this close cooperation are obvious:

The customer will benefit from the know-how of two embedded computer technology specialists from one supplier, can always rely on solutions which integrate the latest technology and expect faster product development.

conga-X945: the first XTX module with dual core technology

congatec AG announces the conga-CLX, the first embedded computer module utilizing the miniaturized COM Express Compact standard

The conga-X915 supports all the features defined by the XTX standard

The Embedded Panel Interface EPI, an open standard, allows for easy and direct control of all flatpanel displays with maximum interchangeability.

Bosch Rexroth AG, congatec AG and two additional manufacturers of embedded computer modules have defined a miniaturized computer module based on the COM Express connector definition.

The conga-X845, the very first module based on the new XTX Standard, features the latest I/O interfaces and state of the art computing performance

The first public release of the XTX specification is now available.

Simulation of PCI Express signal path proves industrial usability of XTX

XTX consortium adds more members

Advantech, Evalue and MarekMicro

congatec AG is pleased to have aquired the services of Christian Schubert who is an experienced manager in the embedded computer industry.

American Megatrends will provide congatec AG, an embedded computer manufacturer, with AMIBIOS8 system software that will be integrated into all of its products

congatec's XTX™ extension boosts I/O performance to a factor of more than 10

conga-EVEGA is ETX® compatible and based on the STPC VEGA, with USB 2.0