Atlanta, USA / Deggendorf, Germany, March 11, 2025 * * * AMI®, the global leader in Dynamic Firmware for worldwide computing, and congatec, a leading provider of embedded and edge computing…
COMs just got even cooler
Unrivaled AI performance for COMs with Intel Core Ultra processors
Empowering smart factories: congatec highlights application-ready solution platforms
Application-ready software building blocks for simple and fast IoT connectivity
More AI and graphics performance for low-power SMARC modules
New performance boost for COMs with Intel Core S technology
From start-up to world leader in embedded computing technology
Offering the best Ubuntu Pro experience on congatec aReady.COMs
A new level of application readiness - for increased efficiency and reliability
Compact module delivers 39 TOPS AI performance
congatec modules set new benchmarks for secure edge AI applications
Newly integrated IIoT capabilities create added value
Focus on security (NIS-2) and sustainability with offline AI and modular design
The faster, more sustainable route to dedicated high-end 3.5-inch systems
