Greatness awaits you at embedded world China 2024!
June 12th - 14th 2024, Hall 3, Booth 441
At embedded world China 2024 from June 12-14, you can expect more from us than ever before: more innovations, more application examples to fuel your business ideas, and more convenient next-gen modular solutions to progress your designs.
Sounds a bit exaggerated? Well, visit us and see firsthand that we will keep our promises.
Here is what we can tell you so far…
Great AI performance for the edge
Experience the power of our new COM Express Computer-on-Modules featuring the innovative Intel Core Ultra processor technology with integrated AI accelerator.
High-performance COM HPC Client ecosystem
Let us inspire you with our complete ecosystem of COM‑HPC Client modules, including the new COM‑HPC Mini form factor, cooling solutions, and carrier boards.
Server-on-Module ecosystem
Accelerate your edge servers with our Server -on-Module ecosystems, featuring COM Express Type 7 and COM-HPC Server modules.
