11th Gen Intel Core COMs (codename: Tiger Lake-H)
congatec introduces 20 new Computer-on-Modules following the launch of Intel’s 11th generation Core™ processor for IoT. Featuring 11th Gen Intel® Core™ vPro®, Intel® Xeon® W-11000E, and Intel® Celeron® processors, the new modules target the most demanding IoT gateway and edge computing applications.
The conga-HPC/cTLH COM-HPC Client Size B modules (120mm x 120mm), as well as the conga-TS570 COM Express Basic Type 6 modules (125mm x 95mm) will be available with new scalable 11th Gen Intel Core, Xeon and Celeron processors, with selected variants even for extreme temperatures ranging from -40 to +85°C. Both form factors support up to 128 GB DDR4 SO-DIMM memory with 3200 MT/s and optional ECC. To connect peripherals with massive bandwidth the COM-HPC modules support 20 PCIe Gen 4 lanes (x16 and x4), and the COM Express versions support 16 PCIe lanes. In addition, designers can leverage 20 PCIe Gen 3 lanes with COM-HPC, and 8 PCIe Gen 3 lanes on COM Express.
To support ultra-fast NVMe SSD, the COM-HPC module provides 1x PCIe x4 interface to the carrier board. The COM Express board has NVMe SSD even onboard for optimum utilization of all native Gen 4 lanes supported by the new processor. Further storage media can be connected via 2x SATA Gen 3 on COM-HPC, and 4x SATA on COM Express.
The modules
conga-TS570
- 11th Generation Intel® Core™
- Performance-optimized design
- Up to 8 cores
- Extended temperature range options
- PCIe Gen 4
conga-HPC/cTLH
- 11th Generation Intel® Core™
- Intel® Xe graphics engine
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 4
Product Video
Learn more about our Tiger Lake-H modules
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11th Gen Intel Core Solution Brief
Built on 11th Gen Intel® Core™ processors, congatec’s conga-TS570 COM Express Type 6 and conga-HPC/cTLH COM-HPC Client modules bring near real- time performance, scalability, security, and resilience to a new class of edge computing applications.
COM Express Type 6 and COM-HPC Client
It’s a new era for high-end embedded processors that are now available on two COM form factors: The brand-new COM-HPC® Client and COM Express® Type 6. With the emergence of the 11th Gen Intel® Core® processor generation (codenamed Tiger Lake), developers now have the ability to choose the most appropriate form factor that best suits their project requirements.
COM Express Type 6 vs COM-HPC Client
High-end embedded computing developers have important decisions to make these days. Following the launch of the 11th Intel® Core™ processor generation (codenamed Tiger Lake), they are facing the question whether to develop their next new design based on COM Express Type 6 or COM-HPC Client.
