conga-TEVAL3/COMe3.1 (P/N 065820)
congatec COM Express Type 6 evaluation carrier compliant to COM Express 3.1 specification. Industrial temperature range. From -40°C to 85°C
Zur Anfrage hinzugefügt
conga-TEVAL3/COMe3.1
COM Express Type 6 Rev. 3.1 Evaluation Carrier Board
Ausgewählte Modulvariante
conga-TEVAL3/COMe3.1
COM Express Type 6 Rev. 3.1 Evaluation Carrier Board
- Evaluation Carrier for COMe Type 6 modules
- Supports COMe Compact and Basic modules using connector Pinout Type 6
- Compliant to latest COMe Spec Rev. 3.1
Spezifikation
Board Type
- Evaluation Carrier Board for COM Express® Type 6 Modules Rev. 3.1
Internal IO
- PCIe Gen4 x16 (PEG)
- PCIe Gen4 x4
- 2x PCIe Gen4 x1
- M.2 Key B 2242/3042 (USB2.0 muxed, PCIe x1, SIM)
- M.2 Key E 2230 (USB2.0 muxed, PCIe x1)
- Dual USB2.0 header (muxed)
- USB Typ B (muxed)
- 3x SATA 6Gb/s
- SATA 6Gb/s with SATADOM Pin 7
- LVDS (muxed with eDP)
- eDP (muxed with LVDS)
- VGA Dsub
- HDA/SoundWire header
- GSPI header
- SD Card socket (muxed with GPIOs)
- SPI boot flash socket
- Up to 4x COM headers
- CAN header
- LPC header
- Feature Connector
- ATX-4pin Power connector
- ATX-24pin Power connector
- Banana sockets for single power input
External IO
- RJ45 2.5G Base-T
- 2x Dual USB Type A up to 10Gbps
- 2x USB4 Type C up to 20Gbps
- DP++ HBR3
- 2x Audio Jack 3.5mm
Temperature
Operation -40°C to 85°C | Storage -40°C to 85°C
Humidity
Operation 10% to 90% r. H. non cond. | Storage 5% to 95% r. H. non cond.
Size
294 x 244 mm2
Dokumente
Alle Dokumente auf dieser Seite werden ohne Benachrichtigung aktualisiert. Prüfen Sie diese Seite immer auf die neueste Version.
Data Sheet
30.10.2024
