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conga-QMX8 (discontinued)

Highest performance Qseven module based on NXP i.MX8 processor series

Ausgewählte Modulvariante

Zusätzliche Ecosystem Parts


Cooling Solutions

Carrierboards

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conga-QMX8 (discontinued)

Highest performance Qseven module based on NXP i.MX8 processor series

  • Product status: Discontinued
  • NXP i.MX 8 processor series with ARM Cortex-A72 / A53 / M4F core complex
  • Advanced Performance and Virtualization
  • Graphics up to 4k display resolution
  • Vision extensions and dual MIPI camera support
  • Extended longevity up to 15 years
  • Temperature range up to -40°C …+85°C

Spezifikation

Formfactor
Qseven
CPU
NXP i.MX8 Quad Max (4, ARM Cortex-A53, 2x ARM Cortex-A72, 2x ARM Cortex-M4F, 15W)
NXP i.MX8 QuadPlus (4, ARM Cortex-A53, 1x ARM Cortex-A72, 2x ARM Cortex-M4F)
DRAM
Up to 8 GByte onboard LPDDR4 memory | 3200 MT/s
Ethernet
Gigabit Ethernet
I/O Interfaces
4 x USB 2.0 (shared with 1x USB OTG client)
1 x USB 3.0
1 x SATA III (6Gb/s)
1 x SDIO
2 x PCI Express™ 3.0 lanes
I²C bus
CAN Bus
SPI
2 x UART
Graphics
Integrated in NXP i.MX8 Series dual GT7000 multimedia GPU
VPU (4K h.265 dec / HD h.264 enc) | 2D Graphics (GPU2D) and 3D Graphics (GPU3D) | 3D graphics with 4 shaders up to 200MT/s 2 independent displays | dual stream 1080p/720p decoder/encoder | OpenGL 3.1 | Vulcan | VX extensions | OpenCL 2.0
Operating Systems
Android
Linux
Yocto
Temperature
Extended
Commercial : Operating: 0 to +60°C Storage: -20 to +70°C Industrial: Operating: -40 to +85°C Storage: -40 to +85°C
Humidity
Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.
Size
70 x 70 mm (2,75" x 2,75")

Dokumente

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Data Sheet

conga-QMX8
29.05.2020

Manual

conga-QMX8 Sample Distribution Set Quick Start Guide
08.03.2019
conga-QMX8 Software Documentation

Software

[ Android ]      [ yocto ]     

Android

Link
In order to fetch and build the Yocto-/Android-BSP for conga-QMX8, please follow:
https://wiki.congatec.com/display/IMX8DOC/BSPs+conga-QMX8

yocto

Link
In order to fetch and build the Yocto-/Android-BSP for conga-QMX8, please follow:
https://wiki.congatec.com/display/IMX8DOC/BSPs+conga-QMX8

Produktvarianten

conga-QMX8/QCM-4GB eMMC16 (P/N 016400)

Qseven module with high-performance NXP i.MX8 Quad Max processor with 2x ARM® Cortex®-A72, 4x ARM® Cortex®-A53 and 2x ARM® Cortex®-M4F, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Lidded package. Commercial temperature range.

conga-QMX8/QCP-4GB eMMC16 (P/N 016401)

Qseven module with high-performance NXP i.MX8 Quad Plus processor with 1x ARM® Cortex®-A72, 4x ARM® Cortex®-A53 and 2x ARM® Cortex®-M4F, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Lidded package. Commercial temperature range.

conga-QMX8/QCP-2GB eMMC16 (P/N 016403)

Qseven module with high performance NXP i.MX 8QuadPlus processor with 1x ARM Cortex-A72, 4x ARM Cortex-A53 and 2x ARM Cortex-M4F, 2GB onboard LPDDR4 memory and 16GB onboard eMMC. Commercial temperature range.

conga-QMX8/i-QCM-4GB eMMC16 (P/N 016421)

Qseven module with high-performance NXP i.MX8 Quad Max processor with 2x ARM® Cortex®-A72, 4x ARM® Cortex®-A53 and 2x ARM® Cortex®-M4F, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Lidded package. Industrial temperature range.

conga-QMX8/i-QCP-4GB eMMC16 (P/N 016422)

Qseven module with high-performance NXP i.MX8 Quad Plus processor with 1x ARM® Cortex®-A72, 4x ARM® Cortex®-A53 and 2x ARM® Cortex®-M4F, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Lidded package. Industrial temperature range.

conga-QMX8/i-QCP-2GB eMMC16 (P/N 016424)

Qseven module with high performance NXP i.MX 8QuadPlus processor with 1x ARM Cortex-A72, 4x ARM Cortex-A53 and 2x ARM Cortex-M4F, 2GB onboard LPDDR4 memory and 16GB onboard eMMC. Industrial temperature range.

Ecosystem Details

Cooling Solutions

conga-QMX8/CSP-B (P/N 016450)

Passive cooling solution for Qseven module conga-QMX8 with lidded NXP i.MX8 ARM Cortex® A72 processor. All standoffs are M2.5mm thread.

conga-QMX8/CSP-T (P/N 016451)

Passive cooling solution for Qseven module conga-QMX8 with lidded NXP i.MX8 ARM processor. All standoffs are M2.5mm thread.

conga-QMX8/HSP-B (P/N 016452)

Standard heatspreader for Qseven module conga-QMX8 with lidded NXP i.MX8 ARM Cortex® A72 processor. All standoffs are M2.5mm thread.

conga-QMX8/HSP-T (P/N 016453)

Standard heatspreader for Qseven module conga-QMX8 with lidded NXP i.MX8 ARM Cortex® A72 processor. All standoffs are with 2.7mm bore hole.

Carrierboards

conga-QEVAL/Qseven 2.0 ARM (P/N 007005)

Evaluation carrier board for Qseven 2.0 modules based on ARM architecture.

Zubehör

Mehr über conga-MCB/Qseven-ARM (EOL)

conga-MCB/Qseven-ARM (EOL)

The conga-MCB/ARM is a full featured carrier board for Qseven ARM modules.

Mehr über conga-QEVAL/Qseven 2.0

conga-QEVAL/Qseven 2.0

To achieve a quick start with Qseven congatec offers an evaluation carrier board, which routes all the Qseven® signals to standard interface connectors.