COM-HPC Product Overview
High performance Computer on Module formfactor
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Es gibt eine Vielzahl an möglichen Produktkonfigurationen und Optionen.
Sollte Ihre gewünschte Konfiguration in unserem Filter nicht erscheinen, kontaktieren Sie bitte unseren Vertrieb für weiterführende Hilfe.
Sollte Ihre gewünschte Konfiguration in unserem Filter nicht erscheinen, kontaktieren Sie bitte unseren Vertrieb für weiterführende Hilfe.
conga-HPC/mRLP
- 13th Generation Intel® Core™
- Intel® Xe graphics engine
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 4
conga-HPC/cRLS
- 13th Generation Intel® Core™
- Intel® performance hybrid architecture
- Performance-optimized design
- Up to 24 cores
- PCIe Gen 5
conga-HPC/cRLP
- 13th Generation Intel® Core™
- Intel® performance hybrid architecture
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 5
conga-HPC/sILH
- Intel® Xeon® D2700 processors
- Up to 20 cores
- Up to 1 TB RAM
- Ext. temp. options
- 100 Gb max. Ethernet bandwidth
conga-HPC/sILL
- Intel® Xeon® D1700 processors
- Up to 10 cores
- Up to 256 GB RAM
- Ext. temp. options
- 100 Gb max. Ethernet bandwidth
conga-HPC/cTLH
- 11th Generation Intel® Core™
- Intel® Xe graphics engine
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 4
conga-HPC/cTLU
- 11th Generation Intel® Core™
- Power- and size-optimized design
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 4
conga-HPC/EVAL-Server
- Evaluation carrier board for Size D & E
- 7x PCIe connectors for 52 lanes
- 10 GbE RJ45 through module
- GbE RJ45 through ASPEED AST2600
conga-HPC/EVAL-Client
- Evaluation carrier board for sizes A, B, C
- 5x PCIe connectors for 48 lanes
- 2x MIPI Camera Serial Interface
- KR connector to connect LAN mezzanine cards
