COM-HPC Ecosystems
The game-changers for high-performance digitization projects
Our COM-HPC ecosystems are specifically engineered to provide everything developers need to be first to market with industry-leading solutions that deliver highest performance and bandwidth for all the new and emerging AI-powered edge computing and embedded server applications.
Learn more about the COM-HPC standard
COM-HPC Server Ecosystem
For high-performance, sustainable, and upgradeable edge server designs in harsh environmental conditions
- Data center level performance
- Extended temperature support
- Real-time capable
COM-HPC Client Ecosystem
For next-generation edge computing, revolutionizing embedded edge client performance
- Multi-display support
- High-performance CPU+GPU
- Extensive connectivity with PCIe Gen 5, USB4, MIPI CSI, etc.
COM-HPC Mini Ecosystem
Delivering unmatched performance and I/O density to space- and power-restricted rugged applications
- Credit-card size form factor
- High-performance CPU+GPU
- Extensive connectivity with PCIe Gen 5, USB4, MIPI CSI, etc.
Experience our COM-HPC ecosystem offerings
Carrier boards
Our evaluation and application-ready carrier boards provide the perfect entry to high-end edge computing and server markets. Our carrier boards act not only as a cost-efficient off-the-shelf platform for system designs but can also be used as a fully compliant development platform and blueprint for custom designs. For a detailed list of carrier boards, please refer to the individual product pages.
Powerful cooling solutions
No embedded system is complete without a powerful cooling solution to always draw the best performance and reliability. Our offering ranges from active cooling to passive heatpipe solutions for fanless cooling of rugged designs operating in the harshest environments. For a detailed list of cooling solutions, please refer to the individual product pages.
Services
On demand, we support our customers from project definition to series production of their solutions. OEMs benefit from our broad project and technology experiences, with synergistic effects leading to further development time and cost reductions. Module-related services include, for example, the application of conformal coating to harden designs against aggressive environments, BIOS customization, and design-in services. For a detailed list of services, please refer to the individual product pages.
