It’s all about edge computing
Let’s meet at EdgeTech+ 2023, Booth B-L10, Yokohama Exhibition Hall!
At our booth, you’ll experience our exciting range of high-performance Computer-on-Module ecosystem offerings that are driving innovation at the edge. You’ll also see inspiring demos of how our modules empower the latest edge technologies.
Here’s what you can be looking forward to:
COM-HPC – the paradigm shift for modular designs
Experience unmatched scalability and performance with the COM-HPC and new COM-HPC Mini standards. We offer a comprehensive ecosystem of COM-HPC modules based on 13th Gen Intel® Core™ processor technology.
More performance for rugged edge servers
Check out our rugged edge server reference system designs powered by high-performance COM-HPC modules with heat pipe cooling. Ideal for harsh industrial environments, they enable workload consolidation and orchestrating communications in IoT networks.
The multitool for edge connectivity
Be one of the first to see our versatile and secure edge connector platform. Learn why this multitool is ideal if you are looking for a flexible digitization solution, whether you’re a machine builder, system integrator or manufacturer.
These are just a few select booth highlights. But we have a lot more for you to explore.
Arrange a meeting with us today to discuss all the ways we can accelerate your edge applications,
or visit us at our Booth B-L10 during EdgeTech+ 2023.
Your congatec team.
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