COM Express Type 6 Basic module based on 6th Generation Intel® Core™ processor family
Data Sheet
Manual
COM Express Type 6 Basic module with Skylake-H Intel® Xeon® E3-1578L V5 quad core processor with 2.0GHz up to 3.4GHz, 8MB L2 cache, GT4 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support
COM Express Type 6 Basic module with Skylake-H Intel Xeon® E3-1558L V5 quad core processor with 1.9GHz up to 3.3GHz, 8MB L2 cache, GT3e graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support
COM Express Type 6 Basic module with Skylake-H Intel® Xeon® E3-1515M V5 quad core processor with 2.8GHz up to 3.7GHz, 8MB L2 cache, GT4 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support
COM Express Type 6 Basic module with Intel® Xeon® E3-1505M V5 quad core processor with 2.8GHz up to 3.7GHz, 8MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support
COM Express Type 6 Basic module with Intel® Xeon® E3-1505L V5 quad core processor with 2.0GHz up to 2.8GHz, 8MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support
COM Express Type 6 Basic module with Intel® Core™ i7-6820EQ quad core processor with 2.8GHz up to 3.5GHz, 8MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset QM170
COM Express Type 6 Basic module with Intel® Core™ i7-6822EQ quad core processor with 2.0GHz up to 2.8GHz, 8MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset QM170
COM Express Type 6 Basic module with Intel® Core™ i5-6440EQ quad core processor with 2.7GHz up to 3.4GHz, 6MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset QM170
COM Express Type 6 Basic module with Intel® Core™ i5-6442EQ quad core processor with 1.9GHz up to 2.7GHz, 6MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset QM170
COM Express Type 6 Basic module with Intel® Core™ i3-6100E dual core processor with 2.7GHz, 3MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support
COM Express Type 6 Basic module with Intel® Core™ i3-6102EQ dual core processor with 1.9GHz, 3MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support
COM Express Type 6 Basic module with Intel® Core™ i3-6100E dual core processor with 2.7GHz, 3MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset HM170
COM Express Type 6 Basic module with Intel® Core™ i3-6102EQ dual core processor with 1.9GHz, 3MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset HM170
COM Express Type 6 Basic module with Skylake-H Intel® Celeron® G3900E dual core processor with 2.4GHz, 2MB L2 cache, GT1 graphics and 2133MT/s dual channel DDR4 memory interface. Chipset HM170.
COM Express Type 6 Basic module with Skylake-H Intel® Celeron® G3902E dual core processor with 1.6GHz, 2MB L2 cache, GT1 graphics and 2133MT/s dual channel DDR4 memory interface. Chipset HM170.
Standard heatspreader for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes. All standoffs are with 2.7mm bore hole.
Standard heatspreader for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes. All standoffs are M2.5mm thread.
Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All standoffs are with 2.7mm bore hole.
Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All standoffs are M2.5mm thread.
Standard active cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
Standard active cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.
DDR4 SODIMM memory module with 2400 MT/s and 4GB RAM
DDR4 SODIMM memory module with 2400 MT/s and 8GB RAM
DDR4 SODIMM memory module with 2400 MT/s and 16GB RAM
4 GByte ECC DDR4 SODIMM memory module | 2400 MT/s (PC4-2400) | 260 pin | supply voltage 1,2V
8 GByte ECC DDR4 SODIMM memory module | 2400 MT/s (PC4-2400) | 260 pin | supply voltage 1,2V
16 GByte ECC DDR4 SODIMM memory module | 2400 MT/s (PC4-2400) | 260 pin | supply voltage 1,2V
Evaluation Carrier Board for COM Express Type 6 Modules.
Design-Training to develop carrier boards for Computer on Modules
HumiSeal® 1A33 coating for COM Express Basic and Compact modules; MIL-I-46058C qualified, IPC-CC-830 and
RoHS Directive 2002/95/EC compliant and recognized under UL File Number E105698.
congatec Wide Temperature Range Screening
Standard screening profile with 12h temperature screening and cold soak test
Including functional test and several boot-ups (before & after screening)
congatec Wide Temperature Range Screening
Standard screening profile with 12h temperature screening and cold soak test
Including functional test and several boot-ups (before & after screening)
DVI Converter Module for LVDS
Evaluation Carrier Board for COM Express® Type 6 Modules Rev. 2.1
COM Express Type 6模块评估载板
适用于LVDS的DVI转换模块
